-
Orbray Co., Ltd. and MIRISE Technologies Corporation have begun collaborating on vertical diamond power devices that will contribute to carbon neutrality.
Over the three-year period of this project, Orbray and MIRISE Technologies will use their respective technologies, resources, and expertise in diamond substrates and power devices to develop the technologies needed to deploy vertical diamond power devices in a wide range of electric vehicles in the future.
In this research collaboration, Orbray will be responsible for developing a p-type conductive diamond substrate, while MIRISE Technologies will take charge of developing a high-voltage operating device structure to demonstrate the feasibility of a vertical diamond power device. At the end of this project, the companies are planning to discuss the next stage of collaboration, such as further research and development.
As the automobile industry increasingly shifts to electric vehicles worldwide to achieve carbon neutrality, the development of next-generation automotive semiconductors is essential to improve the fuel efficiency and power consumption of electric vehicles, and reduce battery costs. Compared with current mainstream semiconductor materials such as Si (silicon), SiC (silicon carbide), and GaN (gallium nitride), diamond is known as the “ultimate semiconductor material” because it has higher voltage operating capability and superior thermal conductivity (heat dissipation). In the future, the development and mass production of next-generation automotive semiconductors using diamond is expected to improve the fuel efficiency and power consumption of electric vehicles, and reduce battery costs.
Orbray and MIRISE Technologies will leverage their respective strengths to develop next-generation in-vehicle semiconductors through vertical power devices, and thereby contribute to carbon neutrality.
Original – Orbray
-
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, introduced the SCALE-iFlex™ LT NTC family of IGBT/SiC module gate drivers. The new gate drivers target the popular new dual, 100 mm x 140 mm style of IGBT modules, such as the Mitsubishi LV100 and the Infineon XHP 2, as well as silicon carbide (SiC) variants thereof up to 2300 V blocking voltage. The SCALE-iFlex LT NTC drivers provide Negative Temperature Coefficient (NTC) data – an isolated temperature measurement of the power module – which enables accurate thermal management of converter systems. This is particularly important for systems with multiple modules arrayed in parallel, ensuring proper current sharing and dramatically enhancing overall system reliability.
Thorsten Schmidt, product marketing manager at Power Integrations, commented: “Designers of renewable energy and rail systems using SCALE-iFlex drivers already benefit from increased system performance; the SCALE-iFlex approach handles paralleling so expertly that one module in five can be eliminated without loss of performance or current de-rating. Adding an isolated NTC output reduces hardware complexity – particularly cables and connectors – and contributes to system observability and overall performance.”
Based on Power Integrations’ proven SCALE™-2 technology, SCALE-iFlex LT gate drivers improve current sharing accuracy and therefore increase the current carrying capability of multiple-paralleled modules by 20 percent, allowing users to significantly increase the semiconductor utilization of their converter stacks. This is possible because the localized control of each 2SMLT0220D MAG (Module Adapted Gate driver) unit ensures precise control and switching, enabling excellent current sharing. Advanced Active Clamping (AAC) is employed to deliver accurate overvoltage protection.
To further increase space saving, up to four MAG-driven power modules can be parallel-connected from a single 2SILT1200T Isolated Master Control (IMC) unit, which can also be mounted on a power module due to its compact outline. The gate drivers are fully qualified to IEC 61000-4-x (EMI), IEC-60068-2-x (environmental) and IEC-60068-2-x (mechanical) specifications, and undergo complete type testing – low voltage, high voltage, thermal cycling – shortening designer development time by 12 to 18 months. A comprehensive set of protection features is included, and parts are optionally available with conformal coating.
Original – Power Integrations
-
onsemi, a leader in intelligent power and sensing technologies, announced the release of the latest generation of 1200 V EliteSiC silicon carbide (SiC) M3S devices, which enable power electronics designers to achieve best-in-class efficiency and lower system cost. The new portfolio includes EliteSiC MOSFETs and modules that facilitate higher switching speeds to support the growing number of 800 V electric vehicle (EV) on-board charger (OBC) and energy infrastructure applications, such as EV charging, solar and energy storage systems.
Also, part of the portfolio, are new EliteSiC M3S devices in half-bridge power integrated modules (PIMs) with industry leading lowest Rds(on) in a standard F2 package. Targeting industrial applications, the modules are ideally suited for DC-AC, AC-DC and DC-DC high power conversion stages. They provide higher levels of integration with optimized direct bonded copper designs to enable balanced current sharing and thermal distribution between parallel switches. The PIMs are designed to deliver high power density in energy infrastructure, EV DC fast charging and uninterruptible power supplies (UPS).
“onsemi’s latest generation of automotive and industrial EliteSiC M3S products will allow designers to reduce their application footprint and system cooling requirements,” said Asif Jakwani, senior vice president and general manager of the Advanced Power Division, onsemi. “This helps designers to develop high power converters with higher levels of efficiency and increased power densities.”
The automotive-qualified 1200 V EliteSiC MOSFETs are tailored for high-power OBCs up to 22 kW and high voltage to low voltage DC-DC converters. M3S technology has been developed specifically for high-speed switching applications and has the best-in-class figure of merits for switching losses.
Original – onsemi
-
Texas Instruments (TI), a leader in high-voltage technology, debuted a highly integrated, functional safety-compliant, isolated gate driver that enables engineers to design more efficient traction inverters and maximize electric vehicle (EV) driving range. The new UCC5880-Q1 reinforced isolated gate driver offers features that enable EV powertrain engineers to increase power density and reduce system design complexity and cost while achieving their safety and performance goals.
As EVs continue to grow in popularity, semiconductor innovations in traction inverter systems are helping overcome critical barriers to widespread adoption. Automakers can build safer, more efficient and more reliable silicon carbide (SiC)- and insulated-gate bipolar transistor (IGBT)-based traction inverters by designing with UCC5880-Q1, featuring real-time variable gate-drive strength, Serial Peripheral Interface (SPI), advanced SiC monitoring and protection, and diagnostics for functional safety.
“Designers of high-voltage applications like traction inverters face a unique set of challenges to optimize system efficiency and reliability in a small space,” said Wenjia Liu, product line manager for high-power drivers at TI. “Not only does this new isolated gate driver help enable engineers to maximize driving range, but it also integrates safety features to reduce external components and design complexity. And it can be easily paired with other high-voltage power-conversion products such as our UCC14141-Q1 isolated bias supply module to improve power density and help engineers reach the highest levels of traction inverter performance.”
The need for higher reliability and power performance for EVs is continuously growing, as efficiency gains have a direct impact on operating range improvement per charge. But achieving any increase in efficiency is difficult for designers, given that the majority of traction inverters already operate at 90% efficiency or higher.
By varying the gate-drive strength in real time, in steps between 20 A and 5 A, designers can improve system efficiency with the UCC5880-Q1 gate driver as much as 2% by minimizing SiC switching power losses, resulting in up to 7 more miles of EV driving range per battery charge. For an EV user who charges their vehicle three times per week, that could mean more than 1,000 additional miles per year. To learn more, read the technical article, “How to Maximize SiC Traction Inverter Efficiency with Real-Time Variable Gate Drive Strength.”
In addition, the UCC5880-Q1’s SPI programmability and integrated monitoring and protection features can reduce design complexity as well as external component costs. Engineers can further reduce components and quickly prototype a more efficient traction inverter system using the SiC EV Traction Inverter Reference Design. This customizable, tested design includes the UCC5880-Q1, a bias-supply power module, real-time control MCUs and high-precision sensing.
Original – Texas Instruments
-
LATEST NEWS / PRODUCT & TECHNOLOGY / SiC / TOP STORIES / WBGNavitas Launches into High-Power Markets with GeneSiC SiCPAK™ Modules and Accelerates Bare-Die Sales
May 8, 2023
2 Min ReadNavitas Semiconductor, the only pure-play, next-generation power semiconductor company, announced their expanded portfolio into higher power markets with their leading-edge silicon carbide (SiC) power products in SiCPAK™ modules and bare die.
Target applications cover centralized and string solar inverters, energy storage systems (ESS), industrial motion, electric vehicle (EV) on-board chargers, EV roadside fast chargers, wind energy, UPS, bi-directional microgrids, DC-DC converters, and solid-state circuit breakers.
Ranging from 650 V to 6,500 V, Navitas has the widest range of SiC technology. From an original line-up of discrete packages – from 8×8 mm surface-mount QFNs to through-hole TO-247s – the GeneSiC SiCPAK is an initial, direct entry point into higher-power applications. A comprehensive power-module roadmap, with high-voltage SiC MOSFETs and MPS diodes, GaN power ICs, high-speed digital isolators and low-voltage silicon control ICs is being mapped out.
Dr. Ranbir Singh, Navitas EVP for SiC noted, “With a complete portfolio of leading-edge power, control and isolation technology, Navitas will enable customers to accelerate the transition from fossil fuels, and legacy silicon power products to new, renewable energy sources and next-generation semiconductors, with more powerful, more efficient, faster-charging systems.”
SiCPAK™ modules employ ‘press-fit’ technology to offer compact form factors for power circuits and deliver cost-effective, power-dense solutions to end users. The modules are built upon GeneSiC die that have already made a mark in terms of superior performance, reliability, and ruggedness. Examples include a SiCPAK half-bridge module, rated at 6 mOhm, 1,200 V with industry-leading trench-assisted planar-gate SiC MOSFET technology. Multiple configurations of SiC MOSFETs and MPS diodes will be available to create application-specific modules for superior system performance. The initial release will include 1,200 V-rated half-bridge modules in 6, 12, 20, and 30mOhm ratings.
Within the lead-free SiCPAK, each SiC chip is silver (Ag) sintered to the module’s substrate for superior cooling and reliability. The substrate itself is ‘direct-bonded copper’ (DBC) and manufactured using an active-metal brazing (AMB) technique on silicon-nitride (Si3N4) ceramics, ideal for power-cycling applications. This construction delivers excellent strength and flexibility, fracture resistance, and good thermal conductivity for cool, reliable, long-life operation.
For customers who prefer to make their own high-power modules, all GeneSiC MOSFET and MPS diodes are available in bare die format, with gold (Au) and aluminum (Al) top-side metalizations.
Original – Navitas Semiconductor
-
Magnachip Semiconductor Corporation (“Magnachip” or “Company”) announced that the Company has released a new family of 600V Super Junction Metal Oxide Semiconductor Field Effect Transistors (SJ MOSFETs) consisting of nine distinct products featuring proprietary design technology.
Magnachip’s proprietary design provides specific on-resistance (RSP) reduction of about 10%, and this result was achieved while maintaining the same cell-pitches of previous generation MOSFETs.
In addition, the new product family of 600V SJ MOSFETs is equipped with a fast recovery body diode. This diode technology significantly enhances system efficiency with reduced reverse recovery time (trr) and switching loss. Therefore, the figure of merit to evaluate general performance of MOSFETs was improved by more than 10% compared to the previous generation. As such, these 600V SJ MOSFETs can be used widely in industrial applications, such as solar inverters, energy storage systems, uninterruptible power supply systems, and a variety of electronics.
Among these new MOSFETs, the MMQ60R044RFTH product offers an exceptionally low RDS(on) of 44mΩ, making it an optimal choice for electric vehicle chargers and servers. Omdia, a global market research firm, estimates that the compound annual growth rates of Si MOSFET markets for hybrid & electric vehicles and servers will be 11% and 7%, respectively, from 2023 to 2026.
“Now that we have introduced these 600V SJ MOSFET products, we are aiming to unveil new 650V and 700V SJ MOSFET products with fast recovery body diode in the second half of 2023,” said YJ Kim, CEO of Magnachip. “These new MOSFETs represent a notable achievement for the Company, and we will build upon this success to deliver next-generation power solutions for rapidly changing market requirements and customer expectations.”
Original – Magnachip Semiconductor
-
Henkel announced the addition of Loctite Ablestik ABP 8068TI to its growing portfolio of high thermal die attach adhesives. With 165 W/m-K thermal conductivity, the new pressure-less sintering die attach paste boasts the highest thermal capability in the company’s semiconductor packaging portfolio, meeting performance requirements for high-reliability automotive and industrial power discrete semiconductor devices.
“High voltage applications like those found in automotive ADAS systems, EVs, industrial motor controls, and high-efficiency power supplies require superior electrical and thermal performance,” says Henkel’s Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran Trichur. “Currently, the only viable die attach alternative to Pb solder – which will soon be phased out and cannot meet certain thermal demands – is sintered silver (Ag). Henkel pioneered pressure-less sintering die attach, allowing the use of standard, low-stress processing, and we have now formulated our fourth and highest thermal conductivity material to date, which tackles the stringent thermal and electrical requirements of next-generation power packages.”
Henkel’s newest pressure-less sintering die attach formulation meets multiple metrics for power semiconductors like MOSFETs, which are increasingly incorporating silicon carbide (SiC) and gallium nitride (GaN) materials as alternatives to silicon (Si) for improved efficiency. Loctite Ablestik ABP 8068TI is compatible with traditional Si and newer wide-bandgap semiconductors, among other power discrete devices. The 165 W/m-K ultra-high thermal conductivity die attach adhesive has demonstrated excellent sintering properties with good adhesion on copper (Cu), pre-plated frames (PPF), silver (Ag), and gold (Au) lead frames, robust electrical conductivity and stable RDS(on) after 1,000 hours of thermal cycling, and MSL 3 reliability.
Recommended for dies measuring 3.0 mm x 3.0 mm or smaller, Loctite Ablestik ABP 8068TI fully cures at 175° C or above to form a rigid sintered Ag network in the bulk epoxy and at the interface. Because pressure-less sintering is a drop-in replacement for standard die attach, high pressure is not required to achieve this robust structure, eliminating stress on thin die. Workability of the material is also notable at three hours of void-free open time and 24 hours of stage time with no degradation in shear strength.
As Trichur concludes, the power device market will only accelerate in application uses and performance requirements, making high-capability, high thermal die attach solutions an operational necessity: “There is an increased demand for power devices across market sectors, including automotive, industrial power storage and conversion, and aerospace, to name a few. For power semiconductors, sintered die attach is the prevailing and most reliable solution to deliver the die attach strength, integrity, and thermal and electrical conductivity required. Loctite Ablestik ABP 8068TI provides all this in a formula that enables simple processing to protect thinner, more complex dies.”
Original – Henkel
-
Alpha and Omega Semiconductor Limited (AOS) announced the release of 600V αMOS7™ Super Junction MOSFETs Family. αMOS7™ is AOS’ next generation high voltage MOSFET, designed to meet the high efficiency and high-density needs of servers, workstations, telecom rectifiers, solar Inverters, EV charging, motor drives and industrial power applications.
Today’s Server power supply requires Titanium efficiency, which translates to more than 98.5% peak efficiency on both PFC and LLC stages. Active-Bridges and Bridgeless designs are easy-to-implement solutions; however, switching and driving losses, especially at light load, are still the main problems designers face. Existing technologies limited by large cell pitches and charges could hardly meet such requirements.
Next-gen SJ technologies with reduced charge but also enough robustness is in demand. Low Qrr and Trr for LLC and PSFB applications are also a must during transient and abnormal situations. AOS αMOS7™ High Voltage SJ MOSFET is the best answer for above needs.
For Solar applications, low ohmic SMD devices are becoming the new standards, aiming for reduced form factors through utilizing 3D mechanical and thermal designs. αMOS7™ provides a wide Rdson granularity and SMD package choices, such as DFN, TOLL, and Top-cooling variants.
For low Fsw applications such as Solid-State Relays or Active Bridges, FETs must meet specific SOA requirements to sustain surge and in-rush currents. αMOS7™ ensures low Rdson’s temperature coefficient and ruggedness for transient voltage and current overstresses.
The first product released – AOK050V60A7 is a 600V 50mOhm αMOS7 low ohmic device with the industry-standard TO-247 package tailored for today’s high-power AC/DC, DC/DC, and Solar Inverter stages. As the EU ERP Lot9 regulation pushes the efficiency of single PSUs to Titanium level, AOS αMOS7™ 600V low ohmic family provides an ideal solution for single, interleaved, dual boost, totem-pole, and Vienna PFCs, as well as other hard-switching topologies. The optimized capacitance of AOK050V60A7 will provide customers excellent switching performances, with fast turn-on/turn-off behaviors, while avoiding the risks of self-turn-on or shoot-through. The 50mohm device will be followed by our upcoming 32mohm, 40mohm, 65mohm, and 105mohm devices.
“The new charge balance structure makes it possible to further reduce the active area up to 50%, compared to αMOS5™, our existing solution. In general, αMOS7™ is an industry-leading high voltage SJ solution designed to address both efficiency driven and cost-driven markets,” said Richard Zhang, Senior Director of Product Line and Global Power Supply businesses at AOS.
Technical Highlights:
- Low Ohmic device with ultra-low switching losses
- Rugged Body Diode and FRD options (Reduced Qrr) available for more demanding use cases
- Rugged SOA and in-rush current capability for Solid-State Relay and Active Bridge applications
- Optimized for both High Power and Low Power SMPSes, Solar Inverters, and EV DC Charging applications
Original – Alpha and Omega Semiconductor
-
Infineon Technologies AG launched a new automotive power module: The HybridPACK™ Drive G2. It builds on the well-established HybridPACK Drive G1 concept of an integrated B6 package, offering scalability within the same footprint and extending it to higher power and ease-of-use. The HybridPACK Drive G2 will be available with different current ratings, voltage levels (750V and 1200V) and Infineon’s next generation chip technologies EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET.
With a power range of up to 300 kW within the 750 V and 1200 V classes, the HybridPACK Drive G2 provides high ease-of-use and new features, such as an integration option for next-generation phase current sensor and on-chip temperature sensing, which enable system cost improvements. The power module achieves higher performance and power density through improved assembly and interconnect technology. The adoption of new interconnect technology (chip sintering) and of new materials (new black plastic housing) enables higher temperature rating, resulting in higher performance and longer product life.
The first generation (G1) of HybridPACK Drive was introduced in 2017, using silicon EDT2 technology. It offers a power range of 100 kW to 180 kW in the 750 V class. In 2021, Infineon expanded its product family with the first generation of HybridPACK Drive Automotive CoolSiC MOSFETs, which allowed the inverter design to achieve higher power up to 250 kW within the 1200 V class, longer driving range, smaller battery size and optimized system size and cost. With a track record of nearly 3 million units sold in various global electric vehicle platforms, the HybridPACK Drive is now Infineon’s market-leading power module.
The lead products (FS1150R08, FS01MR08, FS02MR12) of the new HybridPACK Drive G2 are in production and will be available starting May 2023, with additional product variants to follow in 2023 and 2024. More information is available at www.infineon.com/hybridpackdrive.
Original – Infineon Technologies
-
Infineon Technologies AG and Schweizer Electronic AG are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC). Both partners are developing a solution to embed Infineon’s 1200 V CoolSiC™ chips directly onto printed circuit boards (PCB). This will increase the range of electric vehicles and reduce the total system costs.
The two companies have already demonstrated the potential of this new approach: They were able to embed a 48 V MOSFET in the PCB. This resulted in a 35 percent increase in performance. SCHWEIZER contributes to this success with its innovative p²Pack® solution which enables power semiconductors to be embedded in PCBs.
“Our joint goal is to take automotive power electronics to the next level,” said Robert Hermann, Product Line Head Automotive High-Voltage Discretes and Chips, of Infineon. “The low-inductive environment of a PCB allows clean and fast switching. Combined with the leading performance of 1200 V CoolSiC™ devices, chip embedding enables highly integrated and efficient inverters that reduce overall system costs.”
“With Infineon’s 100 percent electrically tested standard cells (S-Cell), we can achieve high overall yields in the p² Pack manufacturing process,” said Thomas Gottwald, Vice President Technology at Schweizer Electronic AG. “The fast-switching characteristics of the CoolSiC chips are optimally supported by the low-inductance interconnection that can be achieved with the p² Pack. This leads to increased efficiency and improved reliability of power conversion units such as traction inverters, DC-DC converters, or on-board chargers.”
Original – Infineon Technologies
