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As part of a so-called Joint Lab at Fraunhofer IISB, AIXTRON SE operates equipment, works on process development for SiC epitaxy and runs a demo center for its customers. Joint Labs like this are a great opportunity for companies to collaborate with Fraunhofer IISB in an industry-compatible laboratory environment.
For the epitaxy Joint Lab, the awarded IISB team ensures the continuous fault-free operation of already 5 state-of-the-art G10 SiC reactors, and enables the installation of new systems with minimal downtime. By setting up automated metrology and by optimizing wafer logistics, workflows and data management, the team has also established a modern wafer characterization facility at the IISB with a fast feedback loop for AIXTRON.
Fraunhofer IISB is thrilled for its colleagues Rainer Apelt, Nino Fröbisch and Katharina Roßhirt-Lilla from the SiC Epitaxy Group of the Materials Department together with Christian Heilmann, Rainer Schönweiß and Christopher Torscher from the Infrastructure Group within the Central Services Department. Such outstanding results are the base for the success of the Joint Labs model at Fraunhofer IISB.
Original – Fraunhofer IISB
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Nexperia released 650V ultra- and hyperfast recovery rectifiers in D2PAK Real-2-Pin (R2P) packaging for use in various automotive, industrial and consumer applications including charging adapters, photovoltaic (PV), inverters, servers and switched mode power supplies (SMPS).
Combining planar die technology with a state-of-the-art junction termination (JTE) design, these rectifiers offer high power density, fast switching times with soft recovery and excellent reliability. They are encapsulated in a D2PAK Real-2-Pin Package (SOT8018), which offers the same package outline as the standard D2PAK package but has only two pins instead of three (the middle cathode pin has been removed). This increases the pin-to-pin distance from 1.25mm to over 4mm, which allows to meet the creepage and clearance requirements stated in the IEC 60664 standard.
“These recovery rectifiers further demonstrate Nexperia’s expertise in the field of semiconductor device packaging” according to Frank Matschullat, Head of Product Group Power Bipolar Discretes at Nexperia. “By taking the innovative step of removing the cathode pin from a standard D2PAK package, Nexperia has created a Real-2-Pin package that can meet the creepage and clearance requirements, in particular for high voltage automotive applications.”
Original – Nexperia
