-
SMC Diode Solutions, a leading designer and manufacturer of silicon carbide and silicon die, wafer and packaged products, announced a representative agreement with Atlantic Tech Marketing LLC. The agreement authorizes Atlantic Tech Marketing LLC to promote, sell, and market SMC’s extensive range of discrete products in several US states, including Alabama, Georgia, North Carolina, South Carolina, Mississippi, and Tennessee.
Learn more about Atlantic Tech Marketing LLC here: https://atlantic-tech.com
SMC Diode’s SiC and Si products are sold for a variety of applications in the commercial market including automotive, LCD displays, telecom equipment, power supplies, industrial and aircraft industries, which have demanding reliability and quality requirements.
Original – SMC Diode Solutions
-
Teledyne e2v HiRel Electronics announced the release of the TDGM650LS60, the first product in its innovative new 650V power module family. This new module utilizes a Teledyne high voltage Gallium Nitride (GaN) transistor and integrates an isolated driver in one package.
Designed to serve as a load switch or solid-state switch, the TDGM650LS60 offers unparalleled performance and versatility. With the driver providing 5KV isolation and a GaN transistor boasting a minimum breakdown voltage of 650V, this module ensures robust and dependable operation in diverse environments.
One of the standout features of the TDGM650LS60 is its lightning-fast switching time coupled with the absence of moving parts. This unique combination not only enhances operational efficiency but also significantly elevates the reliability of the device. As a result, the TDGM650LS60 is ideally suited for high-reliability applications, including but not limited to Space, Avionics, and Military sectors.
“This launch marks a significant milestone in Teledyne’s commitment to innovation” said Mont Taylor, Vice President and Business Development Manager at Teledyne e2v HiRel. “The TDGM650LS60 represents the culmination of our dedication to pushing the boundaries of technology, offering our customers performance, reliability, and versatility in their applications.”
Original – Teledyne e2v HiRel Electronics
-
SemiQ will showcase its latest portfolio of advanced SiC modules at this year’s International Electric Vehicle Symposium & Exhibition (EVS37) in Seoul, South Korea, from April 23rd to 26th, 2024.
Visitors to SemiQ’s booth #C1414 in Hall C, Coex, will have the chance to explore the company’s cutting-edge QSiC™ technologies, including the very latest 1200V SiC modules. Engineered to excel even in demanding environments, these modules facilitate top-tier performance and compact integration, all while mitigating both dynamic and static losses. Crafted from premium-grade ceramics, the modules come in a variety of configurations, including SOT-227, half-bridge, and full-bridge options.
The latest QSiC MOSFET modules offer versatile support for a wide spectrum of demanding automotive and industrial power applications where efficiency, power density and performance are paramount design considerations. These encompass electric vehicle charging, on-board chargers (OBCs), DC-DC converters, electronic compressors (E-compressors), fuel cell converters, medical power supplies, energy storage systems, solar and wind energy applications, data center power supplies, and UPS/PFC circuits.
“We’re excited to show visitors to EVS37 how our QSiC™ family of 1200V MOSFET modules can empower engineers in renewable energy, automotive, medical and industrial sectors,” said Dr. Timothy Han, President of SemiQ. “With rigorous testing and meticulous customization, we guarantee that each module exceeds the requirements of high-efficiency, high-power applications, enhancing reliability and performance.”
EVS37 is a global forum conceived to highlight industry breakthroughs and electric vehicle advancements. Boasting insightful talks by prominent figures from both industry and academia, EVS is a state-of-the-art exhibition featuring contributions from around the world and many opportunities for professional networking.
Original – SemiQ
-
SemiQ has opened its newest office in Taiwan. This strategic move underscores SemiQ’s commitment to providing enhanced ground support to its valued customers in the region while further solidifying its presence in the Asia-Pacific market.
As a Product Engineering and Global Sourcing Center, the new office, located near the Taiwan High Speed Rail Hsinchu Station, will serve as a vital hub, facilitating seamless interfacing with key stakeholders including Hsinchu Foundry, Miaoli Test Facility, Far East OSATs, and Taiwan Sales Office.
“Expanding our presence in Taiwan represents a significant milestone for SemiQ as we continue to strengthen our global operations and better serve our customers,” said Michael Tsang, VP, Product Engineering and Operations at SemiQ. “The opening of this office underscores our dedication to providing unparalleled support and resources to our customer base in the region.”
Mr. Tsang, a seasoned professional with extensive experience in semiconductor industry dynamics, will lead the Taiwan office. His expertise will be instrumental in managing demand, fostering partnerships, and ensuring the highest level of service delivery to SemiQ’s customers.
The strategic location of the new office near key industry players and transportation hubs will enhance SemiQ’s ability to collaborate effectively with its partners, streamline operations and expedite response times to customer needs.
“We are excited about the opportunities that the Taiwan office brings in terms of strengthening relationships with our partners and better understanding the evolving needs of the market,” added Mr. Tsang. “This expansion aligns with our vision of driving innovation and delivering value-added solutions to our customers.”
Establishing the Taiwan office complements SemiQ’s existing wafer processing facilities in the region. It underscores its commitment to providing superior SiC solutions for ultra-efficient, high-performance, and high-voltage applications.
Original – SemiQ
-
Microchip Technology Incorporated announced that its Board of Directors has appointed Rich Simoncic as Chief Operating Officer. In this position, Mr. Simoncic will report to Ganesh Moorthy, who will remain President and CEO.
Rich Simoncic joined Microchip as a new college graduate in 1989 and has had progressively increasing product development, operational and business unit responsibilities. He founded the analog business at Microchip in 1998 and has been instrumental in building it to a more than $2 billion annual revenue business through a combination of organic efforts as well as acquisitions.
He was promoted to Vice President in 1995, Corporate Vice President in 2001, Senior Vice President in 2019 and Executive Vice President in 2023. He holds a Bachelor’s degree in Electrical Engineering Technology from DeVry Institute of Technology.
“Rich has expanded his role over the last few years, beyond leading our analog businesses, by assisting me with several corporate initiatives, including strategic planning, acquisitions, total system solutions, market megatrends, use of artificial intelligence within Microchip and Investor Relations activities. Going forward, Rich and I will jointly manage the worldwide Microchip enterprise so that we can apply our combined leadership capacity to engage the opportunities and challenges ahead of us,” said Ganesh Moorthy, Microchip’s President and CEO.
Original – Microchip Technology
-
According to the information on the official website of the China National Intellectual Property Administration (CNIPA) on April 2, 2024, the key claims 6, 9, 10, 13, 14, 17, 18 and 22-26 of the Chinese patent titled “Enhancement mode GaN HEMT device and method for fabricating the same” (Patent No. ZL201080015388.2) owned by Efficient Power Conversion Corp (“EPC”) have been maintained valid during an invalidation procedure (case number: 4W116775), which was requested by the petitioner Innoscience (Suzhou) Technology Co., Ltd. (“Innoscience”).
As compared with products using silicon-based devices, transistors and integrated circuits using GaN-based technology are superior in terms of higher efficiency, reduced weight and lower cost. The key claims which are held valid as mentioned above cover core technologies of the design and the manufacturing process of EPC’s proprietary enhancement-mode GaN-based power semiconductor devices. By virtue of multiple innovations including such technologies, EPC has successfully brought GaN-based power devices from laboratory to market.
In May 2023, EPC filed complaints before the US Federal Court and the US International Trade Commission (ITC), asserting that Innoscience (Zhuhai) Technology Co., Ltd. and its affiliate Innoscience infringed four patents of its foundational patent portfolio, which include the US counterpart of this Chinese patent ZL201080015388.2. As part of the responses to those complaints, Innoscience filed, in September 2023, a request to invalidate the EPC’s Chinese counterpart patent ZL201080015388.2 before the CNIPA.
Pursuant to the Chinese Patent Law, Innoscience may appeal this invalidation decision before the Beijing Intellectual Property Court within three months.
Original – Efficient Power Conversion
-
Axcelis Technologies, Inc. announced a shipment of the Company’s Purion EXE™ SiC high energy implanter as well as a successful Purion H200™ SiC medium energy implanter evaluation closure at leading power device chipmakers located in Japan. The systems will be used for 150mm and 200mm production of silicon carbide power devices supporting automotive, industrial, energy, and other power intensive applications.
Greg Redinbo, Executive Vice President, Marketing and Applications remarked, “The successful evaluation closure of the 200mm Purion H200 SiC system enables it to join an existing 200mm Purion EXE SiC in production at a leading power device customer in Japan.” Dr. Redinbo continued, “The shipment of an additional Purion EXE SiC to a new 150mm customer in Japan highlights growing customer requirements for even higher energy ion implant recipes on advanced SiC power devices, which the Purion Power Series provides.”
President and CEO, Russell Low commented, “We look forward to supporting our growing installed base in Japan and remain focused on expanding our market share by providing customers with the most innovative implant technology and support solutions to ensure their success. The Purion Power Series is the market leader due to its highly differentiated features and process control capabilities that are enabling for power device applications. Axcelis is the only ion implant company that can deliver complete recipe coverage for all power device applications.”
Original – Axcelis Technologies
-
Aehr Test Systems announced it has received an initial customer order for a FOX-NP™ wafer level test and burn-in system, multiple WaferPak™ Contactors, and a FOX WaferPak Aligner to be used for engineering, qualification, and small lot production wafer level test and burn-in of their silicon carbide devices.
The customer is multiple billion dollar per year global semiconductor company with locations across Europe, Asia, and the Americas that serves various industries including automotive, industrial, mobile, and consumer applications. The FOX-NP system, including the FOX WaferPak Aligner and initial WaferPaks, are scheduled to ship over the next few months.
The FOX-NP system is configured with the new Bipolar Voltage Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM) options that enable new advanced test and burn-in capabilities for silicon carbide power semiconductors using Aehr’s proprietary WaferPak full wafer Contactors.
Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are very excited that this new customer selected our FOX-P solution for engineering, qualification, and production of their silicon carbide power devices. After working with the Aehr team and our technology solutions over an extended period of time, they felt secure in our ability to aid them in achieving these goals. A key feature in their selection of our FOX solution is its proven ability to cost-effectively implement their target burn-in and stabilization requirements, including 100% traceability and proof that every device on the wafer is burned in for the needed test duration.
“This customer currently has a wide range of automotive products and is entering the silicon carbide market to address several applications that include automotive, industrial, and electrification infrastructure. Key capabilities of our solution include our ability to scale from engineering and qualification and small lot production with the FOX-NP system to large scale production with the FOX-XP with Automated WaferPak Aligner. They have told us that they plan to transition to our FOX-XP multi-wafer test and burn-in systems for high-volume production. Aehr’s FOX-P technology facilitates a seamless transition from engineering to high-volume production with 100% compatibility between systems.
“This customer sees the enormous opportunity for silicon carbide power devices in industrial and power applications. William Blair forecasts that in addition to the 4.5 million six-inch equivalent wafers that will be needed to meet the demand for electric vehicle related silicon carbide devices in 2030, another 2.8 million wafers are needed to address industrial, solar, electric trains, energy conversion and other applications in 2030. The cost of ownership of our solution proves to be more cost-effective and efficient for these devices than package part burn-in after the die are packaged. This is a strong testimony of the advantage of wafer level burn-in as a better alternative to package part burn-in.
“The FOX family of compatible systems including the FOX-NP and FOX-XP multi-wafer test and burn-in systems and Aehr’s proprietary WaferPak full wafer contactors provide a uniquely cost-effective solution for burning in multiple wafers of devices at a single time to remove early life failures of silicon carbide devices, which is critical to meeting the initial quality and long-term reliability of the automotive, industrial, and electrification infrastructure industry needs.”
The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
Original – Aehr Test Systems
