• Rich Templeton of Texas Instruments Elected Chair of Semiconductor Industry Association

    Rich Templeton of Texas Instruments Elected Chair of Semiconductor Industry Association

    2 Min Read

    The Semiconductor Industry Association (SIA) announced Texas Instruments Chairman of the Board Rich Templeton has been elected Chair of the SIA Board of Directors and Western Digital CEO David Goeckeler has been elected SIA Vice Chair. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

    “It is a great pleasure to welcome our new leadership team for the year ahead, Rich Templeton of Texas Instruments and David Goeckeler of Western Digital,” said John Neuffer, SIA President and CEO. “Rich is extremely knowledgeable about the challenges we face as an industry and how we can overcome them, and David is a seasoned industry veteran and a highly effective champion for SIA’s priorities. Together, they will make an outstanding team as leaders of the SIA Board of Directors in 2024.

    Templeton became Chairman of Texas Instruments in April 2008 and was President and CEO from May 2004 through March 2023. From April 2000 through April 2004, Templeton was Chief Operating Officer of TI. He was Executive Vice President of the company and President of TI’s semiconductor business from June 1996 through April 2004.

    As CEO, Templeton maintained the company’s strategic investments in R&D and manufacturing, while expanding the size of the sales and applications engineering team to better serve TI customers. Under his leadership, TI emerged stronger, with better technological and product positions in both its core businesses. Templeton joined the company in 1980 after earning a B.S. in electrical engineering from Union College in New York.

    “Semiconductor technology is making the world smarter, greener, more efficient, and better connected, and effective government policies are needed to help the industry continue to grow and innovate,” said Templeton. “I look forward to working alongside my colleagues on the SIA Board to advocate for industry priorities in Washington and capitals around the world.”

    Since joining Western Digital in March 2020, Goeckeler has focused on the company’s transformation as the leading data storage producer in the industry. Before becoming CEO, he was Executive Vice President and General Manager of Cisco’s Networking and Security Business, with responsibility for more than $34 billion of the company’s global technology franchise.

    He led a worldwide team of more than 25,000 engineers and oversaw Cisco’s networking and security strategy and market acceleration, including development operations for the company’s expansive technology portfolio and strategic acquisitions.

    Original – Semiconductor Industry Association

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  • Navitas will Present Its Solutions during Power Semiconductor User Forum in Munich

    Navitas will Present Its Solutions during Power Semiconductor User Forum in Munich

    2 Min Read

    Navitas Semiconductor announced its participation in the Power Semiconductor User Forum, organized by WEKA Fachmedien on November 22nd -23rd, 2023. The event offers valuable insights into power electronics for developers and technical buyers.

    Alfred Hesener, Senior Director of Industrial and Consumer Applications will explore “Reliability and Cost-of-Ownership Optimization in Industrial Power Supplies,” on November 23rd at 1:45 p.m. CET. Mr. Hesener will highlight next-generation solutions that achieve high power densities, cool operation, robust performance using Navitas’ GaNSense single and Half-Bridge power ICs.

    Navitas’ GaNFast power ICs integrate GaN power and drive with control, sensing, and protection to enable faster charging, higher power density, greater energy savings and system cost reduction. In addition, each GaN power IC saves over 4 kg CO2 due to higher efficiency and dematerialization. New ‘Gen-3 Fast’ GeneSiC MOSFETs have up to 50% improved performance vs. other SiC devices, and save over 40 kg CO2 per unit vs. legacy silicon IGBTs.

    “For industrial power designers, the WEKA forum highlights leading-edge, reliable technology for drives, pumps, chargers and power conversion, using GaN and SiC,” said Mr. Hesener. “Features like loss-less current sensing, programmable dV/dt, 2 kV ESD protection and autonomous sensing and protection are key enablers, and reduce time to market.”

    WEKA Fachmedien’s Power Semiconductor User Forum 2023 will be held from November 22nd-23rd at the Novotel Messe Munich, Willy-Brandt-Platz 1, 81829 München, Germany.

    Original – Navitas Semiconductor

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  • DENSO Delivers Company Direction Update

    DENSO Delivers Company Direction Update

    4 Min Read

    DENSO CORPORATION hosted its annual Dialog Day on November 15th. Aiming to enhance its concepts “Green” and “Peace of Mind” to evolve from “a Tier 1 supplier that supports the auto industry” to “a Tier 1 supplier that supports a mobility-centered society,” DENSO has announced a new management structure strategy, its corporate value improvement strategy, its fundamental technology strategy and creation of new values.

    To evolve from “a Tier 1 supplier that supports the auto industry“ to “a Tier 1 supplier that supports a mobility-centered society,” DENSO is implementing three intiatives: “evolution of mobility,” “strengthening fundamental technologies,” and “creating new value.”

    1.Evolution of mobility


    ・ Electrification


    DENSO aims to grow its electrification business to 1.2 trillion yen in sales by 2025 and 1.7 trillion yen in 2030 by strengthening its “product competitiveness,” “product lineups” and “manufacturing.”

    In terms of “product competitiveness,” the company will refine the functions and performance of its core products, improve competitiveness and provide a wide range of products, from core components to energy management systems, to meet the diverse needs of customers’ “product lineups.” In “manufacturing,” DENSO will shorten the development period in half so it can quickly deliver products to customers around the world. In support of this, the company will establish a mass-production system in 5 regions around the world.

    ・ADAS


    DENSO aims to achieve sales of 520 billion yen by 2025 and 1 trillion yen in 2030 by strengthening its “product competitiveness,” “product lineups” and “technology development.”

    For “product competitiveness,” in 2022, the company began mass producing Global Safety Package 3, a new-generation advanced safety system. It achieves optimal driver assistance by connecting ADAS products to HMI (Human Machine Interface) and infrastructure. In terms of “product lineups” DENSO will contribute to safety by increasing the percentage of vehicles equipped with our products and systems that meet the needs of customers and local communities. In “technology development,” we will strengthen the development of emerging technologies that support the evolution of systems and components.

    2.Strengthening fundamental technologies


    ・Semiconductor


    DENSO will actively invest about 500 billion yen by 2030 and will triple the scale of the business to 700 billion yen from the current level by 2035.

    In terms of SiC power semiconductors, which contribute to the improvement of electricity consumption of BEV, the company will accelerate the introduction of SiC power semiconductors to the market by promoting technological initiatives such as the practical application of high-quality wafers and the reduction of costs, and by achieving stable supply through cooperation with our partners. Regarding analog semiconductor ASICs, we will differentiate ourselves by developing in-house products that suppot customers’ needs. In terms of the SoC, we will build an optimal SoC for in-vehicle use by advancing industry cooperation, including the acquisition of chiplet technology.

    ・Software


    Relating to our workforce, in 2030, DENSO will increase the number of software engineers to 18,000, 1.5 times more than the current level. In 2035, we increased the size of our business to 800 billion yen, four times more than the current level.

    As the scale of in-vehicle software becomes increasingly large and the cross-domain development such as powertrains, body, and communications is required, DENSO will realize a large-scale integrated Electronic Control Unit (ECU) with high quality and high accuracy in software by utilizing the diverse software IP and mounting capabilities DENSO has accumulated over the years. In the age of Software-Defined Vehicles (SDV), when software and hardware are separated and begin to be distributed separately, we will ollaborate with customers to develop business and lead standardization across our customers.

    3.Creating new value


    DENSO aims to grow the new value business to 300 billion yen in sales by 2030 and to 20% of total sales in 2035.

    While we are developing technologies and considering commercialization in various fields, we will enter the hydrogen business in the energy field. Utilizing technologies we have developed in the automotive industry, such as ceramics, ejectors, and thermal management, we will introduce SOEC and SOFC to the market. In the food and agriculture sector, we will introduce manufacturing principles to farming to contribute to the stable supply of food,. We will also accelerate our global business development by combining the strengths of the wholly owned Certhon Group with those of DENSO.

    Through the three intiatives and under the new management structure, we will advance our business in the field of “Green” and “Peace of Mind” and aim to achieive 7.5 trillion yen in sales by 2030.

    Management that values our people


    DENSO will recruit new employees and shift current ones in mature fields to electrification and software areas to grow that team to about 4,000 employees from 2022 to 2025. The company values the intrinsic talents and passions of every employee, which is the driving force behind all DENSO activities. DENSO will promote management that values its people in order to connect its company philosophy with employees’ motivations.

    Original – DENSO

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  • Applied Materials Announced Fourth Quarter and Fiscal Year 2023 Results

    Applied Materials Announced Fourth Quarter and Fiscal Year 2023 Results

    2 Min Read

    Applied Materials, Inc. reported results for its fourth quarter and fiscal year ended Oct. 29, 2023.

    Fourth Quarter Results

    Applied generated revenue of $6.72 billion. On a GAAP basis, the company reported gross margin of 47.1 percent, operating income of $1.97 billion or 29.3 percent of net sales, and record earnings per share (EPS) of $2.38.

    On a non-GAAP adjusted basis, the company reported gross margin of 47.3 percent, operating income of $1.98 billion or 29.5 percent of net sales, and record EPS of $2.12.

    The company generated $1.56 billion in cash from operations and distributed $968 million to shareholders including $700 million in share repurchases and $268 million in dividends.

    Full Year Results

    In fiscal 2023, Applied generated record revenue of $26.52 billion. On a GAAP basis, the company recorded gross margin of 46.7 percent, operating income of $7.65 billion or 28.9 percent of net sales, and record EPS of $8.11.

    On a non-GAAP adjusted basis, the company reported gross margin of 46.8 percent, operating income of $7.72 billion or 29.1 percent of net sales, and record EPS of $8.05.

    The company generated a record $8.70 billion in cash from operations and distributed $3.16 billion to shareholders including $2.19 billion in share repurchases and $975 million in dividends.

    “Applied Materials delivered record revenue, earnings and cash flow in fiscal 2023 and is outgrowing the wafer fabrication equipment market for the fifth year in a row,” said Gary Dickerson, President and CEO. “Applied’s broad product portfolio, strong customer relationships and leadership at major technology inflections put us in a great position to profitably grow the company as powerful trends fuel the semiconductor industry’s expansion in the years ahead.”

    Original – Applied Materials

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  • Siltronic Updated Its Climate Strategy

    Siltronic Updated Its Climate Strategy

    3 Min Read

    Siltronic has updated its existing climate strategy and set ambitious targets to fulfill its role in the Paris Climate Agreement.

    The company remains committed to reducing its direct (scope 1) and indirect greenhouse gas emissions from energy purchases (scope 2) to zero by 2045 at the latest. Despite continued growth and the associated significant increase in energy consumption, these greenhouse gas emissions are expected to be reduced by 42% by 2030 as compared to the 2021 base year.

    With these targets, Siltronic is making its contribution to limiting global warming to a maximum of 1.5 degrees Celsius in accordance with the Paris Climate Agreement passed in 2015. For Siltronic, the 1.5-degree benchmark is the key reference point for the target years 2030 and 2045. The carbon intensity, measured by the CO2 emissions in relation to sales, is to be reduced by an average of at least 5 percent per year between 2021 and 2030.

    “Increasing energy efficiency and thus reducing emissions has always been a core element of our corporate strategy. Our goal is to contribute as effectively as possible to the fight against climate change, and at the same time to support the global decarbonization through our products,” said Claudia Schmitt, CFO of Siltronic AG and responsible for the company’s sustainability activities.

    Joining the RE100 underscores our commitment to renewable energy

    To achieve the revised climate targets, Siltronic is committed to gradually increasing the use of renewable energy to 60 percent by 2030 and 100 percent by 2045. To reinforce its commitment to renewable energy, Siltronic joined the RE100 initiative in November 2023. RE100 is a global corporate initiative dedicated to the exclusive use of renewable energy. Through its membership, Siltronic aims to help eliminate one of the biggest obstacles to global decarbonization: the insufficient amount of green electricity available in many energy markets.

    For Siltronic, this is particularly noticeable at its largest site in Singapore, where growth will be strongest in the coming years due to the gradual ramp of the new fab, which recently started test operations. Siltronic’s updated climate targets are conditional on the availability of renewable energy in Singapore to improve by 2030 and beyond. To this end, the company is in continuous dialog with decision-makers in Singapore.

    Siltronic’s commitment to climate protection and the reduction of scope 3 emissions, meaning greenhouse gas emissions generated outside of Siltronic, also extends to the supply chain. The company will intensify its cooperation with suppliers in this regard in the future.

    SBTi standards remain reference point, validation not pursued for now

    In 2021, Siltronic defined targets in accordance with the Science Based Target Initiative (SBTi), which changed its criteria for the purchase of renewable energy in Q2 2023. Considering these revised requirements, the company feels compelled not to pursue the planned validation of the SBTi targets. At the same time, the SBTi criteria remain an important reference point for Siltronic.

    The company continues to have its sustainability performance evaluated by independent third parties. To learn more about these and other sustainability practices, please visit https://www.siltronic.com/en/our-company/sustainability.html.

    Original – Siltronic

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