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In a significant advancement for the high-voltage power electronics industry, Maspower Semiconductor has introduced the MS2N300HGC0 MOSFET, a powerful new component that sets new benchmarks in performance and reliability.
This cutting-edge product, housed in the TO-247 package, offers unprecedented performance with its robust 3000V voltage rating and 2A continuous current capability. What truly sets this MOSFET apart, however, is its rigorous testing and certification. The MS2N300HGC0 has undergone 100% avalanche testing, ensuring exceptional resilience and durability in demanding applications.
Moreover, the MS2N300HGC0’s Fast Intrinsic Diode design and minimized gate charge contribute to its high-speed switching capabilities, making it a perfect fit for high-voltage power supplies, PV inverters, switching applications and more. Its very low intrinsic capacitance further enhance its performance, delivering maximum efficiency and reliability. Maspower’s commitment to innovation and reliability is evident in the MS2N300HGC0, which has been rigorously tested and certified to meet the highest industry standards.
“The MS2N300HGC0 is a testament to our commitment to pushing the boundaries of high-voltage power electronics,” said a spokesperson from Maspower. “We are proud to offer this state-of-the-art MOSFET to our customers, enabling them to achieve unprecedented levels of performance and reliability in their applications.”
Original – Maspower Semiconductor
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At PCIM Europe 2024, Infineon Technologies AG will showcase how its latest semiconductor, software, and tooling solutions provide answers to today’s green and digital transformation challenges. Under the motto “Driving decarbonization and digitalization. Together.”, Infineon will demonstrate the industry’s broadest power electronics portfolio covering all relevant power technologies in silicon (Si), silicon carbide (SiC), and gallium nitride (GaN).
The company will be exhibiting in a larger area this year, with the main booth #740 in Hall 7 demonstrating innovative Si and SiC-based solutions, while the adjacent booth #169 is dedicated to the broad GaN portfolio. Alternatively, visitors can also register for Infineon’s digital event platform.
Infineon’s PCIM 2024 highlights
The products, demonstrations, and design aids on display illustrate how Infineon’s product-to-system expertise in power management enables engineers to balance operational specifications with application requirements. Demonstrations will include solutions from the following areas:
- Wide-bandgap technologies: Wide-bandgap materials are revolutionizing power electronics and various applications that are driving the green and digital transformation. Infineon will demonstrate the CoolSiC™ MOSFETs 650 V and 1200 V Generation 2, which can be used to improve overall energy efficiency. Additionally, the expanded portfolio of GaN solutions will be showcased, offering a wide range of innovative packages, discrete and integrated solutions.
- Renewables, energy storage and HVDC: With its power solutions, Infineon enables the most climate-friendly forms of energy generation from wind and solar accompanied by efficient storage systems. At PCIM, the company will present a wide range of solutions for single-phase and three-phase hybrid solar inverters as well as its In-Field Power Analytics Service helping to maximize converter uptime and optimize operation in real-time.
- Industrial automation, motor drives and control: With advanced power semiconductors, Infineon is paving the way for highly reliable and energy-efficient electric motors and drive solutions in smart factories. This is achieved through a combination of efficient energy management and intelligent motor control solutions, advanced sensor functions, and reliable connectivity components. Furthermore, the company is presenting its growing range of solid-state relays and circuit breakers as well as a stack assembly solution for high-end Press Pack IGBTs.
- Information and communication technologies: True to the motto “We power AI”, Infineon exhibits innovative technologies that make it possible to meet increasing energy demands while promoting greener AI and paving the way for more efficient AI servers. This includes two-phase power supply modules, integrated point-of-load solutions, and converters. In addition, the company will showcase cutting-edge solutions, including Si, SiC, and GaN power switches, that meet the evolving needs of server technology and telecoms networks, driving efficiency, reliability, and innovation across all industries.
- eMobility, eTransportation and charging solutions: With leading power supply solutions for traction inverters, on-board chargers, DC-DC converters, and battery management systems, Infineon supports the efforts of developers and manufacturers, enabling the rapid expansion of eMobility, eTransportation, eCAV, and the corresponding charging infrastructure. Highlights presented in this area include traction inverters with fusion, single-side cooling and discrete concepts, traction inverter systems for commercial vehicles and rail transport, as well as high power fast charging solutions.
- Smart and connected homes: Infineon’s leading technology portfolio of customized, ready-to-use solutions assists manufacturers in developing innovative system designs for homes that meet the growing demand for smart, connected, and energy-efficient living solutions. Highlights in this area include USB-C charging solutions, portable battery-powered welding solutions, residential heat pumps, as well as air conditioning systems.
Infineon will also contribute to the PCIM conference program and the various forums, including a keynote by Dr. Gerald Deboy, Fellow at Infineon, on the “Challenges and Solutions to Power Latest Processor Generations for Hyper Scale Data Centers” on June 13 at 8:45 am. An overview of all contributions by Infineon experts is available at www.infineon.com/pcim.
Original – Infineon Technologies
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Toshiba Electronics Europe GmbH and Toshiba Materials CO., LTD. will bring solutions that support customers’ goals in reducing their CO2 footprint at the PCIM 2024 conference and exhibition (Nuremberg 11th – 13th June).
This year, the company will use the event to showcase a combination of several business units that support development of sustainable solutions. Semiconductor, battery, and fine ceramic material solutions form a complete chain of products in key applications from e-mobility, industrial, energy and infrastructure sectors.
Toshiba has manufactured top-class ceramics since the 1970s, and its pioneering Silicon Nitride substrates will be on display along with bearing balls, AMOBEADS™, and Nanocrystalline common mode choke cores.
In Toshiba’s eMobility booth area, visitors will discover demonstrations of automotive thermal management by heat pumps and fans utilising Toshiba’s newly released SmartMCD.
Toshiba’s industrial demonstrations highlight the entire product chain from control to isolation to power conversion stages, incorporating the latest generations of SiC, GaN and low-voltage MOSFET technologies. They include reference design implementations utilising modern topologies for factory automation, power supplies, and motor control applications.
Energy and infrastructure demonstrations will focus on high-power solutions such as IEGT and SiC Modules supporting voltages from 1.2kV to 3.3kV. Toshiba’s SiC Cube illustrates a solution implementation for charging infrastructure utilising SiC MOSFET devices, whereas SCiB batteries demonstrate their effective use for energy storage.
Toshiba representatives are also scheduled to participate in the conference program speeches and poster sessions on Wide Bandgap, power semiconductors and gate driver ICs topics.
Original – Toshiba
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WeEn Semiconductors will be exhibiting the company’s latest highly efficient, high-power density silicon carbide (SiC) technologies, automotive grade power devices and highly reliable IGBTs at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.
Established in 1979, PCIM Europe serves as a premier platform for showcasing the latest advancements in power electronics technologies and applications. This year, in Hall 9, booth 538, under the theme of ‘Power Efficiency for a Cooler Planet,’ WeEn Semiconductors will exhibit its extensive range of high-voltage 1700V SiC power modules, SiC 1200V/750V MOSFETs, Thyristors, power diodes, silicon-controlled rectifiers (SCRs), IGBTs, and other advanced power devices tailored for the renewable energy and e-mobility industries.
With a focus on efficiency, sustainability and cost reduction, WeEn’s broad portfolio offers best-in-class performance, efficiency and density for demanding applications including solar and wind power storage, electric vehicle (EV) fast chargers and traction inverters, HVAC and datacenter servers.
“At WeEn, we are dedicated to developing cost-effective power control technologies that support high voltage ratings and efficient, high-performance operation,” remarked WeEn Semiconductors CEO, Markus Mosen. “We’re excited to showcase the solutions we’ve launched in recent months at PCIM, not least those technologies targeted at renewable energy and electric mobility applications that demonstrate our commitment to products that not only meet but exceed the unique demands of every application while contributing to environmental sustainability.”
PCIM 2024 highlights
- At PCIM, WeEn is set to introduce a range of SiC MOSFETs and SiC Schottky Barrier Diodes (SBDs) in TSPAK packages for EV charging, On Board Charger (OBC), PV inverters, and high power density PSU applications. The new MOSFETs are available in 650V, 750V, 1200V, and 1700V variants, with resistance ranging from 20mΩ to 150mΩ. The current range for the new SiC SBDs is 10 to 40A in 650V, 750V, and 1200V variants.
- A range of SiC power modules in half-bridge, four-pack, six-pack, dual booster, and NPC 3L topologies will also be on display. Target markets for these SiC modules include EV charging, energy storage systems, motor drivers, industrial power supply units (PSUs), test instruments, and PV inverters.
- 1700V SiC series and 1200V / 750V auto-grade SiC MOSFETs, which encompass a diverse range of packaging options and product configurations, including surface-mount device (SMD) discrete components and top-side cooling.
- Highly reliable thyristor/diode modules, suitable for mainstream industrial applications like UPS, Inverter, soft starter, with VDRM up to 1600V and IT(RMS) up to 250A . Thanks for its planar chip technology and state-of-art module manufacture capability, those modules can be in half-bridge, parallel or antiparallel or other customized topology, it has passed 1000 hours reliability test under JEDEC standard as well 100% Pb-Free for the highest level EU RoHS compliance.
- WeEn’s product platforms include Super Junction MOSFETs with breakdown voltage ranges of 600V, 650V, and 800V. Leveraging advanced 8-inch wafer technology, WeEn offers a wide range of trench MOSFETs with voltage ranges from 20V to 30V.
- With voltage ratings from 45V to 2000V, WeEn’s Power Diodes feature current ratings from 1A to 100A. The company’s product portfolio includes low VF Schottky rectifiers, standard diodes, and ultrafast recovery rectifiers.
- WeEn’s range of IGBTs boasts extremely low leakage currents and exceptional conduction and switching characteristics at both high and low junction temperatures. They have undergone high voltage H3TRB and 100%-biased HTRB tests with a maximum junction temperature of 175°C safely. These application-specific IGBTs have been tuned to match the precise needs of each application, including switching behaviors, conduction losses, short circuit capabilities, environmental ruggedness, and freewheeling diode characterization. The 1200V and 650V variant current products, including bare dies, discrete components, and PIMs, are offered to various end customers.
Original – WeEn Semiconductors
