Event Type Webinars
september
![GaN and Planar Making Automotive µDCDC Converters Slim and Efficient](https://usercontent.one/wp/www.powersemiconductorsweekly.com/wp-content/uploads/2024/09/GaN-and-Planar-Making-Automotive-µDCDC-Converters-Slim-and-Efficient.jpg)
Event Details
Learn about the complexities of high-voltage power electronics in EV charging applications, exploring various charging topologies and the impact of increasing charger voltages. This webinar
Event Details
Learn about the complexities of high-voltage power electronics in EV charging applications, exploring various charging topologies and the impact of increasing charger voltages.
This webinar will describe through example of how to design µDCDC converters for the next generation of electric vehicle architectures. It will cover the basic circuit topology but focus on thermal management, efficiency and optimizing the magnetics design.
In this webinar, you will learn:
- Enabling high power µDCDC solutions.
- Design optimization, focused on thermal management of key power components.
- Optimization of planar magnetics design including fully integrated and hybrid designs.
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Time
(Thursday) 2:00 pm - 3:00 pm(GMT-04:00) View in my time
10sep9:00 am10:00 amGaN Innovations for Next-Level System PerformanceEvent Type Webinars
![GaN Innovations for Next-Level System Performance](https://usercontent.one/wp/www.powersemiconductorsweekly.com/wp-content/uploads/2024/09/GaN-Innovations-for-Next-Level-System-Performance.jpg)
Event Details
Infineon Technologies invites you to explore the broad landscape of its GaN-based CoolGaN™ product offerings, designed to boost the efficiency and performance of your design. Find out why
Event Details
Infineon Technologies invites you to explore the broad landscape of its GaN-based CoolGaN™ product offerings, designed to boost the efficiency and performance of your design. Find out why Infineon stands out as the industry leader in GaN solutions.
They will share the unique value propositions of our CoolGaN™ technology, illustrating how it can be the cornerstone for a multitude of applications ranging from consumer electronics to industrial power systems. By the end of discourse, you will have gained a deeper understanding of how CoolGaN™ can be a crucial component in your next project.
Whether you are at the inception of a new venture or looking to enhance an existing framework, this webinar will provide the insights and direction for success.
Key Takeaways
- Discover the CoolGaN™ portfolio, ranging from powerful transistors to highly integrated solutions
- Examine the benefits of CoolGaN™ technology for various applications
- Understand why Infineon qualifies as preferred supplier of GaN solutions
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Time
(Tuesday) 9:00 am - 10:00 am(GMT-04:00) View in my time
![Efficient And Cost-Effective Power Conversion For Electric Commercial Vehicles](https://usercontent.one/wp/www.powersemiconductorsweekly.com/wp-content/uploads/2024/09/Efficient-And-Cost-Effective-Power-Conversion-For-Electric-Commercial-Vehicles.jpg)
Event Details
Infineon Technologies’ expert, Daniel Makus, Global Application Director OBC and Power Conversion Systems, will speak about the success factors for efficient and yet enduring electrification of commercial vehicles.
Event Details
Infineon Technologies’ expert, Daniel Makus, Global Application Director OBC and Power Conversion Systems, will speak about the success factors for efficient and yet enduring electrification of commercial vehicles. He will discuss how to overcome power conversion challenges.
Demanding operating conditions call for reliability and durability of our components. Learn from concrete examples of DC-DC and charging solutions how Infineon contributes to a more sustainable transportation industry.
Key takeaways
- Development of high-efficiency power electronics systems capable of handling high voltages and currents
- Tackling demanding operating conditions
- Infineon’s DC-DC and charging solutions for eCAVs
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Time
(Wednesday) 8:00 am - 9:00 am(GMT-04:00) View in my time
![SiC for power market from substrate to device, recent results and future progress](https://usercontent.one/wp/www.powersemiconductorsweekly.com/wp-content/uploads/2024/09/SiC-for-power-market-from-substrate-to-device-recent-results-and-future-progress.jpg)
Event Details
SiC has superior efficiency to (Si) IGBT in the high voltage (600-3,300V) space and the high current (several hundred amperes) field that is in the spotlight in relation
Event Details
SiC has superior efficiency to (Si) IGBT in the high voltage (600-3,300V) space and the high current (several hundred amperes) field that is in the spotlight in relation to EVs. SiC MOSFETS issues to be solved for the SiC market expansion are: substrate size, supply and defect density; device on resistance and trade off with short circuit and bipolar degradation; voltage surge and ringing linked to fast switching. In particular, the issues of reducing SiC MOSFET chip cost ($/amp) should be a top priority.
A review of industry challenges and future development will be presented. We will also focus on how SiC substrates will enable to address those challenges through advanced substrates engineering.
Why attend? Attendees will get an overview of device and semiconductor substrate engineering to get the better system cost of ownership.
Who should attend? Device design engineers, material procurement engineers, power module designers, system designers, cost analysis engineers, advanced purchasing.
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Time
(Wednesday) 10:00 am - 11:00 am(GMT+02:00) View in my time
![Innovative Cooling Concepts For Enhanced Power Density In Electrified Vehicles](https://usercontent.one/wp/www.powersemiconductorsweekly.com/wp-content/uploads/2024/09/Innovative-Cooling-Concepts-For-Enhanced-Power-Density-In-Electrified-Vehicles.jpg)
Event Details
Maximizing power density is what designers of power conversion systems in EVs strive for. Component packaging and cooling mechanisms become increasingly important in achieving this goal.
Event Details
Maximizing power density is what designers of power conversion systems in EVs strive for. Component packaging and cooling mechanisms become increasingly important in achieving this goal.
Infineon Technologies and Silicon Austria Labs (SAL) collaborate to push the boundaries by going beyond current design requirements. Together they work on developing new cooling concepts that can improve power density, simplify manufacturing, and reduce system costs.
In this webinar, they will explore the innovative concept of top-side cooling packages and how to use them in your designs. On top, they will provide an exclusive overview of future-forward concepts that are on the horizon.
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Time
(Thursday) 8:00 am - 9:00 am(GMT-04:00) View in my time