This book provides readers with state-of-the-art knowledge of established and emerging semiconducting materials, their processing, and the fabrication of chips and microprocessors. In addition to covering the fundamentals of these materials, it details the basics and workings of many semiconducting devices and their role in modern electronics and explores emerging semiconductors and their importance in future devices.

In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low temperature direct copper bonding, in particular, will become widely adopted for a broad range of high performance semiconductor devices in the years to come.

Advanced MOS Devices and their Circuit Applications book comprehensively discusses the advanced MOS devices and their circuit applications with reliability concerns. Further, an energy-efficient Tunnel FET-based circuit application will be investigated in terms of the output voltage, power efficiency, energy consumption, and performances using the device circuit co-design approach.

This book provides real stories about the South Korean semiconductor community. It explores the lives and careers of six influential semiconductor engineers who all studied at Korea Advanced Institute of Science and Technology (KAIST) under the mentorship of Dr. Kim Choong-Ki, the most influential semiconductor professor in South Korea during the last quarter of the twentieth century. Kim’s students became known as “Kim’s Mafia” because of the important positions they went on to hold in industry, government, and academia.

This handbook presents the key properties of silicon carbide (SiC), the power semiconductor for the 21st century. It describes related technologies, reports the rapid developments and achievements in recent years, and discusses the remaining challenging issues in the field.

This book introduces the basics of entrepreneurship and a methodology for the study of entrepreneurship in electrical engineering and other engineering fields. Entrepreneurship is considered here in three fields of electrical engineering, viz. power semiconductor devices, power electronics and electric machines and drive systems, and their current practice. It prepares the reader by providing a review of the subject matter in the three fields, their current status in research and development with analysis aspect as needed, thus allowing readers to gain self-sufficiency while reading the book.

Designing and building power semiconductor modules requires a broad, interdisciplinary base of knowledge and experience, ranging from semiconductor materials and technologies, thermal management, and soldering to environmental constraints, inspection techniques, and statistical process control. This diversity poses a significant challenge to engineers, and a book that brings together the essential elements of these technologies is long overdue. Power Electronic Modules: Design and Manufacture fills that void.