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At the upcoming electronica trade show in Munich, Infineon Technologies AG will illustrate how its innovative solutions are driving the global trends of decarbonization and digitalization. The company will show how its semiconductors are paving the way to a net-zero economy and to unlocking the full potential of artificial intelligence (AI). From 12 to 15 November at booth 502 in hall C3, Infineon will present highlights from its extensive portfolio and offer the opportunity to talk to its experts.
“Decarbonization and digitalization are the key drivers on the way to a climate-neutral future,” said Andreas Urschitz, Member of the Board and Chief Marketing Officer at Infineon. “Semiconductors contribute in many ways to the green and digital transformation and are at the heart of every connected application. At electronica, we’ll be showcasing how our leading technologies and innovative solutions are helping master the central challenges of our time.”
World’s first 300 mm gallium nitride wafers
Infineon will present its technological breakthrough, the world’s first 300 mm power gallium nitride (GaN) wafer technology, to the general public for the first time. This technological milestone will significantly advance the market for GaN-based power semiconductors. Leveraging 300 mm GaN will strengthen existing solutions and application fields and create new ones, with an increasingly cost-effective value proposition and the ability to address the full range of customer systems.
Shaping the future of mobility
Infineon is focused on the development of innovative solutions that drive the transition to clean, safe and intelligent mobility. Products and solutions on display at electronica include the new AURIX™ TC4x microcontrollers, which support the implementation of future-proof E/E architectures and software-defined vehicles, as well as the main inverter CoolSiC™ Kit, battery management system solutions, on-board chargers with GaN, steer-by-wire system solutions and H 2 sensors for fuel cell applications.
Greener and smarter buildings and homes
Semiconductors play a crucial role in the development of smarter and more sustainable living spaces. Infineon’s advanced technologies based on silicon carbide (SiC) and GaN enable maximum energy efficiency and reliability for energy generation and consumption.
With advanced sensors, power semiconductors, security solutions such as OPTIGA™ Trust and microcontrollers such as PSOC™ Control, Infineon enables the efficient use of green energy while bringing smart automation to modern homes and commercial buildings. The company’s booth will showcase comprehensive system solutions including various solar inverter topologies (micro-inverters and string inverters), as well as demos for optimizing power and boosting heat pump output.
Enabling AI – Efficient, reliable and on the edge
Semiconductors also play a crucial role in unlocking the full potential of AI. Infineon’s solutions make it possible for customers to deploy new AI applications quickly, efficiently and at scale. The company’s broad range of products, software, tools and services enables energy-efficient data centers, smarter devices and optimized AI edge applications. Demos will include high-performance, low-power AI-enabled microcontrollers from the PSOC family, advanced sensors from the XENSIV™ portfolio as well as vertical power module architectures, advanced liquid cooling modules and power supply units for AI data centers.
Visitors who are unable to attend the live show can register here for Infineon’s digital event platform, which will be available 24/7.
More information about Infineon’s show highlights is available at www.infineon.com/electronica.
Original – Infineon Technologies
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Navitas Semiconductor announced it will preview several breakthroughs at electronica 2024 (Hall C 3, booth 129, November 12th– 15th).
Aligned with the mission to ‘Electrify our World™’, the “Planet Navitas” booth invites visitors to discover how next-gen GaN and SiC technology enable the latest solutions for AI data centers, EV transportation, renewable energy, industrial drives, and consumer appliances. Each example highlights end-user benefits such as higher power density, increased efficiency, longer range, faster charging, portability, and grid independence, along with a focus on how low-carbon-footprint GaN and SiC technology can save over 6 Gtons/yr CO2 by 2050.
Major technology updates include the world’s first 8.5 kW power supply for AI and hyperscale data centers, using high-power GaNSafe power ICs and Gen-3 Fast SiC MOSFETs.
Enabled by over 20 years of SiC innovation leadership, GeneSiC technology offers world leading performance over temperature to provide cool-running, fast-switching SiC MOSFETs to support up to 3x more powerful AI data centers and faster charging EVs.
The Gen-3 Fast GeneSiC MOSFETs are developed using a proprietary ‘trench-assisted planar’ technology offering leading performance, while also providing superior robustness, manufacturability and cost than competition. Gen-3 Fast MOSFETs deliver high-efficiency with high-speed performance, enabling up to 25°C lower case temperature, and up to 3x longer life than SiC products from other vendors.
Also on display will be the company’s latest development of GaNSense™ Motor Drives ICs for home appliance and industrial, 650V bi-directional GaN demonstrator for next generation, highest efficiency and power density solutions, as well as newly released SiCPAK™ modules for high-power markets such as power grid, renewables, EV charging, and UPS.
In addition to the exhibition, the company’s Llew Vaughan-Edmunds will take part in the EETimes panel debate ‘SiC & GaN Technologies – Exploring Advancements, Addressing Challenges’ (November 12th, 2:20 pm local time). This debate will examine both recent and upcoming advances that will increase wide bandgap technologies’ share of the legacy silicon power IC market, which has been valued at $22bn/yr. The analyst house Yole Group predicts GaN and SiC products will make up 30% share of the power semi market by 2027.
electronica 2024 takes place at Trade Fair Center Messe München, Am Messesee 2, 81829 Munich, from November 12th – 15th. “Planet Navitas” is featured in Hall C3, booth #129.
Original – Navitas Semiconductor
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onsemi announced results for the third quarter of 2024 with the following highlights:
- Revenue of $1,761.9 million
- GAAP gross margin and non-GAAP gross margin of 45.4% and 45.5%, respectively
- GAAP operating margin and non-GAAP operating margin of 25.3% and 28.2%, respectively
- GAAP diluted earnings per share and non-GAAP diluted earnings per share of $0.93 and $0.99, respectively
- Returned 75% of free cash flow over the last 12 months to shareholders through stock repurchases
“With third-quarter results above expectations, we remain focused on delivering consistent results in the current environment through execution and prudent financial management,” said Hassane El-Khoury, president and CEO, onsemi.
“As power demands continue to rise across our key markets, and the need for greater efficiency becomes paramount, we are investing to win across the entire power spectrum to ensure that onsemi is best positioned to gain share in automotive, industrial and AI data center.”
Original – onsemi
