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Infineon Technologies AG introduced the first product in its new advanced power MOSFET technology OptiMOS™ 7 80 V. The IAUCN08S7N013 features a significantly increased power density and is available in the versatile, robust, and high-current SSO8 5 x 6 mm² SMD package.
The OptiMOS™ 7 80 V offering is a perfect match for the upcoming 48 V board net applications. It is designed specifically for the high performance, high quality and robustness needed for demanding automotive applications like automotive DC-DC converters in EVs, 48 V motor control, for instance electric power steering (EPS), 48 V battery switches and electric two- and three-wheelers.
Compared to the previous generation, the R DS(on) of the Infineon IAUCN08S7N013 has been reduced by more than 50 percent, and is now the best R DS(on) in the industry with a maximum of 1.3 mΩ. Users benefit from minimized conduction losses, superior switching performance and the highest power density in a 5 x 6 mm² package.
In addition, the IAUCN08S7N013 also features low package resistance and inductance, as well as a high avalanche current capability. For automotive applications, it has an extended qualification that goes beyond AEC-Q101.
The IAUCN08S7N013 is in mass-production and available now. More information is available at www.infineon.com/iaucn08s7n013/.
Original – Infineon Technologies
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Navitas Semiconductor announced its participation in the upcoming Power Electronics International conference on April 16th– 17th 2024, in Brussels, Belgium.
Grid reliability is a key factor in a $1.3 trillion power semiconductor opportunity as Navitas’ technologies accelerate the transition from fossil fuels to renewable energies. Navitas will introduce the latest GaNFast™ and GeneSiC™ products to the European audience, including new Gen-3 Fast SiC for high-power and higher-speed performance, plus GaNSafe™ – the world’s most protected GaN power devices.
Navitas will present the following on April 17th:
- “3.3 kV SiC MOSFETs Accelerate Grid-Connected Energy Storage,” Dr. Ranbir Singh, EVP GeneSiC
Synopsis: The grid supplies energy from generators and delivers it to customers via transmission and distribution (T&D) networks. In the U.S., the use of electricity storage to support and optimize T&D has been limited due to high storage costs and limited design and operational experience. Recent improvements in storage and power technologies, however, coupled with changes in the marketplace, herald an era of expanding opportunity for electricity storage. SiC inverters will revolutionize electricity delivery, renewable energy integration, and energy storage. It is well-recognized that silicon-based semiconductors have inherent limitations that reduce their suitability for utility-scale applications.
- “Bi-directional circuits open up new opportunities in off-grid applications,” Alfred Hesener, Senior Director Industrial and Consumer Applications
Synopsis: Bi-directional circuits are critical to effectively smooth the supply/demand variation in renewable energy applications. In the past, they were expensive to make and complex to implement in power electronics applications. Wide bandgap GaN power ICs with integrated drive and advanced circuit functions deliver easy-to-use, reliable, high power density, and functionality for power factor correction circuits, solar inverters, and solid-state circuit breakers.
Original – Navitas Semiconductor
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Vishay Intertechnology, Inc. introduced two new FRED Pt® 500 A Ultrafast soft recovery diode modules in the new TO-244 Gen III package. Offering higher reliability than previous-generation solutions, the Vishay Semiconductors VS-VSUD505CW60 and VS-VSUD510CW60 are designed to reduce losses and EMI / RFI in high frequency power conditioning systems.
The rugged TO-244 package of the diode modules released today withstands 46 000 IOL cycles at given conditions, offering an improved life expectancy over previous-generation devices. In addition, the industry-standard package is footprint-compatible with competing solutions in the TO-244 to provide a drop-in replacement for existing designs.
The VSUD505CW60 and VS-VSUD510CW60 are ideally suited for high frequency welding; high current converters and ballast water management systems (BWMS) in railway equipment, cranes, and ships; UPS; and other applications where switching losses comprise a significant portion of the total losses. In these applications, the softness of their recovery eliminates the need for a snubber, reducing component counts and lowering costs.
Offered in a common cathode configuration, the diode modules provide low forward voltage drop down to 0.82 V, thermal resistance — junction to case — of 0.16 °C/W, and an operating temperature range up to +175 °C.
Device Specification Table:
Part number VS-VSUD505CW60 VS-VSUD510CW60 VR (V) 600 IF(AV) (A) 500 Qrr typical (nC) 460 1770 trr (ns) 178 270 VFM @ 250 A, +175 °C (V) 0.95 0.82 RthJC per diode (°C/W) 0.160 Package TO-244 Samples and production quantities of the new FRED Pt® soft recovery diode modules are available now, with lead times of 26 weeks.
Original – Vishay Intertechnology
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Toshiba Corporation announced a new Toshiba Group Policy on Diversity, Equity, Inclusion and Belonging (DEIB) that takes Diversity and Inclusion (D&I) initiatives promoted by the Group to a new level with the addition of Equity (E) and Belonging (B). The policy applies to all executives and employees of Toshiba Group in Japan and overseas.
The addition of E represents fair provision of opportunities that allow all employees to take on challenges and flourish, so that all employees are able to maximize their abilities and contribute to the organization. B indicates realizing circumstances where each individual feels that, “As a member of the organization, I am in a place where I can make the most of myself,” leading to higher engagement, productivity, and employee retention.
The policy summarizes an approach to DEIB closely attuned to the times. Toshiba Group will use it to foster a corporate culture in which all employees can turn their diversity into strengths, find fulfillment in working for the Group, and feel that they are growing by taking on various challenges while maximizing their individual capabilities.
Since establishing an organization to promote D&I in 2004, under the direct control of the CEO, Toshiba Group has promoted D&I as part of the management strategy. Today, a close alignment of management goals and human resources policy is essential, and awareness of the importance of information disclosure on diversity and human capital is increasing globally. With the new policy, Toshiba Group intends to improve employee engagement and also to promote stakeholder understanding of the Group by communicating its basic stance on the participation of diverse human resources in an easy-to-understand manner.
Guided by the basic commitment of “Committed to People, Committed to the Future,” Toshiba Group will further strengthen its efforts to promote diversity based on the DEIB policy, with the aim of achieving both employee and company growth.
Toshiba Group DEIB Policy Website
https://www.global.toshiba/ww/sustainability/corporate/performance/social/diversity.htmlOriginal – Toshiba
