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Power Integrations announced financial results for the quarter and year ended December 31, 2023. Net revenues for the fourth quarter were $89.5 million, down 29 percent compared to the prior quarter and down 28 percent from the fourth quarter of 2022. GAAP net income for the fourth quarter was $14.3 million or $0.25 per diluted share compared to $0.34 per diluted share in the prior quarter and $0.40 per diluted share in the fourth quarter of 2022.
For the full year, net revenues were $444.5 million, compared to $651.1 million in the prior year. Full-year GAAP net income was $55.7 million or $0.97 per diluted share compared to $2.93 per diluted share in the prior year. Full-year cash flow from operations was $65.8 million.
In addition to its GAAP results, the company provided non-GAAP measures that for the fourth quarter of 2023 exclude stock-based compensation, amortization of acquisition-related intangible assets and the related tax effects. Non-GAAP net income for the fourth quarter of 2023 was $12.7 million or $0.22 per diluted share compared to $0.46 per diluted share in the prior quarter and $0.48 per diluted share in the fourth quarter of 2022. For the full year, non-GAAP net income was $74.5 million or $1.29 per diluted share compared to $3.29 per diluted share in the prior year. A reconciliation of GAAP to non-GAAP financial results is included with the tables accompanying this press release.
Commented Balu Balakrishnan, chairman and CEO of Power Integrations: “Fourth-quarter revenues declined as expected, and we project first-quarter sales to be about flat sequentially due to continued soft demand and elevated supply-chain inventories. However, channel inventory fell significantly in the fourth quarter, and we expect a further reduction in the first quarter. Based on lower inventories and seasonal patterns we expect sequential revenue growth beginning in the June quarter. We also expect gross margin to rise in the June quarter driven by the dollar/yen exchange rate, higher manufacturing utilization and end-market mix.”
During the fourth quarter Power Integrations repurchased 680 thousand shares of its common stock for $47.4 million. The company had $26.0 million remaining on its repurchase authorization as of December 31, 2023. Power Integrations paid a dividend of $0.20 per share on December 29, 2023, and will pay a dividend of $0.20 per share on March 29, 2024, to stockholders of record as of February 29, 2024.
Financial Outlook
The company issued the following forecast for the first quarter of 2024:
- Revenues are expected to be $90 million plus or minus $5 million.
- GAAP gross margin is expected to be approximately 51.5 percent; non-GAAP gross margin is expected to be approximately 52.5 percent. The difference between GAAP and non-GAAP gross margins is equally attributable to stock-based compensation and amortization of acquisition-related intangible assets.
- GAAP operating expenses are expected to be approximately $49 million; non-GAAP operating expenses are expected to be approximately $42.5 million. Non-GAAP operating expenses are expected to exclude about $6.5 million of stock-based compensation.
Original – Power Integrations
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JCET Group announced that the company’s holding company, JCET Automotive Electronics (Shanghai) Co., Ltd., has successfully secured a RMB 4.4 billion capital increase. The agreement was ratified by the Fourth Meeting of the Eighth Board of Directors and the First Extraordinary General Meeting of Shareholders in 2024, being signed and taking effect on February 5, 2024.
The capital aims to support the construction of JCET’s first intelligent automotive-grade chip advanced packaging flagship factory.
Located in Shanghai’s cutting-edge Lingang industrial hub in eastern China, the JCET Automotive Chip Back-end Manufacturing Base spans over 130,000 square meters, with a dedicated factory area of approximately 200,000 square meters. Construction has accelerated since its commencement in August 2023. Equipment entry is anticipated in the first half of 2025.
Leveraging JCET’s industry-leading technology and resources, the project also includes a pilot line dedicated to manufacturing automotive chip products in China. It focuses on packaging automotive computing chips, power modules and more, optimizing packaging processes and materials while fully implementing automation solutions.
The completed facility will serve customers worldwide and has already garnered significant attention from major car manufacturers and chip suppliers. It caters to a broad spectrum of automotive applications, including ADAS sensors, high-performance computing, interconnectivity, and power modules – driving advancements in performance, reliability, and automation across the entire industry chain.
JCET has experienced rapid expansion within the automotive electronics sector in recent years. The company’s automotive electronics revenue achieved a CAGR exceeding 50% from 2019 to 2022. This momentum continued in the first three quarters of 2023, with revenue in this segment increasing by 88% year-on-year. JCET’s downstream applications not only cover power management, but also include areas such as autonomous driving, infotainment systems, various sensors, and vehicle networking involved in automotive intelligence.
Furthermore, JCET’s close collaboration with customers through the pilot line allows them to secure production capacity in the Lingang facility in advance. Doing so significantly streamlines the verification and introduction processes for future customer products. This fosters a seamless transition from early development to mass production, enabling both parties to capitalize on the vast upcoming opportunities in the automotive semiconductor market.
Original – JCET
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Renesas Electronics Corporation announced consolidated financial results in accordance with IFRS for the year ended December 31, 2023.
Summary of Consolidated Financial Results (Note 1, 4)
Year ended December 31, 2023 Billion Yen % of Revenue Revenue 1,469.4 100.0 Operating profit 390.8 26.6 Profit attributable to owners of parent 337.1 22.9 Capital expenditures (Note 2) 75.5 Depreciation and amortization 186.0 R&D expenses (Note 3) 233.5 Yen Exchange rate (USD) 140 Exchange rate (EUR) 151 As of December 31, 2023 Billion Yen Total assets 3,167.0 Total equity 2,005.6 Equity attributable to owners of parent 2,001.6 Equity ratio attributable to owners of parent (%) 63.2 Interest-bearing liabilities 667.7 - Note 1: All figures are rounded to the nearest 100 million yen.
- Note 2: Capital expenditures refer to the amount of capital for property, plant and equipment (manufacturing equipment) and intangible assets based on the amount of investment decisions made during the year ended December 31, 2023. However, the investments from Dialog Semiconductor Limited (hereinafter “Dialog”) and Celeno Communications Inc. (hereinafter “Celeno”) are listed as an input basis. It should be noted that as of September 29, 2023, Celeno changed its company name from Celeno Communications Inc. to Renesas Semiconductor Design US Inc.
- Note 3: R&D expenses include capitalized R&D expenses recorded as intangible assets.
- Note 4: The allocation of the acquisition costs for the business combination with Steradian Semiconductors Private Limited (hereinafter “Steradian”) and Panthronics AG (hereinafter “Panthronics”) has been revised at the end of three months ended March 31, 2023, and at the end of the three months ended December 31, 2023, respectively. These revisions have been reflected in the consolidated financial results for the year ended December 31, 2022 as well as the consolidated financial results for the three months ended June 30 and September 30, 2023. As of October 12, 2023, Panthronics changed its corporate name to Renesas Design Austria GmbH.
Original – Renesas Electronics
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Micro Commercial Components unveiled the latest components with advanced semiconductor technology — three super fast recovery rectifiers. With a low profile and 600V capacity, MURBF1660C, MURBF1660CT, and MURBF3060CT are game-changers that deliver superior power in a small design.
Housed in a sleek TO-263AC package, these advanced products boast a minimal height of only 1.7mm and are compatible with the in-demand D2PAK footprint. Available in single or dual common cathode configurations, these super fast recovery rectifiers feature low leakage and forward currents of 16A or 30A.
These rectifiers minimize losses and maximize efficiency, making them ideal for reliable power management in industrial, consumer, and telecommunications applications. No matter which super fast recovery rectifier you choose from this collection, you’ll utilize ultra-fast recovery and unquestionable performance.
Features & Benefits:
- Low forward voltage
- Low leakage current
- Reduced power losses and increased efficiency
- Low profile TO-263AC package
- 1.7mm typical height
- D2PAK footprint compatibility for maximum versatility
- 600V working voltage
- Forward currents of 16A and 30A per device
- Single or dual common cathode configuration options
Original – Micro Commercial Components
