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In a recent evaluation conducted by a renowned automotive device packaging OEM, MPP’s Heavy Wire Wedge (HWW) for 12-mil wire delivered exceptional results in boosting Mean Time Between Assists (MTBA) and enhancing overall productivity. Previously, the customer had to clean the aluminum buildup from the bonding tool every 20,000 to 30,000 bonds, which disrupted operations and impacted efficiency.
To address this issue, Micro Point Pro (MPP) provided a wedge with a specialized tip coating, tailored to enhance bonding performance. This upgrade allowed the customer to achieve over 700,000 consecutive bonds—an improvement of more than 25 times the previous process—while maintaining high bond quality.
Moreover, the need for frequent cleaning and wedge replacement was eliminated, resulting in substantial reductions in manufacturing resources and a significant boost in productivity. This, in turn, led to overall cost savings.
Key Benefits:
- Drastically increased MTBA (Mean Time Between Assists)
- Significant improvement in productivity
- Lower cost per bond achieved
- Seamless integration with the existing bonding process (“drop-in” replacement)
Original – Micro Point Pro
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EPC will participate in PCIM Asia 2024. The event will take place from August 28-30 in Shenzhen, China. Attendees are invited to visit EPC at Hall 11, Stand F01 to explore the industry’s most comprehensive portfolio of GaN power conversion solutions.
See How GaN is Powering the Future
GaN power semiconductors are used in fast-charging applications for consumer electronics, aerospace and defense applications, satellites, high density AI servers, drones, robots, autonomous vehicles, telecommunications equipment and medical electronics, among other innovative technologies.
- AI servers, critical for processing vast amounts of data in real-time, require power-efficient and high-speed electronics that GaN technology can deliver.
- Humanoid robotics require lightweight, compact, and highly responsive components. GaN enables more agile and intelligent robots that can perform complex tasks with greater precision.
- The shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) requires power solutions that are not only highly efficient but also capable of handling the increased power demands. GaN’s superior efficiency, compactness, and thermal performance make it the ideal choice for powering the future of transportation.
EPC is uniquely positioned to support these markets with its pioneering GaN technology. EPC’s innovative solutions not only offer superior performance but also drive advancements in these critical sectors, enabling businesses to realize their full potential in a rapidly evolving technological landscape.
Visit EPC at PCIM Asia to discover how EPC’s GaN technology can power your next breakthrough—stop by the booth to explore our latest innovations and speak with our experts.
Explore Booth (Hall 11, Stand F01)
At the EPC booth, visitors will experience firsthand how GaN FETs and ICs enable higher efficiency, smaller size and weight, and lower costs in applications such as DC-DC converters for high power density AI servers, motor drives for eMobility, robotics, and drones, and more.
- Use the Interactive Wall of GaN to select the ideal GaN FET or IC for your application
- Connect with EPC’s team of experts to gain insight into the ‘GaN First Time Right™ Design Process. Attendees will gain valuable knowledge and tools to enhance their projects and drive efficiency to new levels.
- Meet the Robots: “Chip”, the robot dog, and his robotic friends demonstrate GaN-based DC-DC, lidar, and motor drive solutions for advanced robotics.
Schedule a Meeting: Learn from GaN Experts and discover strategies to optimize your power systems. To schedule a meeting during PCIM Asia contact renee.yawger@epc-co.com
Conference Sessions: Attend technical sessions to gain insights from industry leaders into the latest trends and advancements in GaN power conversion technology.
- The Future of Untethered Robotics: GaN-Powered Solutions for Mobility, AI, and Machine Vision
Presenter: Alex Lidow, Ph.D. - Comprehensive Board Level Temperature Cycling Lifetime Projection of WLCSP GaN Power Devices
Presenter: Shengke Zhang, Ph.D. - Comparison of Board-side and Back-side Thermal Management Techniques for eGAN® FETs in a Half-Bridge Configuration
Presenter: Adolfo Herrera, Ph.D. - Validating Duty Cycle-Based Repetitive Gate and Drain Transient Overvoltage Specifications for GaN HEMTsHost: Bodo’s Power Systems
Presenter: Shengke Zhang, Ph.D.
“We are thrilled to participate in PCIM Asia and showcase our cutting-edge GaN technology”, said Nick Cataldo, VP of Sales and Marketing at EPC. “We look forward to demonstrating how our solutions are transforming industries by enabling higher efficiency, smaller size, and lower costs.”
Original – Efficient Power Conversion
