• Texas Instruments Broke Ground on its New 300-mm Semiconductor Wafer Fab in Utah

    Texas Instruments Broke Ground on its New 300-mm Semiconductor Wafer Fab in Utah

    4 Min Read

    Texas Instruments (TI) broke ground on its new 300-mm semiconductor wafer fabrication plant (or “fab”) in Lehi, Utah. Joined by Utah Governor Spencer Cox, state and local elected officials, as well as community leaders, TI President and Chief Executive Officer Haviv Ilan celebrated the first steps toward construction of the new fab, LFAB2, which will connect to the company’s existing 300-mm wafer fab in Lehi. Once completed, TI’s two Utah fabs will manufacture tens of millions of analog and embedded processing chips every day at full production.

    “Today we take an important step in our company’s journey to expand our manufacturing footprint in Utah. This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” said Ilan. “At TI, our passion is to create a better world by making electronics more affordable through semiconductors. We are proud to be a growing member of the Utah community, and to manufacture analog and embedded processing semiconductors that are vital for nearly every type of electronic system today.”

    In February, TI announced its $11 billion investment in Utah, marking the largest economic investment in state history. LFAB2 will create approximately 800 additional TI jobs as well as thousands of indirect jobs, with first production available as early as 2026.

    “TI’s growing manufacturing presence in Utah will be transformative for our state, creating hundreds of good-paying jobs for Utahns to manufacture critically important technology,” said Utah Governor Spencer Cox. “We are proud that semiconductors – made in Utah by Utahns – will power the innovation that is foundational to our country’s economic and national security.”

    As part of TI’s commitment to education, the company will invest $9 million dollars in the Alpine School District to develop the state’s first Science, Technology, Engineering and Math (STEM) learning community for all students in kindergarten through 12th grade. The multiyear program will embed STEM concepts more deeply into coursework for the district’s 85,000 students and provide STEM-oriented professional development for its teachers and administrators. The district-wide program will equip students with essential STEM skills, such as critical thinking, collaboration and creative problem-solving to succeed after graduation.   

    “We are excited this partnership will help our students develop essential knowledge and skills, preparing them for success in life and possible careers in the technology sector,” said Alpine School District Superintendent, Dr. Shane Farnsworth. “Working together with the city of Lehi, Texas Instruments, and our schools, this collaborative investment will impact students and their families for many generations to come.”

    TI has a long-standing commitment to responsible, sustainable manufacturing. LFAB2 will be one of the company’s most environmentally efficient wafer fabs, designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold version 4.

    LFAB2 has a goal to be powered by 100% renewable electricity, and advanced 300-mm equipment and processes in Lehi will further reduce waste, water and energy consumption. In fact, LFAB2 is expected to recycle water at nearly twice the rate of TI’s existing fab in Lehi.

    LFAB2 will complement TI’s existing 300-mm wafer fabs, which include LFAB1 (Lehi, Utah), DMOS6 (Dallas), and RFAB1 and RFAB2 (both in Richardson, Texas). TI is also building four new 300-mm wafer fabs in Sherman, Texas (SM1, SM2, SM3 and SM4), with production from the first fab as early as 2025.

    TI’s manufacturing expansions, with anticipated support from the CHIPS and Science Act, will provide reliable supply of analog and embedded processing products. These investments in manufacturing and technology illustrate the company’s commitment to long-term capacity planning.

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  • Siltronic Welcomed Representatives from Singapore Economic Development Board (EDB)

    Siltronic Welcomed Representatives from Singapore Economic Development Board (EDB)

    1 Min Read

    This week, Siltronic welcomed high-ranking representatives from the Singapore Economic Development Board (EDB) to its Munich headquarters. The delegation, led by Chairman Mr. Png Cheong Boon, included five members of the EDB. This visit underscores the ongoing strong international collaboration with the EDB.

    Over the years, Siltronic’s partnership with the EDB has been characterized by strong support and cooperation in many areas, such as workforce development, labor market support, infrastructure development, as well as investment support.

    During the meeting, both parties reiterated their shared commitment to collaboration in these vital areas and engaged in discussions regarding strategies for decarbonization.

    Siltronic’s latest state-of-the-art 300 mm fab is the largest investment ever made by a German company in Singapore. It showcases the commitment to strengthen and expand the positive relationships with our Singaporean partners.

    Dr. Michael Heckmeier, CEO of Siltronic AG, expressed his pleasure to meet the EDB team in person. “The collaboration between Siltronic and the EDB over the years has created significant results. We are proud of these positive collaborative outcomes and look forward to the future.”

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  • BorgWarner to Deliver SiC Bi-directional 800V Onboard Charger to the Major North American OEM

    BorgWarner to Deliver SiC Bi-directional 800V Onboard Charger to the Major North American OEM

    2 Min Read

    BorgWarner has clinched an agreement with a major North American OEM to supply its bi-directional 800V Onboard Charger (OBC) for the automaker’s premium passenger vehicle battery electric vehicle (BEV) platforms. The technology leverages silicon carbide (SiC) power switches for improved efficiency and delivers amplified power density, power conversion and safety compliance. Start of production is slated for January 2027.  

    “This is a big accomplishment for the team at BorgWarner, highlighting our first OBC win with this OEM and marks the first OBC win in North America,” said Dr. Stefan Demmerle, President and General Manager, BorgWarner PowerDrive Systems.

    “Through our world-class power electronics expertise and market leading status for our 800-volt and silicon carbide technology, we are providing a solution to maximize charging power capabilities, extend power densities and enhance efficiencies while catering to differing grid configurations across regions.”

    BorgWarner’s OBC technology is installed in electric vehicles to convert alternating current (AC) from the power grid to direct current (DC) to charge batteries. The OBC is capable of powers ranging from 19.2kW single-phase operation to 22kW three-phase operation.

    The 19.2kW power level uses two power lines for a single-phase grid connection, which is unique to the U.S. market. The 22kW power level uses a three-phase grid connection and is intended for use in the European market. The 19.2kW single-phase charger is currently the only one of its kind to be introduced into the U.S. market. 

    The OBC incorporates a bi-directional vehicle-to-load (V2L) operating mode that enables users to use the vehicle battery pack to charge various standalone applications, which is an increasingly desired feature within the industry. Additionally, both the charger hardware and software are designed and produced by BorgWarner.

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  • Qorvo Delivered Significantly Improved Financial Performance

    Qorvo Delivered Significantly Improved Financial Performance

    2 Min Read

    Qorvo® announced financial results for the Company’s fiscal 2024 second quarter ended September 30, 2023.

    Quarterly Highlights

    • Grew quarterly revenue 70% sequentially and exceeded the mid-point of revenue guidance by $103 million
    • Achieved sequential growth in ACG, CSG and HPA operating segments
    • Secured broad-based design wins in all end markets, including major UWB wins in a flagship Android smartphone and an in-vehicle car access platform by a leading German automotive tier one
    • Significantly reduced Qorvo inventory while improving Android channel inventory

    On a GAAP basis, revenue for Qorvo’s fiscal 2024 second quarter was $1.103 billion, gross margin was 44.4%, operating income was $151 million and diluted earnings per share was $0.99. On a non-GAAP basis, gross margin was 47.6%, operating income was $279 million and diluted earnings per share was $2.39.

    Bob Bruggeworth, president and chief executive officer of Qorvo, said, “Qorvo delivered significantly improved financial performance in the September quarter supported by content gains at our largest customer. Each of our operating segments is enjoying multiyear technology upgrade cycles that improve performance and enhance functionality, and Qorvo is critical to enabling these capabilities. The Qorvo team continues to operate very well to secure new customer designs and broaden our opportunities in growth markets.”

    Financial Commentary and Outlook

    Grant Brown, chief financial officer of Qorvo, said, “Qorvo exceeded the high end of our September quarterly guidance for revenue, gross margin and EPS, reflecting content gains at our largest customer and sequential growth in all three operating segments. Looking forward, our December quarterly guidance reflects seasonal patterns, robust content on customer programs and improved channel inventories. We continue to expect year-over-year revenue growth in fiscal 2024.”

    Qorvo’s current outlook for the December 2023 quarter is:

    • Quarterly revenue of approximately $1 billion, plus or minus $25 million
    • Non-GAAP gross margin between 43% and 44%
    • Non-GAAP diluted earnings per share of approximately $1.65 at the midpoint of revenue

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  • Axcelis Delivered Strong Third Quarter Financial Performance

    Axcelis Delivered Strong Third Quarter Financial Performance

    2 Min Read

    Axcelis Technologies, Inc. announced financial results for the third quarter of 2023.

    Highlights include:

    • The Company reported third quarter revenue of $292.3 million, compared to $274.0 million for the second quarter of 2023.
    • Operating profit for the quarter was $71.7 million, compared to $63.7 million for the second quarter.
    • Net income for the quarter was $65.9 million, or $1.99 per diluted share, compared to $61.6 million, or $1.86 per diluted share in the second quarter.
    • Gross margin for the quarter was 44.4%, compared to 43.7% in the second quarter.
    • Third quarter ended with systems backlog of $1.2 billion on quarterly bookings of $198 million.

    President and CEO Russell Low commented, “Axcelis delivered strong third quarter financial performance due to robust demand for the Purion product family, especially in the silicon carbide power market. Axcelis is the only company with a product line that can deliver complete recipe coverage for all power device applications. We are the technology leader and the supplier of choice providing the best device manufacturing capabilities. This uniquely positions Axcelis to benefit from high growth in this market. Axcelis expects to achieve revenue of greater than $1.1 billion in 2023.”

    Executive Vice President and Chief Financial Officer James Coogan said, “We are very pleased with our third quarter 2023 financial results. Revenue, EPS and gross margins all finished well above guidance. Axcelis has had the rare opportunity to grow revenue 20% year over year as well as improve profitability during a significant industry downturn. This is a result of strong product positioning and continued strong execution in a challenging environment.”

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