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Mitsubishi Electric Corporation has agreed with Coherent Corp. to invest USD 500 million in a new silicon carbide (SiC) business to be carved out from Coherent, aiming to expand its SiC power device business by strengthening vertical collaboration with Coherent, who has been a supplier of SiC substrates to Mitsubishi Electric.
The electric vehicle market is expanding worldwide and is one of several emerging applications driving the exponential growth of SiC power devices, which offer lower energy loss, higher operating temperatures and faster switching speeds than conventional silicon power devices. The high efficiency of SiC power devices is expected to contribute significantly to global decarbonization and green transformation.
Mitsubishi Electric has been a leader in SiC power modules for high-speed trains, high-voltage industrial applications, and home appliances for many years. The company made history by launching the world’s first SiC power modules for air conditioners in 2010, and became the first supplier of a full SiC power module for Shinkansen high-speed trains in 2015. Mitsubishi Electric has also accumulated extensive expertise by meeting market needs for advanced performance and high reliability by deploying superior processing, screening, etc. for the development and manufacture of SiC power modules.
Mitsubishi Electric has been procuring high-quality 150mm SiC substrates from Coherent for the production of SiC power modules for many years. In addition to developing high-quality 200mm SiC substrates with Coherent, Mitsubishi Electric plans to invest approximately 100 billion yen to construct a new 200mm SiC wafer plant in Kumamoto Prefecture, Japan beginning in 2026.
By further deepening its collaboration with Coherent through this investment, Mitsubishi Electric aims to stabilize its procurement of SiC substrates for SiC power modules, for which demand is forecasted to grow rapidly, and thereby expand its supply of reliable high-performance SiC power devices to meet rising global demand.
Dr. Masayoshi Takemi, Executive Officer, Group President, Semiconductor & Device of Mitsubishi Electric, said: “Demand for SiC power semiconductors is expected to grow exponentially as the global market for electric vehicles increases in line with the transition to a decarbonized world. To capitalize on this trend, we have decided to expand our SiC power semiconductor production capacity, including by constructing a 200mm wafer plant in the Shisui area of Kumamoto Prefecture. We are delighted to strengthen our partnership with Coherent by investing in this new SiC company, which will provide us with a stable supply of high-quality SiC substrates essential for our increased supply capacity.”
Original – Mitsubishi Electric
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DENSO CORPORATION announced a minority investment of US$500 million in Silicon Carbide LLC, Coherent Corp.’s silicon carbide (SiC) business, which will be separated into an independent subsidiary. Silicon Carbide LLC, which was originally established by Coherent in April 2023, manufactures SiC wafers. This investment will ensure a long-term stable procurement of SiC wafers to enhance the competitiveness of our electrification components. With this equity investment, DENSO will hold 12.5% equity stake in Silicon Carbide LLC.
As vehicle electrification accelerates as part of the global effort to reduce CO2 emissions, semiconductor demand has also grown rapidly. SiC is a key material for devices that significantly contribute to reducing power loss, downsizing, and lightweighting of Battery Electric Vehicle (BEV) systems, owing to its superior performance in high-temperature, high-frequency and high-voltage environments compared to that of conventional silicon.
Through this investment in Silicon Carbide LLC, which has an excellent track record in SiC wafer quality and mass production capabilities, DENSO will secure a stable procurement of quality 150mm and 200mm SiC wafers. This will further strengthen the competitiveness of DENSO’s inverters, which drive and control motors of electric vehicles.
“We are very pleased to establish a strategic relationship with Coherent, which has a world-class track record in SiC wafer manufacturing. Through this investment, we will secure a stable procurement of SiC wafers, which are critical for BEVs, and contribute to the realization of a carbon-neutral society by promoting the widespread adoption of BEVs,” said Shinnosuke Hayashi, President & COO, Representative Member of the Board at DENSO.
Dr. Vincent D. Mattera, Jr., Chair and CEO at Coherent, said, “We are excited to expand our strategic relationships with DENSO to capitalize on the significant demand for silicon carbide. After a thorough review of strategic alternatives for our Silicon Carbide business, we determined that the creation of a separate subsidiary and the strategic investments from DENSO, a leader in SiC power devices and modules, is the best path forward to maximize shareholder value and position the Business for long-term growth.
The investments from our strategic partners will be used to accelerate our capacity expansion plans and help sustain our leadership position, while ensuring the development of a robust and scalable supply for the rapidly growing market for SiC-based power electronics, largely driven by the explosive growth of the global electric vehicle market.”
DENSO will continue to contribute to the realization of a carbon-neutral society by promoting the widespread adoption of electrified products in all regions around the world.
Original – DENSO
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Supplier of semiconductor epiwafers, SweGaN, recently began the transformation from start-up to scale-up. AFRY is assisting SweGaN’s scale-up journey with a wide variety of services to build a new state-of-the-art production facility in Linköping. A rapidly growing global sector, semiconductors – are key component within electric vehicles, solar inverters, power supplies and more – all contributing towards a more sustainable society.
AFRY’s cyber security experts are guiding SweGan in securing its IP (Immaterial Properties) and trade secrets and ensuring customer integrity. Additionally, AFRY is providing a bouquet of expert professional services including IT, OT, ERP, CE marking, construction of the new production facility, server room construction, electrical, security, work environment, quality assurance, risk management and project management.
“Initially, we asked AFRY to support and secure our cyber security operations. After understanding AFRY’s wide range of competencies and services, we determined it would be highly favourable to bring all professional services for the new facility under one roof. Partnering with AFRY, we can now focus SweGaN resources on our growth and expansion goals,” says Henrik Tölander, COO SweGaN.
“I am very proud that SweGaN chose us for this project. The client saw the value of one supplier for all their professional service needs. As SweGaN’s full service provider, we can gain a comprehensive, holistic overview of their needs and offer a customer-tailored solution,” says Michael Blom, Section Manager at AFRY.
The opening of the semiconductor production facility will enable Sweden, and in extension Europe, to strengthen the European supply chain and compete against Taiwan, China, the U.S, South Korea and Japan – currently the main providers of semiconductors. Increased access to robust semiconductor offerings in Europe will make it easier to develop and produce electric vehicles, solar inverters, and power supplies in Europe, while also reducing dependency on competing countries.
Original – AFRY
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Key Foundry signed a long-term supply agreement with Vishay Intertechnology Inc. for multiple power MOSFET products.
Power MOSFETs are the typical power discrete device, characterized by low loss, high-speed switching, and high reliability during high-voltage, high-current operation, which are commonly used in almost every electronic device.
According to a market research firm OMDIA, the power discrete market is expected to grow at a CAGR of 6% from $21.2 billion in 2022, reaching a $28.4 billion market in 2027. Vishay is one of the global leading companies in the power discrete market, and its power semiconductors are widely applied to automotive DC-DC converters, battery management systems, HVAC (Heating, Ventilating, and Air Conditioning) control, LED lighting, as well as consumer and industrial products such as TVs, refrigerators, washing machines, and VR/AR.
Key Foundry and Vishay have signed this long-term foundry service agreement for multiple power MOSFET products, with a plan to start mass production in 2024. In addition, both parties have begun discussions for other future product development.
With this agreement, Vishay secures a reliable source of foundry services for MOSFET production, while Key Foundry engages with a large customer for automotive power discrete, which will increase its share of automotive semiconductor sales in the long term.
“With this agreement we are taking another step forward in our plan to expand capacity, both internally and externally. In particular, it will help us alleviate our current MOSFET supply constraints especially for our automotive and industrial customers,” said Joel Smejkal, President and CEO of Vishay. “In evaluating foundry partners, we decided to engage with Key Foundry because of its foundry’s capabilities and proactive response, and we look forward to the synergies we can achieve through cooperation with Key Foundry.”
“We are pleased to collaborate with Vishay, a leading automotive power semiconductor company,” said Derek D. Lee, CEO of Key Foundry. “Key Foundry will continue to improve process technologies as well as strengthen capabilities in marketing, quality, and production to expand supply of automotive semiconductors and grow into a leading specialty foundry.”
Original – Key Foundry
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Revasum, Inc. announced a strategic partnership with SGSS, a global leader in high-performance materials and innovative solutions. This partnership aims to revolutionize the semiconductor industry by developing a cutting-edge line of grinding wheels specifically designed for Silicon Carbide (SiC) wafers.
Silicon Carbide is a critical material in the production of power devices and has gained significant prominence in the semiconductor industry due to its exceptional properties. The demand for SiC wafers has been steadily growing, and achieving the highest quality wafers is paramount to meet the evolving needs of the market.
The partnership between Revasum and SGSS represents a collaboration between two industry giants with a shared commitment to innovation and excellence. By combining Revasum’s expertise in semiconductor manufacturing equipment with SGSS’s cutting-edge abrasive materials, this alliance seeks to develop a new generation of surface finishing solutions that will set new standards for precision, efficiency, and surface quality in SiC wafer production with sustainability and environmental responsibility at the core of our collaboration.
This partnership holds great promise for the semiconductor industry, paving the way for enhanced SiC wafer production processes that will contribute to the advancement of power electronics, electric vehicles, renewable energy, and various other technology sectors.
Mr. Scott Jewler, CEO of Revasum, Inc., commented on the partnership, saying, “We are excited to join forces with Saint-Gobain Surface Solutions, a renowned leader in materials science and innovation. This partnership will enable us to provide our customers with cutting-edge tools and solutions to address the increasing demand for high-quality Silicon Carbide wafers.”
Mr. Jean-Claude Lasserre, CEO Saint-Gobain Surface Solutions stated, “Our collaboration with Revasum exemplifies our commitment to delivering high-performance materials and solutions that push the boundaries of what is possible. Together, we will unlock new levels of precision and efficiency in Silicon Carbide wafer grinding with highest levels of sustainable products and solutions.”
Both Revasum, Inc. and SGSS are eager to embark on this journey of innovation and look forward to delivering groundbreaking solutions that will shape the future of Silicon Carbide wafer manufacturing.
Original – Revasum
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Hon’ble Union Minister of State for Electronics and Information Technology, Shri Rajeev Chandrasekhar, virtually inaugurated the new Surface Mount Semiconductor Packaging Line, at Continental Device India Private Limited’s (CDIL) Mohali plant today. With the new versatile SMA and SMB package line, via the Government of India’s SPECS, CDIL becomes India’s first Silicon Carbide components manufacturer, scaled to make auto-grade devices, including Silicon Carbide MOSFETs, Silicon Carbide Schottky Diodes, Rectifiers, Zeners and TVS Diodes among others for the global as well as the domestic market. The expansion of assembly lines will increase CDIL’s total capacity at the facility to 600 million units annually.
The new line inauguration was also attended by Shri Tejveer Singh, IAS, Principal Secretary, IT, Government of Punjab, and Shri Amitesh Kumar Sinha, IRAS, Joint Secretary, MeitY and other senior dignitaries of MeitY and Invest Punjab.
With the impending surge in electric vehicles (EVs), power management devices and solar-powered panels, globally as well as in India, and their increased reliance on wide band gap electronics, CDIL identified and laid focus on Silicon Carbide (SiC) products.
SiC is an emerging technology that allows for much-improved efficiencies and power-handling capabilities, especially in high-power charging applications and battery management systems. CDIL spent R&D efforts pursuing SiC technology so as to build proficiency and assist in the world’s switch to Electric Vehicles.
Expressing his gratitude, Tejveer Singh, IAS, Principal Secretary, IT, Government of Punjab, said, “I am very very thankful to the CDIL team for this great effort in expanding the plant capacity and assembly line. And as CDIL and SCL sign the MoU, we can finally see Mohali becoming the chip-making hub of India. The Government has a vision to cultivate a dynamic semiconductor ecosystem in Mohali and therefore, the modernization of SCL could provide the sector the much needed impetus to put Mohali on the semiconductor manufacturing map of India.”
Speaking at the launch of the new assembly lines, Amitesh Kumar Sinha, IRAS, Joint Secretary, MeitY, said, “India’s Semiconductor mission is a key focus for both the Union and the State Governments, and there have been many developments in the sector. Yet, India still has much to catch up, with a projected surge in demand to approximately $110 billion by 2030. At MeitY, our objective is to modernise and commercialise SCL with focus on making it a R&D hub for developing the semiconductor ecosystem in the country.
It’s heartening to see CDIL taking the lead in Packaging of discrete semiconductor devices. CDIL has capability for R&D, Design, and Packaging. Earlier, they also had a fabrication facility. I hope CDIL will also consider setting up a discrete fab in the country by availing financial support under the Semicon India programme in future. As CDIL and SCL join hands for knowledge exchange, India can look forward to more indigenous chip manufacturing and packaging for India and the world in the upcoming future.”
CDIL has also established an advanced testing and reliability laboratory at the Mohali plant. The facility, a one-of-a-kind in India, is equipped to meticulously qualify the semiconductor products according to the stringent standards stipulated by the Automotive Electronics Council (AEC), ensuring they meet the rigorous demands of the automotive domain.
Commenting on the same, Prithvideep Singh, General Manager, CDIL said, “In line with our steadfast commitment to innovation and market diversification, CDIL Semiconductors has strategically positioned itself to meet the burgeoning demands of the automotive sector, both within India and on a global scale. Even though SiC devices are notoriously hard to manufacture at scale, we have spent effort and investment to master them. CDIL has been able to innovate on the brittleness and complexity around the production of SiC devices and has earned the resounding approval of large multinational customers in export markets.”
CDIL also signed an MoU with the Semi-Conductor Laboratory (SCL), a research institute in Mohali under MeitY, undertaking research and development in the field of semiconductor technology. Both parties will aim to establish a comprehensive framework wherein SCL’s specialized knowledge and wafer fabrication facilities are utilized to produce indigenized wafers for CDIL’s discrete semiconductor devices, using CDIL’s proprietary manufacturing processes. This collaborative effort is aimed as a significant stride towards advancing India’s semiconductor ambitions in fostering a stronger, self-reliant industry in the region.
Silicon Carbide (SiC) material boasts a significantly wider bandgap compared to traditional semiconductor materials like silicon. A wide bandgap (~3.26 eV for SiC) enables SiC devices to operate at higher temperatures and handle higher breakdown voltages. Consequently, SiC emerges as the optimal choice for the electric vehicle (EV), power management and solar sectors, as it allows semiconductor components to operate reliably in high temperatures, reducing the need for complex cooling systems.
The company has already initiated pilot production in August with 50 million units and promptly delivered its inaugural batch to customers in both the domestic and international markets. CDIL operates manufacturing facilities and a reliability lab in Mohali and Delhi, serving industries with a strong emphasis on the Automotive, Defence, and Aerospace sectors. With 59 years of legacy, a worldwide customer base, with many industry leaders as loyal customers spread throughout the world including China, Brazil, Germany, Hong Kong, Japan, Malaysia, Russia, Singapore, South Africa, South Korea, Turkey, USA and the UK.
Original – CDIL Semiconductors
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Soitec opened its new plant in Bernin, near Grenoble, in the presence of Thierry Breton, European Commissioner for the Internal Market and Roland Lescure, French Minister Delegate for Industry.
Soitec has developed its SmartSiC™ technology as a response to vehicle electrification challenges.
The technology, based on silicon carbide (SiC), sets a new standard with improved efficiency for energy conversion systems. Thanks to its reduced energy losses, better thermal management and improved power density, the material increases the range and performance of electric vehicles.
Through the application of SmartCut™ technology, each SiC substrate can be used 10 times.
As a result, SmartSiC™ enables electric vehicles to achieve ranges above 500 km, compared with an average 350 km for vehicles using silicon IGBT alternatives – while also reducing CO2 emissions during wafer manufacturing by 70% compared to monocrystalline SiC substrates.
Development of the technology began in 2020 in partnership with CEA-Leti and has received financial support from the French state, the region, local authorities and the European Union.
A new production facility in step with Soitec’s ambition
The new plant will have a 2,500 m2 footprint and a final production capacity of 500,000 SmartSiC™ wafers per year.
It will contribute to Soitec’s strategy of sustainable growth towards a threefold expansion of addressable markets by 2030, reinforcing the company’s leadership position in the strategic semiconductor materials market.
The new plant will lead to the creation of 400 direct jobs, while also reinforcing the attractiveness and dynamism of the “French Silicon Valley” ecosystem.
Pierre Barnabé, Chief Executive Officer of Soitec, stated: “More than ever we are ready to establish our SmartSiC™ technology as a new standard in semiconductor materials for coming generations of electric cars. This plant will enable us to meet growing demand for silicon carbide and achieve a 30% market share by 2030, while helping to make electric mobility more efficient and affordable. Completed in record time, it is the embodiment of our industrial performance and our future-facing strategy, based on the expansion of our product and technology portfolio.
This is also an important day for our region, which is once again showing its dynamic and exemplary approach to industrial innovation, with technologies designed, developed, and manufactured within our ecosystem. We will create jobs and continue to showcase French and European knowhow in global semiconductor markets.”
Original – Soitec
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The U.S. Department of Defense (DoD) has awarded GlobalFoundries (GF) a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.
With an initial award of $17.3 million this month and an overall 10-year spending ceiling of $3.1 billion, the new contract provides the DoD and its contractors with access to GF’s semiconductor technologies manufactured at its U.S. facilities. These GF facilities are DoD-accredited to the highest security level, Trusted Supplier Category 1A, which implements proven stringent security measures to protect sensitive information and manufacture chips with the highest levels of integrity to ensure they are uncompromised.
In addition to secure chip manufacturing for DoD systems used on land, air, sea, and in space, the new contract provides the DoD and its contractors with access to GF’s robust design ecosystem, IP libraries, early-access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing. The contract was awarded through the DoD’s Defense Microelectronics Activity (DMEA) Trusted Access Program Office (TAPO).
“GF is proud to begin this new chapter of our decades-long partnership with the U.S government, and to continue serving as the leading supplier of securely manufactured essential chips for the U.S. aerospace and defense industry,” said Mike Cadigan, chief corporate and government affairs officer at GF. “This partnership provides DoD programs with ‘front-door access’ to advanced technologies in a way that is scalable and highly efficient. For this work, GF is accredited to provide the right level of security required for each program, from GF’s industry leading GF Shield protections, to strictly export controlled handling (e.g. ITAR), to the highest level of accredited microelectronics manufacturing security on the planet, Trusted Category 1A.”
This new contract is the third sequential 10-year contract of its kind between the DoD and the Trusted Foundry business team at GF and is the latest milestone in the longstanding partnership between the department and the company.
Original – GlobalFoundries
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CDIL Semiconductors (Continental Device India Pvt. Ltd.), India’s first semiconductor chips and components manufacturer, will be adding new semiconductor packaging lines via the Government of India and MeitY’s SPECS scheme. With the new lines, CDIL aims to increase its annual capacity by 100 million units. The company initiated the first phase of this production with a surface mount packaging line of 50 million devices that will be inaugurated on September 28th, 2023 by Shri Rajeev Chandrasekhar Ji, Hon’ble Union Minister of State for Electronics and Information Technology & Skill Development and Entrepreneurship.
With 59 years of legacy, CDIL today is a semiconductor and electronics service provider to a worldwide customer base across Consumer, Industrial, Defence, Aerospace and Automotive. The company has many industry leaders as long term customers spread throughout the world including USA, UK, Germany, China, Hong Kong, Japan, South Korea, South Africa, and Egypt.
Commenting on the expansion of the product lines, Prithvideep Singh, General Manager, CDIL Semiconductors said, “In line with our steadfast commitment to innovation and market diversification, CDIL Semiconductors has strategically positioned itself to meet the burgeoning demands of the industry especially the power electronics, automotive, and defence sectors, both within India and on a global scale. As we reflect upon this progress, we recognize that this is only the beginning. The groundwork has been established and will stand as a pivotal cornerstone for the company’s future endeavours.”
CDIL has established an advanced high reliability (HiRel) and testing laboratory located at Mohali in addition to its NABL Accredited facility in Delhi. The HiRel laboratory is a crucial part of qualifying CDIL’s devices for stringent sectors like Automotive, Defence, and Aerospace.
Being the 1st Indian semiconductor company to obtain the IS/ISO 9002 and IATF 16949 quality system certifications, CDIL was the first to introduce India to silicon semiconductor technology in 1964. Currently, it produces a comprehensive range of discrete semiconductor devices including Transistors, Diodes, Rectifiers, Schottky Diodes, Thyristors, Voltage Regulators, Transient Voltage Suppressors and MOSFETS, with specialities in power Semiconductors, and high-reliability components.
Original – CDIL Semiconductors
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IQE plc, the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry, announced a strategic collaboration with VisIC Technologies, a global leader in the provision of GaN (Gallium Nitride) power solutions to the automotive sector, to develop the highest reliability gallium nitride D-Mode (D-Mode GaN) power products for use in electric vehicles inverters.
IQE and VisIC Technologies will collaborate to develop 200mm (8”) D-Mode GaN power epiwafers that will be developed at IQE’s UK facilities, leveraging IQE’s well-established expertise in GaN technology.
VisIC Technologies, with its ground-breaking D3GaN technology (Direct Drive D-Mode GaN), brings the future of EV inverters into focus. This technology promises to reduce power consumption, increase reliability and enhance performance in electric vehicles. By combining VisIC Technologies’ innovative Power Electronics solutions with IQE’s epitaxy excellence, this partnership aims to accelerate the adoption of GaN-on-Silicon technology in EVs, significantly contributing to the evolution of sustainable transportation.
The collaboration marks another important milestone in IQE’s strategy of diversification into the high-growth Power market, first announced at its 2022 Capital Markets Day. IQE sees significant opportunities in the GaN Power epiwafer market in particular, which is forecast to reach a $632m value by 2027.
Original – VisIC Technologies
