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onsemi announced that Sineng Electric will integrate onsemi EliteSiC silicon carbide (SiC) MOSFETs and IGBT-based high-density power integrated modules (PIMs) into its utility-scale solar inverter and industry-first 200kW energy storage system (ESS). The two companies worked together to develop optimized solutions that maximize the performance of solar inverters, energy storage and power conversion systems.
Sineng’s work with onsemi EliteSiC has led to the launch of a utility-scale solar string inverter, which offers simplicity in design, reduced maintenance costs and lower downtimes compared to a centralized inverter solution. The adoption of onsemi’s highly optimized single-stage PIM with multi-level topology in 200KW ESS enables industry leading system efficiency and lower total cost of ownership.
“onsemi supports us in solving the most challenging technical problems such as system-level design, simulations, thermal analysis and creation of sophisticated control algorithms,” said Qiang Wu, chairman of Sineng Electric. “Integrating the highly efficient EliteSiC technology enables us to develop and implement cutting-edge renewable energy solutions tailored to our customers’ needs. In combination with onsemi’s end-to-end SiC supply chain, we have the supply assurance to plan for long-term growth.”
Both companies will continue to collaborate on the development of new high-power products to enable a broader range of renewable energy solutions. As part of this process, Sineng will adopt more EliteSiC products, thereby benefitting from efficiency and scale.
“Together, we will leverage the benefits of onsemi’s high performance products and Sineng Electric’s expertise in power electronics system design to deliver industry leading solutions for sustainable energy applications,” said Asif Jakwani, senior vice president and general manager, Advanced Power Division, onsemi. “Our continuous pursuit to improve overall system efficiency plays a pivotal role in society moving towards the goal of a net-zero emissions future.”
The two companies expect to extend their existing long-term supply agreement (LTSA), signed in late 2022, further demonstrating their commitment to collaboration and innovation.
Original – onsemi
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Analog Devices, Inc. announced a new €630 million investment at its European regional headquarters in the Raheen Business Park in Limerick, Ireland. The investment enables the construction of a new, state-of-the-art, 45,000 sq-ft Research & Development and manufacturing facility.
The new facility will support ADI’s development of next-generation signal processing innovations designed to accelerate the digital transformation of Industrial, Automotive, Healthcare, and other sectors. It is expected to triple ADI’s European wafer production capacity and aligns with the company’s goal of doubling its internal manufacturing capacity to enhance the resiliency of its global supply chain and better serve customer needs. This investment is expected to grow ADI’s employment footprint in the mid-west region of Ireland by 600 new positions, a significant increase to ADI’s current 1,500 employees in Ireland and 3,100 employees in Europe as a whole.
This announcement comes a year after ADI announced a separate investment of €100 million in ADI Catalyst, its 100,000 sq-ft custom-built facility for innovation and collaboration at its Limerick campus. Ireland is also home to ADI’s main European Research and Development Center, which has generated more than 1,000 patents since its inception and has seeded ADI R&D sites throughout Europe in Spain, Italy, UK, Romania, and Germany.
“Since 1976, Ireland has been a critical innovation center for ADI, thanks to its strong academic and research organizations, business ecosystem, and progressive government leadership,” said ADI CEO and Chair Vincent Roche. “This next-generation semiconductor manufacturing facility and expanded R&D team will further extend ADI Limerick’s global influence. Through organic R&D and close collaboration with our customers and ecosystem partners, we are striving to solve some of the world’s greatest challenges and enable a more efficient, safer, and sustainable future.”
The new investment is planned as part of a collaboration within the European Union’s Important Projects of Common European Interest on Microelectronics and Communication Technologies (IPCEI ME/CT) initiative, and will support cross-border collaborative research. ADI’s IPCEI application – Ireland’s first since the inception of the Important Projects of Common European Interest (IPCEI) initiative – is subject to final approval from the European Commission, and is supported by the Irish Government through IDA Ireland.
An Taoiseach Leo Varadkar TD said: “This is a really significant announcement for Limerick and the Mid-West region, which marks a new chapter in the longstanding relationship between ADI and Ireland. This massive €630 million investment is great news for local employment with lots of jobs being created during the construction phase, and 600 high-end graduate jobs. It means a significant expansion in the size and scale of ADI’s research, innovation, and development, leading to new, highly innovative products.
This investment is further evidence of the Government’s commitment to bringing jobs to the Mid-West. Most IDA jobs created in recent years have been outside of Dublin, and Limerick has done particularly well with its deep talent pool, universities, airport, and infrastructure. This investment will also mean lots of spin-off jobs and contracts for local SMEs and Irish-owned businesses. ADI’s investment is part of Ireland’s commitment to develop Important Projects of Common European Interest, IPCEIs, and will contribute to Europe’s broader microelectronics sector. The future is digital. There can be no such future without microchips and it’s great that Ireland is such an important player in the supply chain.”
Minister for Enterprise Trade & Employment Simon Coveney said: “This is a much welcome announcement from Analog Devices and a great vote of confidence in Limerick and the Mid-West. It’s also noteworthy that it’s the latest in a series of major job announcements outside of Dublin. I’m struck not only by the scale of the investment, but also the high quality positions that will result. I’ll be visiting Analog Devices in Boston during a trade mission this week where we’ll be looking forward to many more years of doing business in Ireland.”
IDA Ireland CEO Michael Lohan said: “The technology that ADI will develop at this facility in Limerick is at the very forefront of innovation and has the potential to revolutionise the lives of billions of people across the world. This investment by ADI is intended to strengthen our supply chain resilience for advanced semiconductor processes. We wish continued success to ADI and look forward to our continued partnership. This is a transformational investment for the Limerick site, for the Mid-West region, and for the semiconductor industry in Ireland. IDA Ireland is committed to supporting investments of scale that impact positively on Europe’s semiconductor industry.”
Original – Analog Devices
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Orbray Co., Ltd. and MIRISE Technologies Corporation have begun collaborating on vertical diamond power devices that will contribute to carbon neutrality.
Over the three-year period of this project, Orbray and MIRISE Technologies will use their respective technologies, resources, and expertise in diamond substrates and power devices to develop the technologies needed to deploy vertical diamond power devices in a wide range of electric vehicles in the future.
In this research collaboration, Orbray will be responsible for developing a p-type conductive diamond substrate, while MIRISE Technologies will take charge of developing a high-voltage operating device structure to demonstrate the feasibility of a vertical diamond power device. At the end of this project, the companies are planning to discuss the next stage of collaboration, such as further research and development.
As the automobile industry increasingly shifts to electric vehicles worldwide to achieve carbon neutrality, the development of next-generation automotive semiconductors is essential to improve the fuel efficiency and power consumption of electric vehicles, and reduce battery costs. Compared with current mainstream semiconductor materials such as Si (silicon), SiC (silicon carbide), and GaN (gallium nitride), diamond is known as the “ultimate semiconductor material” because it has higher voltage operating capability and superior thermal conductivity (heat dissipation). In the future, the development and mass production of next-generation automotive semiconductors using diamond is expected to improve the fuel efficiency and power consumption of electric vehicles, and reduce battery costs.
Orbray and MIRISE Technologies will leverage their respective strengths to develop next-generation in-vehicle semiconductors through vertical power devices, and thereby contribute to carbon neutrality.
Original – Orbray
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Nexperia announced a significant raising of the bar in semiconductor engineer design support with the release of next-generation interactive datasheets to accompany its Power MOSFETs. By manipulating interactive sliders within the datasheets, users can manually adjust the voltage, current, temperature and other conditions for their circuit application and watch how the operating point of a device dynamically responds to these changes.
These interactive datasheets effectively offer a type of graphical user interface to a circuit simulator, using Nexperia’s advanced electrothermal models to calculate the operating point of a device. In addition, they allow engineers to visualize immediately the interaction between parameters such as gate voltage, drain current, RDS(on) and temperature. Their collective contribution to the device behavior is then displayed dynamically in tables or graphs. As a result, Nexperia’s interactive datasheets can significantly increase productivity by eliminating the time needed for an engineer to perform manual calculations or set up and debug a circuit simulation.
The datasheet is commonly the first port of call when a design engineer is looking to select a device for an application. However, while they contain a wealth of information, including the minimum, maximum and typical specifications across dozens of device parameters, it is often difficult to determine how these are interrelated. Consequently, engineers must perform time-consuming manual calculations or set up a circuit simulator using models provided by the manufacturer (assuming these are available) to thoroughly investigate a device’s behavior. Even then, many manufacturers’ simulation models do not show the effect of temperature changes on device behavior. The new interactive datasheets from Nexperia support engineers by showing real-time interaction across different parameters as they are manually changed with the easy-to-use datasheet sliders.
Chris Boyce, Senior Director of Nexperia’s Power MOSFET business adds, “Whether you are a Design Engineer looking to see how a device will perform at elevated temperature, or a Component Engineer trying to compare devices under different test conditions, our new interactive datasheets are designed to make your life easier.”
The technology powering these datasheets is the same as that used in Nexperia’s hugely successful precision electrothermal MOSFET models, which demonstrate how the behaviour of discrete MOSFETs changes with temperature. The new interactive datasheets are offered in addition to the traditional static datasheets and operate in any standard web browser without the requirement of additional software for device simulation.
With the initial version currently under patent application, Nexperia will be reaching out to its global community of customer engineers to evaluate how interactive datasheets are used in real-time in order to broaden the functionality of future versions.
More than 200 interactive datasheets are already available, covering the devices in Nexperia’s latest generations of Automotive and Industrial Power MOSFETs. Over time, the Company plans to make them available for its entire portfolio of discrete MOSFETs and other devices. Try a live interactive datasheet in action at nexperia.com/interactive-datasheet
Original – Nexperia
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DENSO CORPORATION (DENSO), a leading mobility supplier, and United Semiconductor Japan Co., Ltd. (“USJC”), a subsidiary of global semiconductor foundry United Microelectronics Corporation (“UMC”), announced a joint collaboration to produce insulated gate bipolar transistors (IGBT), which have entered mass production at the 300mm fab of USJC. A first shipment ceremony was held last week to mark this important milestone. It comes just one year after the companies announced a strategic partnership for this critical power semiconductor used in electric vehicles.
As adoption of electric vehicles accelerates, automakers are seeking to boost powertrain efficiency while also increasing cost-effectiveness of electrified vehicles. The jointly invested line at USJC supports the production of a new generation of IGBT developed by DENSO, which offers 20% reduction in power losses compared with earlier generation devices. Production is expected to reach 10,000 wafers per month by 2025.
The ceremony was held at USJC’s fab in Mie Prefecture, Japan. Attendees included by DENSO President Koji Arima, UMC Co-President Jason Wang, USJC President Michiari Kawano, Director-General of the Commerce and Information Policy Bureau at Japan’s Ministry of Economy, Trade and Industry (METI) Satoshi Nohara, Governor of Mie Prefecture Katsuyuki Ichimi, and Mayor of Kuwana City Narutaka Ito.
“Today, we are thrilled to welcome a memorable shipping ceremony that symbolizes the partnership between DENSO, UMC and USJC. We are from different cultures such as semiconductor industry and automobile industry. However, we have worked steadily with mutual respect which is a source of our strong competitiveness. DENSO, together with our trusted partners, will continue to further accelerate electrification through the production of competitive semiconductors in order to preserve the global environment and create a society full of smiles,” said Koji Arima, President of DENSO.
“USJC is proud to be the first semiconductor foundry in Japan to manufacture IGBT on 300mm wafers, offering customers greater production efficiency than the standard fabrication on 200mm wafers. Thanks to our dedicated teams and support from DENSO, we were able to complete trial production and reliability testing without delay and honor the mass production date as agreed with the customer,” said Michiari Kawano, President of USJC.
“It is an honor to be a strategic partner of DENSO, a leading automotive solution provider to global automakers. This collaboration fully demonstrates UMC’s manufacturing capability and our collaborative approach to ensure the success of our foundry customers,” said Jason Wang, Co-President of UMC. “The electrification and automation of cars will continue to drive up semiconductor content, particularly for chips manufactured using specialty foundry processes on 28nm and above nodes. As a specialty technology leader, UMC is well positioned to play a bigger role in the automotive value chain and enabling our partners to capture opportunities and win market share in this rapidly evolving industry.
Original – DENSO
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Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, introduced the SCALE-iFlex™ LT NTC family of IGBT/SiC module gate drivers. The new gate drivers target the popular new dual, 100 mm x 140 mm style of IGBT modules, such as the Mitsubishi LV100 and the Infineon XHP 2, as well as silicon carbide (SiC) variants thereof up to 2300 V blocking voltage. The SCALE-iFlex LT NTC drivers provide Negative Temperature Coefficient (NTC) data – an isolated temperature measurement of the power module – which enables accurate thermal management of converter systems. This is particularly important for systems with multiple modules arrayed in parallel, ensuring proper current sharing and dramatically enhancing overall system reliability.
Thorsten Schmidt, product marketing manager at Power Integrations, commented: “Designers of renewable energy and rail systems using SCALE-iFlex drivers already benefit from increased system performance; the SCALE-iFlex approach handles paralleling so expertly that one module in five can be eliminated without loss of performance or current de-rating. Adding an isolated NTC output reduces hardware complexity – particularly cables and connectors – and contributes to system observability and overall performance.”
Based on Power Integrations’ proven SCALE™-2 technology, SCALE-iFlex LT gate drivers improve current sharing accuracy and therefore increase the current carrying capability of multiple-paralleled modules by 20 percent, allowing users to significantly increase the semiconductor utilization of their converter stacks. This is possible because the localized control of each 2SMLT0220D MAG (Module Adapted Gate driver) unit ensures precise control and switching, enabling excellent current sharing. Advanced Active Clamping (AAC) is employed to deliver accurate overvoltage protection.
To further increase space saving, up to four MAG-driven power modules can be parallel-connected from a single 2SILT1200T Isolated Master Control (IMC) unit, which can also be mounted on a power module due to its compact outline. The gate drivers are fully qualified to IEC 61000-4-x (EMI), IEC-60068-2-x (environmental) and IEC-60068-2-x (mechanical) specifications, and undergo complete type testing – low voltage, high voltage, thermal cycling – shortening designer development time by 12 to 18 months. A comprehensive set of protection features is included, and parts are optionally available with conformal coating.
Original – Power Integrations
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Infineon Technologies AG, the global leader in automotive semiconductors, and Hon Hai Technology Group (“Foxconn”), the world’s largest electronics manufacturing services provider, aim to establish a long-term partnership in the field of electric vehicles (EV) to jointly develop advanced electromobility with efficient and intelligent features. The Memorandum of Understanding (MoU) focuses on silicon carbide (SiC) development, leveraging Infineon’s automotive SiC innovations and Foxconn’s know-how in automotive systems.
“The automotive industry is evolving. With the rapid growth of the EV market and the associated need for more range and performance, the development of electromobility must continue to advance and innovate,” said Peter Schiefer, President of the Infineon Automotive Division. “Infineon’s commitment and passion for innovation and zero-defect quality has made us the best partner for our customers. We look forward to writing a new chapter in electromobility together with Foxconn.”
“We are pleased to be working with Infineon and are confident that this collaboration will result in optimized architecture, product performance, cost competitiveness and high system integration to provide customers with the most competitive automotive solutions,” said Jun Seki, Foxconn’s Chief Strategy Officer for EVs.
According to the MoU, the two companies will collaborate on the implementation of SiC technology in automotive high-power applications like traction inverters, onboard chargers, and DC-DC converters. Both parties intend to jointly develop EV solutions with outstanding performance and efficiency based on Infineon’s automotive system understanding, technical support and SiC product offerings combined with Foxconn’s electronics design and manufacturing expertise and the capability of system-level integration.
In addition, the two companies plan to establish a system application center in Taiwan to further expand the scope of their cooperation. This center will focus on optimizing vehicle applications, including smart cabin applications, advanced driver assistance systems and autonomous driving applications. It will also address electromobility applications such as battery management systems and traction inverters. The collaboration covers a wide range of Infineon’s automotive products, including sensors, microcontrollers, power semiconductors, high-performance memories for specific applications, human machine interface and security solutions. The system application center is expected to be established within 2023.
Original – Infineon Technologies
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onsemi, a leader in intelligent power and sensing technologies, announced the release of the latest generation of 1200 V EliteSiC silicon carbide (SiC) M3S devices, which enable power electronics designers to achieve best-in-class efficiency and lower system cost. The new portfolio includes EliteSiC MOSFETs and modules that facilitate higher switching speeds to support the growing number of 800 V electric vehicle (EV) on-board charger (OBC) and energy infrastructure applications, such as EV charging, solar and energy storage systems.
Also, part of the portfolio, are new EliteSiC M3S devices in half-bridge power integrated modules (PIMs) with industry leading lowest Rds(on) in a standard F2 package. Targeting industrial applications, the modules are ideally suited for DC-AC, AC-DC and DC-DC high power conversion stages. They provide higher levels of integration with optimized direct bonded copper designs to enable balanced current sharing and thermal distribution between parallel switches. The PIMs are designed to deliver high power density in energy infrastructure, EV DC fast charging and uninterruptible power supplies (UPS).
“onsemi’s latest generation of automotive and industrial EliteSiC M3S products will allow designers to reduce their application footprint and system cooling requirements,” said Asif Jakwani, senior vice president and general manager of the Advanced Power Division, onsemi. “This helps designers to develop high power converters with higher levels of efficiency and increased power densities.”
The automotive-qualified 1200 V EliteSiC MOSFETs are tailored for high-power OBCs up to 22 kW and high voltage to low voltage DC-DC converters. M3S technology has been developed specifically for high-speed switching applications and has the best-in-class figure of merits for switching losses.
Original – onsemi
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LATEST NEWS / PRODUCT & TECHNOLOGY / SiC / TOP STORIES / WBGNavitas Launches into High-Power Markets with GeneSiC SiCPAK™ Modules and Accelerates Bare-Die Sales
May 8, 2023
2 Min ReadNavitas Semiconductor, the only pure-play, next-generation power semiconductor company, announced their expanded portfolio into higher power markets with their leading-edge silicon carbide (SiC) power products in SiCPAK™ modules and bare die.
Target applications cover centralized and string solar inverters, energy storage systems (ESS), industrial motion, electric vehicle (EV) on-board chargers, EV roadside fast chargers, wind energy, UPS, bi-directional microgrids, DC-DC converters, and solid-state circuit breakers.
Ranging from 650 V to 6,500 V, Navitas has the widest range of SiC technology. From an original line-up of discrete packages – from 8×8 mm surface-mount QFNs to through-hole TO-247s – the GeneSiC SiCPAK is an initial, direct entry point into higher-power applications. A comprehensive power-module roadmap, with high-voltage SiC MOSFETs and MPS diodes, GaN power ICs, high-speed digital isolators and low-voltage silicon control ICs is being mapped out.
Dr. Ranbir Singh, Navitas EVP for SiC noted, “With a complete portfolio of leading-edge power, control and isolation technology, Navitas will enable customers to accelerate the transition from fossil fuels, and legacy silicon power products to new, renewable energy sources and next-generation semiconductors, with more powerful, more efficient, faster-charging systems.”
SiCPAK™ modules employ ‘press-fit’ technology to offer compact form factors for power circuits and deliver cost-effective, power-dense solutions to end users. The modules are built upon GeneSiC die that have already made a mark in terms of superior performance, reliability, and ruggedness. Examples include a SiCPAK half-bridge module, rated at 6 mOhm, 1,200 V with industry-leading trench-assisted planar-gate SiC MOSFET technology. Multiple configurations of SiC MOSFETs and MPS diodes will be available to create application-specific modules for superior system performance. The initial release will include 1,200 V-rated half-bridge modules in 6, 12, 20, and 30mOhm ratings.
Within the lead-free SiCPAK, each SiC chip is silver (Ag) sintered to the module’s substrate for superior cooling and reliability. The substrate itself is ‘direct-bonded copper’ (DBC) and manufactured using an active-metal brazing (AMB) technique on silicon-nitride (Si3N4) ceramics, ideal for power-cycling applications. This construction delivers excellent strength and flexibility, fracture resistance, and good thermal conductivity for cool, reliable, long-life operation.
For customers who prefer to make their own high-power modules, all GeneSiC MOSFET and MPS diodes are available in bare die format, with gold (Au) and aluminum (Al) top-side metalizations.
Original – Navitas Semiconductor
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Transphorm, Inc. announced availability of its 1200 V FET simulation model and preliminary datasheet. The TP120H070WS FET is the only 1200 V GaN-on-Sapphire power semiconductor introduced to date, making its model the first of its kind. Its release indicates Transphorm’s ability to support future automotive power systems as well as three-phase power systems typically used in the broad industrial, datacom, and renewables markets. These applications will benefit from the 1200 V GaN device’s higher power density and reliability along with equal or better performance at more reasonable cost points versus alternative technologies.
Transphorm recently validated the GaN device’s higher performance ability in a 5 kW 900 V buck converter switching at 100 kHz. The 1200 V GaN device achieved 98.7% efficiency, exceeding that of a similarly rated production SiC MOSFET.
The innovative 1200 V technology also underscores Transphorm’s leadership in GaN power conversion. Vertical integration, epitaxy ownership, and patented process paired with decades of engineering expertise enable the company to bring to market the highest performing GaN device portfolio with four additional major differentiators: Manufacturability, Drivability, Designability, and Reliability.
Transphorm’s 1200 V technology is anchored in proven process and mature technology, satisfying customer confidence requirements. The GaN-on-Sapphire process is in volume production today in the LED market. Additionally, the 1200 V technology leverages the fundamentally superior, normally-off GaN platform used in Transphorm’s current device portfolio.
Key TP120H070WS device specifications include:
- 70 mΩ RDS(on)
- Normally off
- Efficient bidirectional current flow
- ± 20 Vmax gate robustness
- Low 4Vth gate drive noise immunity
- Zero QRR
- 3-lead TO-247 package
The Verilog-A device model is recommended for use with the SIMetrix Pro v8.5 Circuit Simulator. A LTSpice model is in development and will be released in Q4 2023. Simulation modeling allows for fast and efficient power system design validation while reducing design iterations, development time, and hardware investments.
The device model files and datasheet are available for download here: https://www.transphormusa.com/en/products/#models
1200 V FET samples are expected to be available by Q1 2024.
Original – Transphorm
