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Infineon Technologies AG introduced the 600 V CoolMOS™ S7TA Superjunction MOSFET for automotive power management applications. Designed to meet the specific requirements of automotive electronics, the S7TA features an integrated temperature sensor that significantly improves the accuracy of junction temperature sensing, building on the advances made by its counterpart for industrial applications (CoolMOS S7T). The resulting benefits include improved durability, safety, and efficiency, all of which are essential in the automotive domain.
Like its industrial counterpart, the automotive-graded CoolMOS S7TA is particularly well suited for solid-state relay (SSR) applications, demonstrating superior R DS(on) and sensing accuracy, which is crucial for various automotive electronic devices that rely on efficient power management solutions. The integration of a Superjunction MOSFET with an embedded temperature sensor in the same package enhances the performance of SSRs and ensures dependable operation even under the most severe overload conditions, which is an absolute necessity for automotive applications where reliability is non-negotiable.
The embedded sensor of the S7TA offers a 40 percent increase in accuracy and up to four times faster response time than standalone on-board sensors. Such advances in temperature monitoring are critical for automotive applications, enabling individual monitoring within multi-device systems, thereby improving reliability, and preventing thermal issues that can lead to system failures.
The optimized power transistor utilization of the CoolMOS S7TA promises not only superior performance, but also precise control of the output stage. This level of precision is key to reducing power consumption and energy costs, which is a pressing concern in automotive applications where efficiency translates directly into vehicle range and operational economy. Compared to traditional electromechanical relays, the CoolMOS S7TA offers a significant improvement in total power dissipation.
The CoolMOS S7TA further provides a high overcurrent threshold, which serves to increase the reliability of the SSR and reduce the likelihood of failures. The robust switching solution paves the way for safer operations within the vehicle, and the enhanced robustness of the MOSFETs leads to a longer automotive relay lifecycle, resulting in lower maintenance and replacement costs.
The 600 V CoolMOS S7TA provides an optimized solution for potential applications that are central to the safety and functionality of modern vehicles. These include critical components such as circuit breakers, encompassing high-voltage battery disconnect switches, low-frequency switches for both direct current (DC) and alternating current (AC), as well as high-voltage electronic fuses (HV eFuses).
Infineon also introduces the EVAL_eFuse_PoC_400V_S7, a proof-of-concept board that showcases the robustness and versatility of an automotive eFuse. The board demonstrates a reliable method for safeguarding automotive electrical systems, featuring an interchangeable power stage that adapts to various operating conditions with different voltage classes and cooling methods.
Both the 600 V CoolMOS S7T in automotive and industrial grades are already available and come in QDPAK TSC and BSC packages, offering a range of R DS(on) from 17 to 40 mΩ. The 10 mΩ variant will be added to the lineup in the second half of 2024. Further information is available at www.infineon.com/s7ta and www.infineon.com/s7t.
Original – Infineon Technologies
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Wolfspeed is expanding its portfolio of industry-leading SiC MOSFET & Schottky diode discrete products with the addition of the new Top Side Cooled (TSC) package: the U2. With options ranging from 650 V – 1200 V, Wolfspeed’s TSC products significantly increase system level power density and efficiency, while improving thermal management and board layout flexibility.
Applications:
- Electric Vehicle (EV) On-Board Chargers and Fast Charging Infrastructure
- EV & Industrial HVAC (Heating, Ventilation, and Air Conditioning) Motor Drives
- High Voltage DC/DC Converters
- Solar and Energy Storage
- Industrial Motor Drives
- Industrial Power Supplies
Features:
- Low profile, surface mount footprint
- Top side cooling with low Rth
- AEC-Q101 Automotive Qualified Options
- SiC MOSFETs Available from 750 V – 1200 V
- SiC Schottky Diodes Available from 650 V – 1200 V
Benefits:
- Highest Creepage Distance Available for SiC Top Side Cooled Packages
- Higher System Power Density with Optimized PCB Layouts
- High Volume Manufacturing Capability with Surface Mount Footprint
What’s New? Advantages of New Top Side Cooled Packages
Most standard surface mount discrete power semiconductors remove heat through the bottom of the device by making direct contact with the power circuit board (PCB), which utilizes a heat sink or cooling plate attached underneath. This method is common across many different power electronics applications, particularly when size and weight requirements do not limit PCB mounting and heat sinks.
Top side cooled (TSC) devices, on the other hand, dissipate heat through the top side of the package. Inside TSC packages, the die sits upside down in the upper portion of the package to allow heat to flow directly to the top surface. Generally, TSC devices are best suited for high-performance applications such as automotive and e-mobility systems where high-power densities, advanced thermal management solutions, and small footprints are essential. Within these applications, TSC devices help address cooling requirements by enabling maximum power dissipation and optimizing thermal performance.
TSC designs also allow for dual-side usage of the PCB since the bottom board surface is no longer needed for the heatsink interface. Removing the heatsink from the thermal path not only creates an improved overall system thermal impedance; it also allows for automated assembly, which can increase manufacturing throughput for a more efficient and cost-effective solution.
Evaluating U2 TSC Devices Made Easy with SpeedVal™ Kit
Wolfspeed’s SpeedVal Kit Modular Evaluation Platform allows engineers to reduce the transition from silicon to silicon carbide (SiC) with a flexible set of building blocks for in-circuit evaluation of system performance at real operating points. The recently released 3-phase motherboard enables high-power testing with static loads as well as a foundation for advanced motor control firmware development.
Evaluation boards for a variety of Rdson ratings for Wolfspeed’s TSC MOSFET devices are coming soon.
SpeedVal™ Kit Modular Evaluation Platform Three-Phase Motherboard Putting U2 TSC Devices to Work: 13 kW Automotive HVAC Motor Drive Reference Design
Wolfspeed’s upcoming 13 kW motor drive reference design, featuring the TSC U2 package, demonstrates the benefits of U2 devices for 10 kW+ EV HVAC systems, which support thermal management of the cabin, battery, and electronics. Optimizing the efficiency and operating temperature range of the HVAC system with the implementation of SiC enables systems designers to bring fast charging to the driver in under 15 minutes, while also extending the driving range per charge for the lifetime of the car. Utilizing Wolfspeed’s new CRD-13DA12N-U2 13 kW HVAC reference design, SiC enables:
Reference Design Specifications:
- Input Voltage: 550 – 850 V
- Max Output Current: 25 A
- Max Output Power: 13 kW
- Switching Frequency: 10 – 32 kHz
- Peak Efficiency: > 98%
Original – Wolfspeed
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Vincotech is returning to PCIM, the world’s leading power electronics expo and conference to showcase its latest technologies and innovations, including GaN and many more products for Motion Control, Renewable and Power Supply use cases. In keeping with this year’s expo slogan “Empowering your ideas,” the company’s application-specific capabilities will be on prominent display.
Highly anticipated, PCIM Europe event is sure to draw thousands of visitors, and Vincotech is thrilled to be back. “Our fair booth will feature all kinds of new tech, and we can’t wait to show customers and prospects how our solutions benefit their business. Hot topics, innovations, donations – expect all that and more”, says Edoardo Guiotto, VP Sales and Marketing.
This year’s big talking point is the company’s commitment to application-specific solutions enabled by a wide range of industrystandard and proprietary housings, multi-source chipsets, expedited time-to-market, and early sample availability. Highlights include a solution for SEW-EURODRIVE, showcased with a station displayed at the booth.
- One spotlight will be on GaN, a cutting-edge technology that has the industry abuzz. Vincotech, which is driving advances on this front, is going to demonstrate the potential, benefits, and applications of GaN in power modules.
- Innovations in motor control applications will also figure prominently. Reliability and performance packed into a small footprint – that’s what sophisticated motor control use cases need. Highly integrated and engineered to support complex electrical and thermal designs, Vincotech’s embedded drive solutions meet these demands. For Industrial drives the tandem diode solutions are available for SixPack, Twin SixPack and PIM topologies including custom and industry standard power module housings.
- Renewables are on the rise. Built on decades of experience in solar, Vincotech’s extensive portfolio of PV & ESS solutions is second to none. Residential, industrial, commercial – every use case and power range is well-covered.
- Leading the way in power supply, Vincotech offers outstanding power module solutions. Highlights in DC fast charging include a built-to-boost 3-phase resonant converter, the fastPACK 1 GaN 2-in-1 featuring advanced Wide Bandgap (WBG) tech, and many ultra-compact, integrated solutions and low inductive modules. Enhancing the performance of Uninterruptible Power Supplies (UPS), Vincotech has a wide range of solutions from 20 kW – 250 kW power.
Like in previous years, Vincotech teams up with Plan International Germany, bringing an exciting VR experience to the event. Visitors can challenge themselves by flying over the mountains in virtual reality, while knowing their participation supports a greater good. Vincotech will match all flights with a donation, targeting a Plan International project for teenagers in Ecuador.
Vincotech’s PCIM presentations at a glance:
Tuesday, June 11
11:15 Exhibitor forum
David Chilachava: NEW fastPACK 1 GaN – The Best Utilization of GaN Technology Benefits in an Industrial Power Module PackageWednesday, June 12
11:20 Bodo’s panel discussion on “SiC Wide Bandgap Design, the Future of Power”)
Evangelos Theodossiu: SiC power module design: Why does it matter?
14:30 Conference, Room: München 2
A joint presentation with Siemens: Optimizing a Power Module for Electrical and Thermal Performance and Symmetry Using EDA ToolsThursday June 13
11:15 Conference poster sessions
Tiago Jappe: Power Module Solutions with Improved Reliability for Elevator Drive Applications
14:35 Exhibitor forum
Matthias Tauer: flow E3 Full SiC Power Module with Direct Pressed Substrate for Superior Thermal Performance and ReliabilityOriginal – Vincotech
