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LATEST NEWS3 Min Read
Alpha and Omega Semiconductor Limited (AOS) will showcase its expanding line of advanced power management solutions at PCIM 2024. Designed to meet the dynamic, important power management challenges in several key application areas and markets, the AOS products highlighted at PCIM include:
- New Silicon Carbide (SiC) MOSFET Announcement at PCIM: Supporting the needs of a wide range of automotive and industrial applications, AOS will introduce three new advanced package options for its latest Gen2 SiC MOSFET line. The new packages comprise a surface mount topside cooling option with a Kelvin source that meets the needs of the most power-dense advanced designs. It will also be announced that an AEC-Q101-qualified surface mount package will be in the standard D2PAK-7L footprint. The third package is a half-bridge module that provides an excellent solution for the high power industrial solar and charging station markets. The announcements will detail how these packages support AOS’ comprehensive line of SiC MOSFETs from 10mOhm to 500mOhm and voltages from 650V to 1700V.
- New Motor Drive Announcement at PCIM: AOS will announce a new range of 60V and 100V drivers for power tools, outdoor garden equipment, and e-mobility applications, including a 100V half bridge, a 100V 3-phase, and a 60V 3-phase. These products all support 100 percent duty cycle operation, and demo boards using AOS motor drivers and MOSFETs will be featured in the AOS booth.
- Power Supply and Renewable Energy: A significant solution in AOS’ growing High Voltage Super Junction MOSFET portfolio is its industry-leading optimized αMOS5™ 600V to 700V Super Junction MOSFETs that help designers achieve efficiency and density goals while satisfying budget goals. Featuring fast switching, a robust UIS/body diode, and ease of use, these state-of-the-art MOSFETs meet the latest server, telecom rectifier, solar inverter, EV charger, gaming, PC, and universal charging/PD design requirements. The newly released AONA66916, a 100V AlphaSGT™ MOSFET, delivers industry-leading Rthjc-top and Rthjc-bottom thermal resistances. A compact DFN 5×6 double-sided cooling package offers improved thermal designs in demanding telecom, solar, and DC-DC converter applications.
- Automotive and E-mobility: In AOS’ increasing line of automotive MOSFETs, the new automotive grade 80V (AOTL66810Q) and 100V (AOTL66912Q) MOSFETs in the TOLL package are designed to achieve the highest current capability. The AOS TOLL package utilizes advanced clip technology to achieve a high in-rush current rating and very low package resistance and inductance, enabling improved EMI performance compared to other TOLL packages based on standard wire-bonding technology packages. These new automotive-grade MOSFETs help designers meet the power requirements in electric vehicles, battery management systems (BMS), and high-performance inverters (BLDC motors) for e-mobility.
- Intelligent Power Modules, Mega IPM7: AOS has integrated its latest RC IGBT and high-voltage gate driver into the world’s most compact package design, capable of delivering mega power of up to 100W in motor control applications. The portfolio covers 600V / (1A−3A) in a variety of package options (Mega IPM-7D, IPM7DT, IPM-7E) that are ideal solutions for a broad array of design requirements.
- Poster Presentation: Jong-Mu Lee, Ph.D. and director of AOS IGBT and Module Product Lines, will present SiC-IPM for Compact and Energy Efficient in the Intelligent Power Modules session on Tuesday, June 11, at 15:30.
Original – Alpha and Omega Semiconductor
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LATEST NEWS / PRODUCT & TECHNOLOGY / SiC / WBG1 Min Read
Taiwan Semiconductor – a global supplier of discrete power electronics devices, LED drivers, analog ICs and ESD protection devices – announced a family of 650V silicon carbide Schottky barrier diodes which are suitable for high-efficiency AC-DC, DC-DC and DC-AC conversion applications.
Unlike silicon-based fast-recovery rectifiers, these SiC devices have negligible switching losses due to low capacitive charge (QC). This makes them suitable for high-speed switching applications, benefitting circuit designs with increased power density and can reduce overall solution size.
Key Features
- Max. junction temperature 175°C
- High-speed switching
- High frequency operation
- Positive temperature coefficient on VF
- SPICE Models available
- Thermal Models available
Applications
- AD-DC conversion – PFC Boost
- DC-DC, Solar inverters
- Data center and server power
- Telecom – Datacom power
- UPS systems
Circuit Functions
- PFC boost diode
- Free-wheeling diode
- Full wave bridge
- Vienna bridgeless circuit
Original – Taiwan Semiconductor
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Ideal Power Inc. reported results for its first quarter ended March 31, 2024.
“Commercial momentum continues as we commenced shipments of SymCool™ power modules to fulfill customer orders in the first quarter. We expect industrial markets, particularly the solid-state circuit breaker market served by our SymCool™ power module, to be the earliest source of our sales ramp,” said Dan Brdar, President and Chief Executive Officer of Ideal Power.
“In addition, all of our Phase II deliverables with Stellantis were successfully completed ahead of schedule and we added our first distributor, Richardson Electronics. They placed multiple orders with Ideal Power including an order from a company not previously in our sales funnel.”
Key First Quarter and Recent Business Highlights
Execution to B-TRAN™ commercial roadmap continues, including:
- Commenced commercial shipment of SymCool™ power modules to fulfill customer orders. The SymCool™ power module targets several applications including solid-state switchgear and circuit protection, renewable energy inverters for solar and wind, industrial inverters, hybrid and electric vehicles (“EVs”) and EV charging.
- Received an order for SymCool™ power modules and drivers from one of the two Forbes Global 500 leaders in diverse power management markets in Ideal Power’s B-TRAN™ test and evaluation program. This global power management market leader is evaluating SymCool™ against IGBT modules for use in solid-state circuit breaker (“SSCB”) applications.
- Received an order for B-TRAN™ devices and a circuit breaker evaluation board from a global leader in power semiconductor and power electronics solutions in connection with its launch of a multi-year DC power distribution system program. This global leader presents multiple opportunities as it addresses several of our target industrial markets: SSCBs, industrial and grid infrastructure and renewable energy.
- Successfully completed Phase II of a product development program with Stellantis, a top 10 global automaker. All Phase II deliverables were completed ahead of schedule including a wafer run and deliveries of tested B-TRAN™ devices, drivers and a Stellantis approved comprehensive reliability test plan for automotive qualification. Ideal Power is partnering with Stellantis’ advanced technology development team to develop a custom B-TRAN™ power module for use in EV drivetrain inverters in Stellantis’ next generation EV platform.
- Added the first distributor, Richardson Electronics, for discrete B-TRAN™ device and SymCool™ power modules. Richardson Electronics placed multiple orders with Ideal Power including an order from a company not previously in Ideal Power’s sales funnel.
- Added a global leader in circuit protection, industrial fuses and power conversion technology with over a billion in annual sales to the roster of the B-TRAN™ test and evaluation program.
- Released B-TRAN™ and SymCool™ videos and application notes for the technical audience at prospective customers, resulting in the addition of new opportunities to the sales funnel. The videos demonstrate the testing of discrete B-TRAN™ devices and SymCool™ power modules and the compelling advantages B-TRAN™ offers to SSCB applications.
- Nearing completion of a qualification run with the second high-volume wafer fabrication partner. This wafer fab in Europe will support future revenue growth and add dual sourcing for wafer fabrication.
- B-TRAN™ Patent Estate: Currently at 86 issued B-TRAN™ patents with 39 of those issued outside of the United States and 41 pending B-TRAN™ patents. Current geographic coverage includes North America, China, Japan, South Korea, India, and Europe, with pending coverage in Taiwan.
First Quarter 2024 Financial Results
- Completed a public offering, raising net proceeds of $15.7 million. The initial closing in late March resulted in net proceeds of $13.7 million and the exercise of the underwriter’s overallotment option in April resulted in additional net proceeds of $2.0 million.
- Commercial revenue increased to $78,739 in the first quarter of 2024 from $0 in the first quarter of 2023.
- Operating expenses in the first quarter of 2024 were $2.5 million compared to $2.6 million in the first quarter of 2023.
- Net loss in the first quarter of 2024 was $2.5 million compared to $2.5 million in the first quarter of 2023.
- Cash used in operating, investing and financing activities in the first quarter of 2024, excluding the net proceeds from the public offering, was $1.9 million compared to $1.8 million in the first quarter of 2023 and down from $2.3 million in the fourth quarter of 2023.
- Cash and cash equivalents totaled $20.2 million at March 31, 2024.
- No long-term debt was outstanding at March 31, 2024.
2024 Milestones
For 2024, the Company has set or achieved the following milestones:
- Successfully completed Phase II of development program with Stellantis
- Secure Phase III of development program with Stellantis
- Complete qualification of second high-volume production fab
- Convert large OEMs in test and evaluation program to design wins/custom development agreements
- Add distributors for SymCool™ products
- Initial sales of SymCool™ IQ intelligent power module
- Begin third-party automotive qualification testing
Original – Ideal Power
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LATEST NEWS2 Min Read
Infineon Technologies AG Supervisory Board has extended the contract of Dr. Rutger Wijburg (62), Management Board member and Chief Operations Officer, for a period of one year, until 31 March 2026. In addition, the Supervisory Board will extend the contract of Andreas Urschitz (52), Management Board member and Chief Marketing Officer, for a period of five years, until 31 May 2030. The current contract of Andreas Urschitz expires at the end of May 2025; Rutger Wijburg’s contract would otherwise have expired in March 2025.
“Andreas Urschitz and Rutger Wijburg have played a decisive role in charting a course of profitable growth for Infineon. We are pleased that they will both continue as members of the Infineon Management Board in the upcoming years,” says Dr. Herbert Diess, Chairman of the Supervisory Board of Infineon Technologies AG. He adds that the Supervisory Board particularly respects the personal decision by Rutger Wijburg to extend his contract only until March 2026.
Andreas Urschitz has been a member of the Management Board since 2022, prior to which he was President of the Infineon Power & Sensor Systems (PSS) Division. Rutger Wijburg has been a member of the Management Board and Infineon’s Chief Operations Officer since 2022; he was previously Head of Frontend as well as Managing Director at Infineon Dresden.
Original – Infineon Technologies
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CVD Equipment Corporation announced its financial results for the first quarter ended March 31, 2024.
Manny Lakios, President and CEO of CVD Equipment Corporation, commented, “First quarter 2024 revenue was $4.9 million, down significantly versus the prior year period, as our business continues to experience fluctuations in revenue given the nature of the emerging growth end markets we serve. While we are disappointedwith our first quarter performance, we’ll stay the course on strategic efforts to achieve profitability, carefully managing our costs and cash flow while simultaneously focusing on growth and return on investment.”
Mr. Lakios added, “As we mentioned in our year-end press release, we started off the year with several key order wins during the first quarter. These included a strategic order for our PVT200™ system from a new customer, marking an important milestone as we seek to gain traction for SiC crystal boule growth, as well as a multi-system order for our SiC CVD coating reactors. The PVT200™ customer plans to evaluate our equipment for potential additional orders. This improved order performance resulted in an increase in backlog from $18.4 million at year-end to $27.1 million at March 31, 2024. We are encouraged by these orders, as we continue to fund both research and development and sales and marketing activities, including direct engagementwith multiple potential customers, highly focused on penetrating key market opportunities.”
First Quarter 2024 Financial Performance
- Revenue of $4.9 million, down $3.8 million or 43.4% year over year primarily due to lower system revenues.
- Gross profit margin percentage was 17.5% due to lower gross profit margins on certain contracts in progress at our CVD Equipment segment partially offset by higher gross profit margins by our SDC segment.
- Operating loss of $1.6 million.
- Net loss of $1.5 million or $0.22 basic and diluted share, compared to a net loss of $40,000 or $0.01 per basic and diluted share for the prior year first quarter.
- Cash and cash equivalents of $11.9 million as of March 31, 2024 as compared to $14.0 million as of December 31, 2023.
First Quarter 2024 Operational Performance
- Orders for the first quarter were $13.5 million primarily driven by demand in the aerospace sector and in our SDC segment for gas delivery equipment.
- As mentioned above we received these important orders in the quarter:
- An order for our new PVT200™ system used to grow silicon carbide crystals for the manufacture of 200 mm wafers. This represents our second customer for our PVT equipment that the customer will evaluate for potential additional orders.
- A multisystem order from an industrial customer for approximately $10 million that will be used for depositing a silicon carbide protective coating on OEM components, with systems scheduled to ship in 2025.
- During the first quarter, we implemented a plan to reduce our operating costs to be consistent with current customer demand. This resulted in a reductionin our work force in early January 2024. We continue to evaluate the demand for our products and opportunities to reduce our operating costs.
Original – CVD Equipment
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SK siltron announced the signing of an agreement with the city of Gumi and the Gumi Chamber of Commerce and Industry that will help foster the next generation of semiconductor professionals in the Gumi region through the “Semiconductor School” program.
The signing ceremony took place at the Gumi Chamber of Commerce and Industry on May 7, and was attended by the Director of Gumi’s Economy & Industry Bureau, Yoo Kyung-sook; Secretary-General of the Gumi Chamber of Commerce and Industry, Jang Dong-ki; and External Cooperation Director for SK siltron, Cho Kyung-chul. The tri-party partnership between SK siltron, Gumi, and the Gumi Chamber of Commerce and Industry will educate approximately 2,700 students from 12 high schools in Gumi to become future semiconductor professionals.
In July of last year, the Korean government designated several “specialized semiconductor complexes” to reinforce the security of semiconductor supply networks and the national economy. Gumi has the only specialized semiconductor complex outside of the Seoul area. The new Semiconductor School will familiarize students with Gumi’s specialized semiconductor complex, which supplies semiconductor essentials such as wafers and substrates.
Students will also be provided with lessons about the present and future of the semiconductor industry, and semiconductor processes and technologies. Students will also enjoy support with choosing their career path, as they will be able to take advantage of study and work opportunities in Gumi’s semiconductor industry. The SK siltron Semiconductor School is an advanced arm of the SK siltron-run Wafer School, a program which introduces elementary and middle school students to the world of semiconductors. The Wafer School has been running since 2019.
Enlistment of high schools to participate in the SK siltron Semiconductor School has taken place since April this year with the support of Gumi’s Office of Education. SK siltron staff and local university students majoring in semiconductors will be trained to become lecturers for the Semiconductor School. Approximately 100 classes are scheduled to be given at selected Gumi high schools between July and September.
“As Gumi is a designated specialized semiconductor complex, we will be able to foster local semiconductor professionals who can help Gumi’s semiconductor industry grow into one of the biggest industries in the region,” said Yoo Kyung-sook, Director of Gumi’s Economy & Industry Bureau.
“The SK siltron Semiconductor School is of monumental significance to Gumi, as SK siltron is a semiconductor company based in the city,” said Jang Dong-ki, Secretary-General of the Gumi Chamber of Commerce and Industry. “We will provide our full support for the growth of all semiconductor companies in the Gumi region.”
Since 2019, SK siltron has run its Wafer School for some 9,300 elementary and middle school students in Korea to introduce them to semiconductors as a possible career. The Wafer School imparts basic knowledge of semiconductors and wafers, and supports interested students in exploring career options in the industry. This year, the Wafer School has been in session for around 2,900 students from 17 middle schools in Gumi since April.
Original – SK siltron
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LATEST NEWS / PRODUCT & TECHNOLOGY5 Min Read
As the “heart” of charging stations, the performance and reliability of charging modules are undeniably crucial. The popularization of the “super charging” concept has made long cruising range and short charging time become the selling points of more and more electric vehicles on the market.
Recently, the newly released Chinese Standard GB/T20234-2023, which focuses on Part 4: High-Power DC Charging Interfaces for Electric Vehicle Conductive Charging Couplers, has been significantly revised to expand the voltage range to 1500Vdc and the corresponding current range to 1000A. Additionally, the standard now includes new provisions related to liquid-cooled charging stations.
This means that in the future, higher-power megawatt-level charging stations will gradually become a reality. As long as your electric vehicle supports supercharging, it will be as convenient as refueling at a gas station.
Charging Module Technology Analysis
In fact, WeEn Semiconductors has long focused its business on the “low-carbon” track, while acknowledging that charging stations, as crucial supporting infrastructure, will evolve towards directions of higher power, greater efficiency, full liquid cooling, and comprehensive supercharging capabilities.
WeEn’s latest research and development effort, the BYC100MW-600PT2, will enable customers to achieve designs for 40kW+ high-power, high-efficiency charging modules. The WND60P20W will offer customers a higher voltage design margin to meet the demands of more complex and challenging application scenarios, thereby supporting the rapid development of new energy vehicles and the achievement of low-carbon objectives.
A charging module is essentially a power electronics converter that converts alternating current (AC) from power grid into direct current (DC) that can be stored in the battery of an electric vehicle.
Charging module converters typically have a two-stage topology. The first stage is usually a three-phase Power Factor Correction (PFC), most often using the Vienna PFC topology. Its main function is to convert AC to DC and to correct the power factor.
Figure 1: Vienna PFC Topology Architecture
The second stage typically involves a DC-DC conversion, most often using the high-efficiency LLC topology. This stage primarily converts the high voltage DC output from the PFC (800Vdc) into a wide range of adjustable DC voltages from 200Vdc to 1000Vdc, to match the needs of different battery voltage levels. Additionally, the DC-DC stage also achieves electrical isolation from the power grid through a high-frequency transformer.
Since the current charging modules are primarily used for delivering power to electric vehicles, the output rectification in the DC-DC stage commonly employs Fast Recovery Diodes (FRD). Benefiting from the negative temperature coefficient characteristics of Fast Recovery Diodes (FRD), and given that the LLC topology generally does not require stringent reverse recovery performance, FRDs are particularly suitable for use in charging modules that operate under high temperature and high current conditions.
Benefiting from the negative temperature coefficient characteristics of Fast Recovery Diodes (FRD), and given that the LLC topology generally does not require stringent reverse recovery performance, FRDs are particularly suitable for use in charging modules that operate under high temperature and high current conditions.
Figure 2: LLC DC- DC Topology Architecture
Currently, the mainstream power ratings for charging modules on the market range from 20kW to 40kW. Superchargers typically operate by outputting through several charging modules connected in parallel. Therefore, to ensure that each module is not affected by others during startup, Oring diodes are essential. When functioning normally, these diodes are in a conducting state, primarily incurring conduction losses. Consequently, standard rectifier diodes with low forward voltage (VF) are the best choice.
WeEn’s Professional Solutions
WeEn semiconductors, including the BYC75W-600P for LLC secondary-side rectification and the Oring diode WND60P16W, have been mass-produced reliably for years in leading charging module manufacturers’ 30kW models. With the recent trend towards higher power in charging modules and the need to accommodate for the harsh operating environments of charging stations, we have responded to our customers’ actual needs by launching the BYC100MW-600PT2 for 40kW charging modules and the higher voltage-resistant WND60P20W, helping our customers solve practical application issues.
#BYC100MW-600PT2 Features:
- Maximum current up to 100A
- Extremely low reverse leakage current
- Optimal VF-QRR trade-off performance
- Robust Eas capability
#WND60P20W Features:
- Maximum reverse voltage up to 2000 Vdc
- Extremely low forward conduction voltage drop
- Enhanced forward surge current capability
- Robust Eas capability
By comparing the specifications of the BYC100MW-600PT2 and BYC75W-600PT2, we find that the BYC100MW-600PT2 offers significant improvements in forward voltage (VF) while maintaining the same reverse recovery charge. As a result, it is more suitable for applications in 40kW high-power charging modules. Customers using the 40kW modules have observed an actual temperature rise reduction of 8°C to 10°C, which substantially enhances the thermal design of the system.
Figure 3: BYC100MW-600PT2 VF Curve
Figure 4: BYC100MW-600PT2 Qrr Curve
In the context of charging station applications, considering that there is quite a distance from the output of the charging module to the high-voltage power battery, potentially up to 30-40 meters, it is important to note that at the moment the charging module begins outputting, stray inductance in the charging cable and capacitors within the system will oscillate. This causes the diode to endure a spike in reverse voltage. If the voltage exceeds the diode’s avalanche voltage, it will cause avalanche breakdown; if the diode’s avalanche energy is insufficient, it will be damaged.
The WND60P20W is an enhancement of the existing WND60P16W product from WeEn Semiconductors, with the reverse withstand voltage increased to 2000Vdc while also improving its capability to withstand avalanche breakdown. The WND60P20W can meet the increasingly complex and harsh working environments of charging modules, providing greater safety margins for customer module designs.
Figure 5: Voltage Oscillation Across Oring Diode
Original – WeEn Semiconductors
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Navitas Semiconductor announced unaudited financial results for the first quarter ended March 31, 2024.
“I am very pleased with our first quarter revenue growth of over 70% from the prior year, despite an overall market slowdown,” said Gene Sheridan, CEO and co-founder. “Response to our latest technologies – GaNSafe™, Gen-3 Fast GeneSiC™ and now GaNSlim technology – has been impressive. Our customer pipeline – which has grown to $1.6 billion – shows that future demand for electrification and energy savings is stronger than ever.”
1Q24 Financial Highlights
- Revenue: Total revenue grew to $23.2 million in the first quarter of 2024, a 73% increase from $13.4 million in the first quarter of 2023.
- Loss from Operations: GAAP loss from operations for the quarter was $31.6 million, compared to a loss of $35.5 million for the first quarter of 2023. On a non-GAAP basis, loss from operations for the quarter was $11.8 million compared to a loss of $12.3 million for the first quarter of 2023.
- Cash: Cash and cash equivalents were $129.7 million as of March 31, 2024.
Market, Customer and Technology Highlights
- AI Data Center: Leading-edge GaNSafe and Gen-3 Fast GeneSiC technologies with unique system design-center solutions enable 3x increase in power capability to support AI-based data centers. Announcing 3 major design wins at the world’s largest power-supply companies, in combination with over 30 customer projects in development. In the coming quarters, we expect to power data centers at AWS, Azure, Google, Supermicro, Inspur and Baidu.
- EV: New 22 kW on-board charger (OBC) platform delivers up to 3x faster charging, 2x power density, 30% greater energy savings and 40% lighter weight relative to current solutions. Now engaged with over 160 EV-related customers across all major regions and increased total pipeline by over 50% since the $400 million reported in December.
- Solar / Energy Storage: Won 6 new designs across US, Europe and Asia for solar optimizers, micro-inverters, string inverters and energy-storage applications for 2025 ramp, with significant increase in pipeline.
- Home Appliance / Industrial: Latest, motor-optimized GaNSense™ half-bridge power ICs in over 15 customer developments. Gen-3 Fast GeneSiC and GaNSafe technologies are achieving rapid industrial adoption with over 25 customer developments.
- Mobile / Consumer: Over 20 new fast chargers added in the last quarter, taking the total released customer products to over 450, across all 10 of the top 10 mobile OEMs. New gen-4 GaN IC projects include Xiaomi launching another two smartphone models (Mi 14 Ultra and the CIVI 4Pro) to support ultra-fast charging, and Lenovo with the ThinkBook 170W desktop 5-port charger and docking station.
Business Outlook
- Second quarter 2024 net revenues are expected to be $20 million plus or minus $500 thousand. Non-GAAP gross margin for the second quarter is expected to be 40% plus or minus 50 basis points and non-GAAP operating expenses are expected to be approximately $21.5 million in the second quarter of 2024.
Original – Navitas Semiconductor
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The Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), released a report on the global chip supply chain that projects the United States will triple its domestic semiconductor manufacturing capacity from 2022—when the CHIPS and Science Act (CHIPS) was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time.
The study, titled “Emerging Resilience in the Semiconductor Supply Chain,” also projects the U.S. will grow its share of advanced logic (below 10nm) manufacturing to 28% of global capacity by 2032, up from 0% in 2022. Additionally, America is projected to capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032, ranking second only to Taiwan (31%). In the absence of the CHIPS Act, the U.S. would have captured only 9% of global capex by 2032, according to the report.
While the report finds investments from the industry—facilitated by CHIPS incentives—are on track to reinvigorate semiconductor manufacturing in America and reinforce U.S. chip supply chains, it also identifies policy actions that will further strengthen supply chains, support R&D and chip design, grow the semiconductor workforce, and ensure CHIPS delivers maximum benefits to America’s economic and national security.
The report also analyzes the efforts underway in other countries to incentivize chip production and innovation and the criticality of ensuring chip companies have open access to global customers and suppliers, among other topics.
“Effective policies, such as the CHIPS and Science Act, are spurring more investments in the U.S. semiconductor industry. These investments will help America grow its share of global semiconductor production and innovation, furthering economic growth and technological competitiveness,” said Rich Templeton, Chairman of the Board at Texas Instruments and SIA board chair. “Continued and expanded government-industry collaboration will help ensure we build on this momentum and continue our next steps forward.”
Other key report findings:
- America’s world-leading 203% projected increase in fab capacity from 2022 to 2032 stands in stark contrast to its modest 11% increase from the previous decade (2012-2022), which ranked last among all major chip-producing regions, according to the SIA/BCG report.
- The U.S. share of the world’s chip manufacturing capacity will increase from 10% in 2022—when the CHIPS and Science Act was enacted—to 14% by 2032, marking the first time in decades the U.S. has grown its domestic chip manufacturing footprint relative to the rest of the world. In the absence of CHIPS enactment, the U.S. share would have slipped further to 8% by 2032, according to the report.
- The U.S. continues to lead the world in its overall contribution to the global value chain, with strong leadership positions in high value-added areas of semiconductor technology, including chip design, electronic design automation (EDA), and semiconductor manufacturing equipment.
The report also finds industrial policies have the potential to create additional bottlenecks that increase supply chain risk. Certain segments of the semiconductor supply chain are at risk if incentive programs and large-scale industrial policies lead to non-market-based investment, which can result in overconcentration or oversupply. Government incentives should focus on enabling targeted, distributed, market-based investments.
Further, the study highlights the ways in which governments and companies are taking concerted action to increase resilience. The U.S. CHIPS Act committed $39 billion in incentives for semiconductor manufacturing, plus a separate advanced manufacturing investment tax credit. The European Union unveiled the European CHIPS Act, China initiated the third phase of its Integrated Circuit (IC) Industry Investment Fund, and various other incentive programs have emerged in Taiwan, Korea, Japan, India, and around the world. In parallel, companies have made significant investments, in both established and new regions. The report projects around $2.3 trillion in capex in 2024-2032, compared to $720 billion in the decade prior to enactment of the CHIPS Act (2013-2022).
Despite the progress made to strengthen U.S.-based semiconductor manufacturing, additional government policy actions are needed to help ensure America stays on track to address lingering supply chain vulnerabilities and grow its share of fabrication capacity, while also increasing its strength in areas such as advanced logic, design, EDA, and equipment in the face of growing global competition.
“The CHIPS and Science Act has put America on course to significantly strengthen domestic semiconductor production and R&D, but more work is needed to finish the job,” said John Neuffer, SIA president and CEO. “We look forward to working with government leaders to advance policies that broaden the STEM talent pipeline, invest in scientific research, promote free trade and access to global markets, and expand and extend critical CHIPS incentives.”
The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced more than 80 new projects across 25 U.S. states—totaling nearly $450 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 56,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
Original – Semiconductor Industry Association