Join STMicroelectronics for a one-hour webinar to learn how the third generation of silicon-carbide MOSFETs with a new top-side cooling HU3PAK package can take your designs to the next
Event Details
Join STMicroelectronics for a one-hour webinar to learn how the third generation of silicon-carbide MOSFETs with a new top-side cooling HU3PAK package can take your designs to the next level. Designed to be surface mounted with its top side connected to external heat sink, the HU3PAK package optimizes thermal performance and allows the maximum power possible to go through the device for very efficient and more compact systems.
Agenda
Overcoming cooling issues with standard surface-mount packages
Advantages of innovative ST’s 3rd Gen SiC MOSFETs and product roadmap
Measuring efficiency and temperature performance of HU3PAK packages with top-side cooling
Additional design tips and conclusion
Afterwards, there will be a 10-minute Q&A session where STMicroelectronics experts will be available to answer your questions and share insights.
more
Time
(Tuesday) 3:00 pm - 4:00 pm(GMT+01:00)View in my time
