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In the current rapidly evolving electronics industry, there is an increasing demand for high-performance MOSFETs. With its superior specifications and robust design, the MS2N350HGC0 MOSFET stands out as an innovative solution for a wide range of high-voltage applications.
The MS2N350HGC0 MOSFET has been designed to meet the rigorous specifications of contemporary electronics, offering an unparalleled combination of features and performance. This MOSFET is the ideal choice for high-voltage power supplies, capacitor discharge, pulse circuits and laser and X-ray generation systems. With a maximum drain-source voltage of 3500V and a continuous drain current of 2A, it is capable of withstanding the high voltage applications on the market.
One of the standout features of the MS2N350HGC0 is its rapid intrinsic diode and minimized gate charge.. This enables the device to operate at high speeds, which is crucial for applications that necessitate rapid response times. Moreover, the MOSFET exhibits exceedingly low intrinsic capacitances, which further enhances its performance in demanding applications.
The MS2N350HGC0’s on-state resistance (Rds) of 19Ω further enhances its performance, allowing for efficient energy transfer and minimal heat generation. This makes it an excellent choice for power supplies and other applications where efficiency and reliability are paramount.
The product is packaged in accordance with the industry standard TO-247, thereby ensuring compatibility with a wide range of existing systems. Its compact size and lightweight design facilitate integration into any application.
The MOSFET’s electrical ratings are noteworthy for their impressive nature. This product is capable of withstanding a continuous drain current of 2A at 25°C and 1.6A at 100°C, with a pulsed drain current of up to 6A. This makes it suitable for even the most demanding applications. Furthermore, its total dissipation of 463 watts at 25°C guarantees reliable operation even under heavy load conditions.
The MS2N350HGC0 also offers excellent avalanche and thermal performance. It has an avalanche current of 1.3A and can withstand a single pulse avalanche energy of 81mJ. The operating junction temperature ranges from -55°C to 150°C, ensuring stable performance even in extreme environments.
For ease of installation, the MS2N350HGC0 has a maximum lead temperature for soldering purposes of 300°C and a mounting torque of 1.13N·m. This ensures that the MOSFET can be securely mounted into any system with minimal effort.
In conclusion, the MS2N350HGC0 MOSFET is a powerful and reliable solution for high-voltage applications. The superior performance, compact design, and excellent thermal stability of the product make it the optimal choice for a diverse range of applications. To gain further insight into this innovative new product, we invite you to contact our sales team. We encourage you to explore the potential of the MS2N350HGC0 MOSFET and discover how it can revolutionize your high-voltage applications.
Original – Maspower Semiconductor
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As the deployment of Energy Storage Systems (ESS) accelerates, there is a critical need for compact and high-efficiency Power Conversion Systems (PCS) optimized for ESS applications. To address this requirement, Semikron Danfoss K.K. and Headspring Inc. have joined forces to develop advanced PCS solutions specifically for ESS, targeting mass production by 2026. This collaboration aims to enable more efficient and space-saving storage solutions.
Energy Storage Systems are essential components for renewable energy and power grids, ensuring resilience and stable supply. The global ESS market is projected to grow by 20%-30% annually, with expectations to exceed 400 GWh of storage systems worldwide by 2030. This exponential growth is driven by the increasing share of renewable energy in the grid, necessitating the accelerated deployment of ESS solutions for stable grid operation.
To address this rapidly growing market, Semikron Danfoss is developing a series of adaptable power solutions. Central to this initiative is the ANPC (Active Neutral Point Clamping) topology for ESS, which demonstrates a significant performance improvement by reducing power loss by over 50% compared to traditional NPC/MLI topologies. However, to fully harness the potential of ANPC technology, collaboration with Headspring is crucial. Headspring’s expertise in high-speed controller technology is vital for effectively controlling ANPC systems and ensuring optimal performance.
Semikron Danfoss brings extensive expertise and innovation in power electronics to the ESS market. Their ANPC technology in LF/HF configuration, featuring a hybrid circuit of silicon IGBTs and silicon carbide MOSFETs, significantly enhances efficiency and cost performance. The availability of ANPC power modules in PCB-mountable, industry-standard housings reduces both material and assembly costs, making them ideal for high-volume production.
The ANPC power modules provided by the SEMITOP E2 platform offer superior thermal performance, contributing to the downsizing and high-capacity PCS for ESS. Semikron Danfoss aims to set new benchmarks in ESS performance and value with their comprehensive design package that supports improvements in both hardware and software.
Headspring excels in developing high-speed real-time controllers essential for power electronics applications. Headspring’s controllers combine commercial microcontrollers with FPGA technology, providing flexible programming tailored to the specific demands of power electronics applications. Headspring has participated in the Strategic Innovation Promotion Program (SIP) “Energy Systems for an IoT Society by Japan’s Cabinet Office,” leading the development of ultra-high-speed controllers for power electronics. These controllers, integrating high-speed multi-core CPUs, high-performance FPGAs, and high-speed AD converters, achieve a feedback control performance of 50MHz, approximately 1000 times faster than conventional systems.
Semikron Danfoss and Headspring are collaborating to develop a compact, high-efficiency PCS tailored for large-scale, scalable ESS applications by integrating Semikron Danfoss’s ANPC technology-based power modules with Headspring’s advanced controller technology. Semikron Danfoss will offer the expertise for developing the power stack, which includes power modules, drive circuits, and coolers, while Headspring will be responsible for the controllers, peripheral circuits, software, and PCS integration.
This synergy aims to create an ESS-specific PCS with optimized cost, efficiency, and size. A primary goal is to enable containerized ESS solutions to increase storage capacity per 20-foot container from 3.3MWh to 5MWh. This will establish a roadmap setting hardware and software benchmarks for ESS performance, delivering superior ESS solutions that promote the advancement of renewable energy technologies.
Original – Semikron Danfoss
