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MCC Semi announced a global distribution agreement with Farnell, an innovative distributor and technology leader.
Highly regarded by the engineering industry, Farnell grew from serving the UK market to a leading global technology platform. Farnell’s element14 Community is where great minds in electronics find resources, discussions, and more to help solve design challenges. MCC Semi team is proud to join this community alongside engineers, designers, and purchasing professionals who are passionate about the future of power electronics.
By partnering with Farnell, MCC is expanding its presence in growing markets throughout the world. Now, MCC can provide many benefits of working with the company to a broader customer base, including:
- Supply chain assurance thanks to integrated device manufacturer model
- Exceptional support with local expertise and deep industry knowledge
- 10,000+ top-notch products (25% AEC-Q101 qualified) in a broad range of categories, package types, and technologies
- Ongoing research & development that enables innovation
- Competitive lead times and pricing to maintain an edge
Combining MCC’s expertise with Farnell’s global reach and innovation represents a significant step forward in delivering high-quality solutions to the customers.
Original – Micro Commercial Components
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Wolfspeed, Inc. has received $192.1 million in cash tax refunds from the advanced manufacturing tax credit under Section 48D. Funds include $186.5 million owed to the Company for both fiscal 2023 and fiscal 2024 taxes, as well as accrued interest. This announcement reflects a portion of the approximately $1 billion total Section 48D cash tax refunds that the Company expects to receive.
As of the end of the second quarter of fiscal 2025, the Company had accrued a total of $865 million in Section 48D tax credits. The Company expects receipt of more than $600 million in cash tax refunds in fiscal year 2026. Wolfspeed intends to use the tax credit proceeds to strengthen its capital structure and for general corporate purposes. The Company expects that its cash balance at the end of its fiscal third quarter of 2025 will be approximately $1.3 billion, inclusive of these recently received 48D cash tax credits.
Reaffirming Guidance:
The Company is reaffirming its business outlook for the third quarter of fiscal 2025 as follows:
- Revenue from continuing operations of $170 million to $200 million
- Non-GAAP gross margin of (3)% to 7%
- Non-GAAP operating expenses of $99 million to $104 million
- GAAP net loss of $(295) million to $(270) million, or $(1.89) to $(1.73) per diluted share
- Non-GAAP net loss of $(138) million to $(119) million, or $(0.88) to $(0.76) per diluted share
In addition, the Company is also reaffirming the guidance that it issued in its Form 8-K filed on March 7, 2025:
- Fiscal 2026 capital expenditures of approximately $150 million to $200 million
- Fiscal 2027 capital expenditures of approximately $30 million to $50 million
- Adjusted EBITDA break-even point of $800 million of annual revenue upon completion of the operational simplifications, additional restructuring actions, including the closure of North Carolina Fab, and other cost reduction initiatives
- $200 million of unlevered operating cash flow in fiscal 2026 based on targeted fiscal 2026 revenue growth
- Positive levered free cash flow in fiscal 2027 following completion of refinancing transactions
Wolfspeed continues to explore alternatives with regard to its convertible notes, in partnership with its advisors, and remains in a dialogue with lenders, including Apollo and Renesas. The Company also maintains constructive dialogue with the White House, its legislators, and the U.S. Department of Commerce to secure federal funding and on ways Wolfspeed can support the Trump Administration’s efforts to reinforce U.S. industrial leadership in semiconductors, secure domestic supply chains, and reshore the manufacturing of critical mineral derivatives, including semiconductor wafers.
Original – Wolfspeed
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Infineon Technologies AG is developing TRENCHSTOP™ 7 H7 IGBTs in the new DTO247 package, which has the size of two TO247 packages. With a nominal current rating of up to 350 A, they will be the most powerful discrete IGBTs on the market. The new devices are ideal for solar inverters, uninterruptible power supplies (UPS) and energy storage systems (ESS).
The DTO247 with a single high-current IGBT can replace multiple lower-current IGBTs in standard TO247 packages that are typically connected in parallel. This enables high power density and bridges the gap between TO247-based designs and module architectures. Moreover, the ability to mix and match DTO247-based and standard TO247-based architectures within the same system offers a high degree of flexibility and customization. Integrating DTO247 into the existing TO247 portfolio simplifies the development of cost-effective, scalable architectures.
This reduces design complexity, shortens development time and lowers parallelization effort while improving performance, reliability, and system cost-effectiveness. The portfolio will include H7 IGBTs in 1200 V and 750 V versions, with current ratings of 200 A, 250 A, 300 A, and 350 A. Designed for high-current applications, these devices feature 2-mm-wide leads for optimal conduction, along with 7 mm pin-to-pin clearance and 10 mm creepage distance for enhanced safety and reliability. Additionally, an integrated Kelvin emitter pin provides faster and more efficient switching performance.
Infineon intends to continuously expand its DTO247 portfolio, with plans to include CoolSiC™ MOSFETs in a half-bridge configuration. These devices target to be pin-to-pin compatible with similar products on the market.
First engineering samples of the 200 A and 350 A variants of the TRENCHSTOP™ 7 H7 IGBTs in the DTO247 package are available now. Volume production is scheduled for mid-2026.
Original – Infineon Technologies
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GaN / LATEST NEWS / PRODUCT & TECHNOLOGY / TOP STORIES / WBGMazda and ROHM Collaborate to Develop Automotive Components Utilizing Next-Generation Semiconductors
March 28, 2025
3 Min ReadMazda Motor Corporation and ROHM Co., Ltd. have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.
Since 2022, Mazda and ROHM have been advancing the joint development of inverters using silicon carbide (SiC) power semiconductors under a collaborative framework for the development and production of electric drive units. Now, they have also embarked on the development of automotive components using GaN power semiconductors, aiming to create innovative automotive components for next-generation electric vehicles.
GaN is attracting attention as a next-generation material for power semiconductors. Compared to conventional silicon (Si) power semiconductors, GaN can reduce power conversion losses and contribute to the miniaturization of components through high-frequency operation.
Both companies will collaborate to transform these strengths into a package that considers the entire vehicle, and into solutions that innovate in weight reduction and design. Mazda and ROHM aim to materialize the concept and unveil a demonstration model within FY2025, with practical implementation targeted for FY2027.
“As the shift towards electrification accelerates in pursuit of carbon neutrality, we are delighted to collaborate with ROHM, which aims to create a sustainable mobility society with its outstanding semiconductor technology and advanced system solution capabilities, in the development and production of automotive components for electric vehicles” said Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of Mazda. “We are excited to work together to create a new value chain that directly connects semiconductor devices and cars. Through collaboration with partners who share our vision, Mazda will continue to deliver products filled with the ‘joy of driving’ that allows customers to truly enjoy driving, even in electric vehicles.”
“We are very pleased to collaborate with Mazda, which pursues the ‘joy of driving,’ in the development of automotive components for electric vehicles” said Katsumi Azuma, Member of the board and Senior Managing Executive Officer of ROHM. “ROHM’s EcoGaN™, capable of high-frequency operation, and the control IC that maximizes its performance are key to miniaturization and energy-saving. To implement this in society, collaboration with a wide range of companies is essential, and we have established various partnerships for the development and mass production of GaN. By collaborating with Mazda, which aims to create ‘cars that coexist sustainably with the earth and society,’ we will understand the requirements for GaN from the perspective of application and final product development, contributing to the spread of GaN power semiconductors and the creation of a sustainable mobility society.”
Original – ROHM
