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Hitachi, Ltd. has signed an agreement to transfer all shares of its wholly owned subsidiary, Hitachi Power Semiconductor Device, to MinebeaMitsumi Inc. for further growth and corporate value enhancement of Hitachi Power Semiconductor Device.
Hitachi Power Semiconductor Device was established in October 2013 for the purpose of structuring an integrated system from design and manufacturing to sales in power semiconductor business by integrating the business of Hitachi and Hitachi Haramachi Electronics Co.
Since then, Hitachi Power Semiconductor Device has been providing high value-added products utilizing high-voltage and low-loss technologies in the field of power semiconductors, which are key devices in the electrification and motorization of industry and social infrastructure, with “IGBT/SiC”, “High Voltage IC” and ” Diodes” as its three main product categories. Hitachi Power Semiconductor Device is focusing on IGBT/SiC products in the market areas where high growth is expected toward the realization of a decarbonized society, such as electric vehicles and inverters for wind power generators, in addition to railroad applications, utilizing the strength of the high durability and reliability cultivated in railroad applications.
Many customers in Japan and overseas have adopted IGBT/SiC made by Hitachi Power Semiconductor Device. In the area of high-voltage ICs for industrial and home appliance applications, Hitachi Power Semiconductor Device is contributing to efficiency improvement and noise reduction in customers’ systems through motor control technology and software based on the knowledge it has gained from providing products for a wide range of fields. Furthermore, Hitachi Power Semiconductor Device provides diodes for automotive applications, which require high reliability, for a long period of time.
Hitachi and Hitachi Power Semiconductor Device have held many discussions on measures to achieve further growth and enhance the corporate value of Hitachi Power Semiconductor Device. As a result of the discussion, we have reached a conclusion that the best way for Hitachi Power Semiconductor Device to continue its growth in the power semiconductor market, which is expected a high growth in the future, is to expand its production capacity and improve manufacturing efficiency under MinebeaMitsumi, which positions the analog semiconductor business as one of its core businesses.
Under MinebeaMitsumi, with whom Hitachi Power Devices has been collaborating for many years, Hitachi Power Semiconductor Device will further enhance its strengths in high-voltage, low-loss technologies, expand its production capacity and improve manufacturing efficiency to provide higher value-added products in larger quantities to markets and customers, thereby aiming for further growth and corporate value enhancement.
Hitachi will strive to further enhance its corporate value by leveraging the funds obtained from this share transfer for investment in growth of green and service business in the energy field.
Original – Hitachi
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Texas Instruments (TI) broke ground on its new 300-mm semiconductor wafer fabrication plant (or “fab”) in Lehi, Utah. Joined by Utah Governor Spencer Cox, state and local elected officials, as well as community leaders, TI President and Chief Executive Officer Haviv Ilan celebrated the first steps toward construction of the new fab, LFAB2, which will connect to the company’s existing 300-mm wafer fab in Lehi. Once completed, TI’s two Utah fabs will manufacture tens of millions of analog and embedded processing chips every day at full production.
“Today we take an important step in our company’s journey to expand our manufacturing footprint in Utah. This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” said Ilan. “At TI, our passion is to create a better world by making electronics more affordable through semiconductors. We are proud to be a growing member of the Utah community, and to manufacture analog and embedded processing semiconductors that are vital for nearly every type of electronic system today.”
In February, TI announced its $11 billion investment in Utah, marking the largest economic investment in state history. LFAB2 will create approximately 800 additional TI jobs as well as thousands of indirect jobs, with first production available as early as 2026.
“TI’s growing manufacturing presence in Utah will be transformative for our state, creating hundreds of good-paying jobs for Utahns to manufacture critically important technology,” said Utah Governor Spencer Cox. “We are proud that semiconductors – made in Utah by Utahns – will power the innovation that is foundational to our country’s economic and national security.”
As part of TI’s commitment to education, the company will invest $9 million dollars in the Alpine School District to develop the state’s first Science, Technology, Engineering and Math (STEM) learning community for all students in kindergarten through 12th grade. The multiyear program will embed STEM concepts more deeply into coursework for the district’s 85,000 students and provide STEM-oriented professional development for its teachers and administrators. The district-wide program will equip students with essential STEM skills, such as critical thinking, collaboration and creative problem-solving to succeed after graduation.
“We are excited this partnership will help our students develop essential knowledge and skills, preparing them for success in life and possible careers in the technology sector,” said Alpine School District Superintendent, Dr. Shane Farnsworth. “Working together with the city of Lehi, Texas Instruments, and our schools, this collaborative investment will impact students and their families for many generations to come.”
TI has a long-standing commitment to responsible, sustainable manufacturing. LFAB2 will be one of the company’s most environmentally efficient wafer fabs, designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold version 4.
LFAB2 has a goal to be powered by 100% renewable electricity, and advanced 300-mm equipment and processes in Lehi will further reduce waste, water and energy consumption. In fact, LFAB2 is expected to recycle water at nearly twice the rate of TI’s existing fab in Lehi.
LFAB2 will complement TI’s existing 300-mm wafer fabs, which include LFAB1 (Lehi, Utah), DMOS6 (Dallas), and RFAB1 and RFAB2 (both in Richardson, Texas). TI is also building four new 300-mm wafer fabs in Sherman, Texas (SM1, SM2, SM3 and SM4), with production from the first fab as early as 2025.
TI’s manufacturing expansions, with anticipated support from the CHIPS and Science Act, will provide reliable supply of analog and embedded processing products. These investments in manufacturing and technology illustrate the company’s commitment to long-term capacity planning.
Original – Texas Instruments
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DENSO CORPORATION hosted a press conference at JAPAN MOBILITY SHOW 2023 held at Tokyo Big Sight on October 26. Shinnosuke Hayashi, President and COO introduced the strategy to maximize company’s contributions to “Green” and “Peace of Mind.”
Shinnnouke Hayashi, President and COO of DENSO CORPORATION said that it is a great pleasure that the Tokyo Motor Show, which has attracted much public attention for decades, has been renamed the JAPAN MOBILITY SHOW. This change reflects the fact that we are entering an era of creating new value by addressing various issues from the viewpoint of a mobility-centered society instead of just vehicles and by connecting people and technologies across industries. This means that DENSO must meet major challenges.
To evolve from “a Tier 1 supplier that supports the auto industry “to “a Tier 1 supplier that supports a mobility-centered society” to create value for more diverse customers, the company addresses three intiatives. To promote these three initiatives, DENSO will recruit new employees in the electrification and software field and actively shift the employees from the mature field to the electrification and software fields and strengthen about 4,000 employees during the four years from 2022 to 2025.- The contribution to the “evolution of mobility”
In the “Green” field, “the environment”, in addition to the product lineup in the “horizontal” direction to enable installation in HEVs, PHEVs, BEVs, and FCEVs, the lineup will be expanded in the “vertical” direction ranging from large systems, which link electrification products with energy management, to components, including power modules, thereby meeting the needs of various customers as BEVs proliferate and helping to achieve carbon neutrality in respective countries. In the “Peace of Mind” field, “worry-free society”, in addition to around-vehicle monitoring systems, DENSO will focus on driver status monitoring systems and cloud-based large systems, which connect with the social infrastructure. Through these efforts, the company will help eliminate fatalities.
Furthermore, DENSO will extend its commitment to the evolution of mobility to the sky to help realize more freedom of traveling and expand the possibilities of mobility.
- The challenge to “to create new value”
DENSO has been studying the possibility of developing and commercializing many technologies in non-mobility fields, including energy, food and agriculture, and the circular economy. Specifically, the company plans to market energy system products such as Solid Oxide Electrolysis Cell and Solid Oxide Fuel Cell in 2024 and beyond.
- Strengthening semiconductors and software
In terms of semiconductors, DENSO will actively invest about 500 billion yen by 2030. DENSO will triple the scale of the business from the current level by 2035. To expand production, the company must ensure stable procurement of materials. Thus, DENSO will forge strategic partnerships with various companies.
In the softaware field, the implementation phase to embody concepts, the company will accelerate the planning of electronic platform and over-the-air technology development based on user needs while strengthening partnerships with various customers and promote integrated development across companies. DENSO will increase the number of software engineers and improve their skills and integrate two group companies which have excellent proprietary technologies, into DENSO. One is NSITEXE, which specializes in the semiconductor intellectual property, and the other is AUBASS, which specializes in developing basic in-vehicle software. DENSO will double the speed of development by applying specialized AI, which incorporates company’s knowledge and experience gained through in-vehicle software.
Original – DENSO
- The contribution to the “evolution of mobility”
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Infineon Technologies AG announced the closing of the acquisition of GaN Systems Inc. (“GaN Systems”). The Ottawa-based company brings with it a broad portfolio of gallium nitride (GaN)-based power conversion solutions and leading-edge application know-how. All required regulatory clearances have been obtained and GaN Systems has become part of Infineon effective as of the closing.
“GaN technology is paving the way for more energy-efficient and CO 2-saving solutions that support decarbonization,” said Jochen Hanebeck, CEO of Infineon. “The acquisition of GaN Systems significantly accelerates our GaN roadmap and further strengthens Infineon’s leadership in power systems through mastery of all relevant power semiconductor technologies. We welcome our new colleagues from GaN Systems to Infineon.”
Infineon now has a total of 450 GaN experts and more than 350 GaN patent families, which expands the company’s leading position in power semiconductors and considerably speeds up time-to-market. Both companies’ complementary strengths in IP and application understanding as well as a well-filled customer project pipeline put Infineon in an excellent position to address various fast-growth applications.
On 2 March 2023, Infineon and GaN Systems announced that the companies had signed a definitive agreement under which Infineon would acquire GaN Systems for US$830 million. The acquisition, an all-cash transaction, was funded from existing liquidity.
Original – Infineon Technologies
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onsemi announced the completed expansion of its state-of-the-art, world-largest silicon carbide (SiC) fabrication facility in Bucheon, South Korea. At full capacity, this fab will be able to manufacture more than one million 200 mm SiC wafers per year.
To support the ramp in SiC manufacturing capacity, onsemi plans to hire up to 1,000 local employees over the next three years to fill the mostly highly technical positions – a more than 40% increase over the present workforce of about 2,300.
Silicon carbide devices are a critical component for power conversion in electric vehicles (EVs), energy infrastructure and high-power EV chargers. The rapidly growing demand for these products has created a surge in demand for SiC chips, with demand outpacing supply for the foreseeable future. The expansion of the Bucheon fab addresses the pressing need for additional production capacity, allowing onsemi to continue to provide supply assurance for its customers and strengthen its leadership in intelligent power solutions.
Construction of the new advanced 150 mm/200 mm SiC fab line along with the high-tech utility building and adjacent parking garage began in the middle of 2022 and was completed in September 2023. The expansion of the 150 mm/200 mm SiC Epi and wafer fab emphasizes onsemi’s focus on building out its vertically integrated silicon carbide manufacturing supply chain at brownfield locations. The Bucheon SiC line is starting with the production of 150 mm wafers and will be converted to 200 mm in 2025 upon qualification of the 200 mm SiC process.
onsemi’s leadership was joined by a delegation of dignitaries led by Vice Governor for Economy of the Gyeonggi-Do Taeyoung Yeom; followed by Bucheon City Mayor YongEek Cho; National Assembly delegates; and Bucheon Chamber of Commerce and Industry Chairman JongHuem Kim. Also in attendance were representatives from local communities, customers, suppliers and the semiconductor industry.
onsemi CEO Hassane El-Khoury opened the event, noting, “The 150 mm/200 mm SiC wafer fab in Bucheon is critical to the continued success of our fully integrated SiC supply chain, enabling us to support the acceleration of electrification globally. The last five years have shown what extraordinary performance our Bucheon team is capable of, and what we can achieve when we work together with governmental agencies toward the common goal of a more sustainable future.”
“I am truly impressed by onsemi’s diligent and yet fast execution of its strategic plan to expand the Bucheon SiC wafer fab,” said Bucheon City Mayor YongEek Cho. “Not only will the city of Bucheon benefit from the creation of new employment opportunities in technology, but it will also be a part of laying the foundation for a sustainable ecosystem through electrification.”
Original – onsemi
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Mitsubishi Electric Corporation announced that it played the key role in leading the project to draft the 2023 International Electrotechnical Commission (IEC) White Paper entitled “Power Semiconductors for an Energy-Wise society,” which the IEC released on October 17. This is the first time for a White Paper, published annually since 2010, to issue recommendations for developing and expanding international standards and certification systems for power semiconductors.
Each year, the IEC White Paper focuses on electrical, electronic and electromechanical technologies requiring international standardization, and makes related recommendations to the IEC and other organizations.
Power semiconductors, one of Mitsubishi Electric’s core product lines, are expected to continue to advance technologically and be increasingly adopted as key devices that reduce power consumption and efficiently convert electrical energy, supporting the global drive toward carbon neutrality by 2050.
New materials such as silicon carbide (SiC) are being used in advanced power semiconductors for applications such as renewable energy and electric vehicles (EVs), but the development of international standards and certification systems for such devices is lagging. A lack of such standards and certifications could lead to a proliferation of nonconforming products and impede cooperation among manufacturers, users and regulators, thereby hindering the healthy growth of the power semiconductor global market.
In response, Mitsubishi Electric initiated a White Paper project within the IEC Market Strategy Board (MSB) in October 2022. Together with experts from around the world, the project team addressed issues related to power semiconductor technologies, markets, and regulations.
The resulting White Paper summarizes the applications, sectors and technological trends of power semiconductors and highlights the need for the development, alignment, and expansion of respective international standards and certification systems. In particular, the White Paper focuses on the critical role that power semiconductor standards can play in helping to realize emission-free, carbon-neutral industries for a healthier and more prosperous world.
The main points of the 2023 IEC White Paper include:
- Current status and future trends of society, markets, and technologies related to power semiconductors and applications that are essential for realizing an “Energy-Wise society” in which energy is used wisely and efficiently.
- Challenges facing the power semiconductor industry and solutions for achieving carbon neutrality by 2050 through an integrated approach involving relevant regulatory, industry and international standardization organizations around the globe.
- Recommendations for international standardization bodies, particularly the IEC, to establish a roadmap and guidelines for the development of international standards and conformity assessment systems for power semiconductors.
The White Paper project team was led by Dr. Kazuhiko Tsutsumi, Mitsubishi Electric’s specially appointed technical advisor who also serves as IEC Vice President and Chair of the MSB, and included experts from Mitsubishi Electric’s Corporate Intellectual Property Division (Tokyo), Mitsubishi Electric’s Power Device Works (Fukuoka), Mitsubishi Electric Europe B.V. German Branch (Ratingen, Germany), as well as a team of international experts.
Going forward, Mitsubishi Electric will collaborate with power semiconductor companies, users, and regulatory authorities to establish a roadmap for the creation of power semiconductor international standards as recommended in the 2023 IEC White Paper, with the aim of promoting the healthy growth of the power semiconductor market in the quest for carbon neutrality by 2050.
Original – Mitsubishi Electric
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LATEST NEWS / PROJECTS / TOP STORIESSamsung Electronics to Provide Service Across a Variety of Solutions, Including Power Semiconductors
October 19, 2023
3 Min ReadSamsung Electronics hosted Samsung Foundry Forum (SFF) 2023 Europe and unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer process to the 8-inch legacy process.
Alongside its customers and Samsung Advanced Foundry Ecosystem (SAFE) partners, Samsung Electronics showcased the latest technological trends and its business strategy tailored to the European market.
“Samsung Foundry is driving innovation in next-generation solutions to build an expanded portfolio that meets the growing needs of our automotive customers, especially as the era of electric vehicles becomes a reality,” said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. “We are strengthening our readiness to provide customers with distinguished service across a variety of solutions, including power semiconductors, microcontrollers and advanced AI chips for autonomous driving.”
Since participating in IAA Mobility 2023 for the first time in September, Samsung Electronics is strengthening engagement and partnership in specialty processes for automotive customers in the European market, further solidifying its status as a leading foundry partner for the industry.
Pioneering New Applications With Industry’s Most Advanced eMRAM
In order to meet the needs of the latest advancements in the automotive market, Samsung is setting out to develop the industry’s first 5-nanometer eMRAM for next-generation automotive technology. eMRAM is a next-generation memory semiconductor used for automotive applications that enables high read and write speeds as well as superior heat resistance.
Since developing and mass producing the industry’s first 28nm FD-SOI based eMRAM in 2019, Samsung Electronics has been developing 14nm for the FinFET process based on AEC-Q100 Grade 1. Samsung Foundry plans to expand its eMRAM portfolio by adding 14nm by 2024, 8nm by 2026, and 5nm by 2027.
Samsung’s 8nm eMRAM shows potential to deliver a 30% increase in density and 33% increase in speed, compared to the 14nm process.
Tackling the Market With Automotive Process Solutions From Cutting-Edge to Legacy
The company announced its advanced process roadmap, highlighting its plans to complete mass production readiness for its 2nm process for automotive applications by 2026.
Samsung Electronics is also bolstering its readiness to serve customer needs by expanding its 8-inch BCD (Bipolar-CMOS-DMOS) process portfolio. The BCD process combines the strengths of three different process technologies: Bipolar (B), CMOS (C), and DMOS (D) on one chip and is most commonly used in the production of power semiconductors.
Samsung Electronics plans to expand its current 130nm automotive BCD process to add 90nm by 2025. The 90nm BCD process is expected to bring a 20% decrease in chip area compared to the 130nm process.
Implementing Deep Trench Isolation (DTI) technology, which reduces the distance between each transistor to maximize the performance of power semiconductors, Samsung Foundry will be able to apply a greater voltage of 120V instead of 70V to a wider range of applications. This will enable readiness to provide a process development kit (PDK) that implements 120V to the 130nm BCD process by 2025.
Leading ‘Beyond-Moore’ Innovation Through Advanced Packaging Alliance
Samsung established a Multi-Die Integration (MDI) Alliance by collaborating with its SAFE partners as well as major players in memory, package substrate, and testing.
As part of an industry-wide partnership with 20 partners, Samsung is leading the development of 2.5D and 3D packaging solutions customized for all applications from automotive to high-performance computing (HPC).
Samsung Electronics hosted the annual Samsung Foundry Forum 2023 in the United States on June 27-28, in South Korea on July 4, and in Japan on October 17. The content from the forum will be available on the Samsung Semiconductor website for worldwide access to all visitors beginning November 2.
Original – Samsung Electronics
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Ardian, a world-leading private investment house, announced that it is expanding into semiconductor investment with the launch of Ardian Semiconductor. This innovative platform will invest across the semiconductor value chain with a focus on Europe and will enable companies to grow into global leaders in their markets.
Semiconductor devices are pervasive in the world economy and are the critical enablers of the digital transformation and green transition of key sectors, such as data infrastructure, mobility, industrial and consumer. Following several decades of consistent mid to high single digit growth, industry analysts believe the semiconductor industry will continue to grow and reach $1 trillion by 2030, driven by predictable megatrends such as artificial intelligence, cloud computing, electrification and automation of mobility and industry, or smart & connected devices.
Europe is one of the most attractive regions to invest in the coming decade. European companies in the value chain are global leaders in semiconductors for the mobility and industrial end-markets that are experiencing rapid technological transformation and expected to grow the fastest.
Europe also leads through its innovation ecosystems, IP, specialized equipment and materials companies, that underpin major megatrends such as the artificial intelligence revolution. Europe leverages strong foundations and attractive government incentives, including the €43 billion European Chips Act, to strengthen its leadership and benefit from an increased regionalization of the global supply chain.
Ardian Semiconductor aims at becoming the partner of choice of the European semiconductor value chain, bringing innovative and flexible capital solutions, as well as strategic and operational expertise, to companies with the potential to enable megatrends leveraging their distinctive technologies.
Ardian is launching the Ardian Semiconductor platform through an exclusive strategic partnership with Silian Partners, a team of highly successful senior executives from the semiconductor industry with more than 115 years of combined experience in the space, bringing unique industry relationships, strategic vision, and operational focus. Ardian and Silian Partners will work as One Team, and will bring together Ardian’s proven and successful private equity capabilities and investment processes with unparalleled industry leadership and expertise.
Ardian Semiconductor is managed by Ardian France. Silian Partners assists Ardian as an industry expert.
Ardian Semiconductor will be powered by a detailed analysis of technology megatrends and their implications across the semiconductor value chain. The team will work together to identify attractive opportunities, carry out expert due diligence, and work closely with entrepreneurs and management teams to define strategic roadmaps and execute.
This expansion builds on Ardian’s track record of investing in attractive high-growth sectors, in addition to its flagship investment activities.
“Semiconductors are everywhere and enable the world’s digital transformation and green transition. As demand for semiconductors is expected to more than double over the next decade, a whole supply chain needs to scale and bring continued innovation, including countless European mid-sized companies. We’re assembling a unique team with tremendous experience and track-record, and I can’t enjoy more than welcoming Paul, Christophe, Helmut and Thomas.
It’s therefore the perfect time to launch Ardian Semiconductor, leveraging Europe’s leading positions in critical segments of the semiconductor value chain. Building on Ardian’s proven track record as a global private investment leader, the platform will bring innovative capital solutions to this strategic value chain at a pivotal moment, working alongside world-class industry leaders.” Thibault Basquin, Member of the Executive Committee, Ardian
“We are delighted to partner with Ardian, who perfectly understand the unique opportunity to address a critical need of the European semiconductor value chain and become its financial sponsor of choice. Through a bespoke strategic partnership, we bring together in One Team seasoned private equity investors, proven investment processes, and successful semiconductor leaders.
Ardian is the ideal firm with the right people and culture to build this first-of-its-kind investment platform together. As we initiate dialogues with companies and entrepreneurs, we have confirmation that we enable solutions for the industry that do not exist today and that our approach will create significant value across the board.” Paul Boudre, Senior Managing Director & Co-Founder of Silian Partners
Silian Partners is led by:
- Paul Boudre, Senior Managing Director & Co-Founder, who brings c.35 years of semiconductor experience. As Chief Executive Officer of Soitec from 2015 to 2022, he successfully led the company through a restructuring and positioned it as a global leader of engineered semiconductor materials. Prior to Soitec, he held senior positions in semiconductor equipment and manufacturing with KLA, STMicroelectronics, IBM Microelectronics, Motorola Semiconductor and Atmel.
- Christophe Duverne, Senior Managing Director & Co-Founder, who has been a semiconductor and electronics executive for the past c.30 years. He was President and Chief Executive Officer of Linxens from 2010 to 2020, which he founded from a corporate carve-out, and led through two successful buyout transactions sponsored by CVC, Astorg and Bain Capital, to create a global leader in smart card components manufacturing. Prior to founding Linxens, he worked for over 10 years at NXP Semiconductors where he was Senior Vice President of the Identification business unit.
- Dr Helmut Gassel, Senior Managing Director & Co-Founder, who contributes c.30 years of semiconductor industry experience. He served as a member of Infineon’s Management Board as Chief Marketing Officer from 2016 to 2022 with responsibilities encompassing marketing, sales, strategy and M&A. In this capacity, he led the €9bn acquisition and integration of Cypress Semiconductor and contributed to transform Infineon into a global top 10 semiconductor company. Prior to joining Infineon in 1995 as a semiconductor design engineer, he worked in semiconductor research at Fraunhofer Institute
- Thomas Pebay-Peyroula, Managing Director & Co-Founder, who brings c.15 years of investment banking experience and has advised many European semiconductor companies on strategic, M&A and financing matters. He is joining from Rothschild & Co, and started his career with Lazard.
Original – Ardian
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DISCO Corporation has made a decision to build a new building at the Haneda R&D Center (Higashi Kojiya, Ota-ku). Construction will begin in April 2025 and is scheduled for completion at the end of March 2027. With the construction of the new building, DISCO aims to further enhance its R&D functions, enabling it to respond to the future needs of the semiconductor and electronic component markets.
The existing buildings, which were acquired in March 2022, were originally designed and built by a previous owner for training flight crews and as a data center. As these buildings have a relatively large amount of floor space with high load-bearing capacity, they were put into use as a development site upon the fitting of utilities such as water supply, drainage, and compressed air.
However, with the recent increase in development, DISCO has decided to construct a new building with an increased amount of floor space suitable for development. This new building will be constructed such that it can be expanded if more floor space for development becomes necessary.
Two of the seven existing buildings will be demolished to make room for the new building. The five remaining buildings will continue to be used with the purpose of R&D, as well as enhancing DISCO’s production system during periods of high demand.
Original – DISCO
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The automotive industry is evolving at a rapid pace, with E-Mobility and Advanced Driver Assistance Systems (ADAS) driving the market’s need for innovative solutions. Microchip Technology announced the expansion of its Detroit Automotive Technology Center in Novi, Michigan. The 24,000-square-foot facility is the destination for automotive clients to explore new technologies and to meet with technical experts to get support for their end applications and designs.
Microchip has been part of the Detroit community since 1999, when it first opened its doors as an application and sales office. With the recent completion of phase three of its expansion project, Microchip has more than doubled its lab space, including the addition of new labs that focus on high-voltage and E-Mobility applications. This larger facility will also bring more technology-related jobs to the region.
“Microchip’s automotive business is a cornerstone of our company’s legacy. We remain focused on developing total system solutions, and this expansion provides our customers with immediate access to state-of-the-art resources,” said Rich Simoncic, executive vice president of Microchip. “In addition to the Detroit location, we have Automotive Technology Centers in Munich, Shanghai, Tokyo and Austin, Texas, to support our global customer base.”
“Microchip’s Automotive Technology Center demonstrates our commitment to the automotive industry by providing a destination for them to develop, test and refine applications in the design phase,” said Matthias Kaestner, corporate vice president of Microchip’s automotive business. “Our vision for the center is to provide our automotive customers with the confidence to choose the right solutions for their designs by helping them to cut design effort and time to market by providing world class technical support locally.”
Located in the heart of the automotive industry, and with top tier OEMs, suppliers and startups operating in the region, Novi is a key location for Microchip’s Detroit Automotive Technology Center and easily accessible to help OEMs with their design challenges.
The key capabilities of the Detroit Automotive Technology Center include:
- Dedicated high-voltage lab for demonstrations of reference designs featuring Microchip’s silicon carbide mSiC™ solutions, dsPIC® Digital Signal Controllers (DSCs) and our wide breadth of analog and mixed-signal solutions
- Support for central compute and zonal networks in ADAS platforms using Microchip’s PCIe® Gen 4 and Gen 5 switching hardware, single-pair Ethernet devices and development tools
- Human Machine Interface (HMI) lab to support the development of full-width cockpit displays; touchscreens; Knob-on-Display™ (KoD™) solutions; and buttons, sliders, and wheels with EMC testing
- USB and networking development resources for pre-certification of multimedia infotainment systems and media hubs for advanced USB Type-C® 3.2 protocol applications
- Die- and product-level characterization of automotive MEMS resonators and oscillators, including vacuum and wafer-scale probe and test, long-term aging, frequency stability, phase noise and jitter test capability
- Development of automotive security solutions using Microchip’s CryptoAutomotive™ TrustAnchor ICs, and onsite security training to learn how to implement secure elements in applications such as secure boot, message and hardware authentication and more
“The new high-voltage lab will help our automotive customers develop systems using our reference design platforms and analog, digital control and power solutions,” said Clayton Pillion, vice president of Microchip’s silicon carbide business unit. “As more OEMs transition to our E-Mobility offerings, we are ready to support them from the design phase to implementation.”
As a leading supplier of embedded solutions to global automotive OEMs, Microchip offers many automotive products that are qualified in accordance with AEC-Q100 requirements. Its automotive-qualified product portfolio includes microcontrollers, DSCs, USB and networking solutions, analog and interface products, SiC MOSFETs, serial EEPROMs and more.
Microchip also offers a broad portfolio of ISO 26262 functional safety ready and functional safety compliant devices that offer the latest hardware safety features and are supported by a comprehensive safety ecosystem to simplify the design and certification of safety-critical automotive applications.
Original – Microchip Technology
