Nexperia's Power Rectifier Webinar Series

In the third session of Nexperia’s Power Rectifier Webinar series Nexperia will explain the importance of clip flat power packages in the context of downsizing and PCB design. The right package choice is not only essential when it comes to availability and long-term supply security. The increasing demand for miniaturization leads to more compact board designs and therefore the thermal power dissipation is becoming a real challenge for designers.

Nexperia will help you to understand the concept of the thermal resistance Rth in depth. Furthermore, temperature differences between conventional SMx and CFP Rectifier packages with regard on the downsizing potential and board layout are investigated and compared. In this webinar you will learn how to make the most out of your design with flat power packages.