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CISSOID will be exhibiting at APEC 2024 – the IEEE Applied Power Electronics Conference and Exposition. The conference will take place in Long Beach, California from February the 25th to the 29th. You can find CISSOID on the booths of partners Silicon Mobility (booth 452) & NAC Semi (booth 2035).
On this occasion, CISSOID will unveil the latest of their SiC offering. CISSOID will display the Intelligent power module, a complete SiC Inverter Reference Design, and a newly released product.
CISSOID’s latest IPM design offers the best SiC Gate driver technology in a compact form factor. Company’s SiC Inverter Reference Design offers a complete Inverter assembly with DC-link Capacitor, EMI Filter, DC and phase current sensors, active discharge circuit & reference cooling. It is built around CISSOID’s Inverter Control Module which will be released soon.
Inverter Control Module sneak peak, the complete offering will be unveiled on the conference floor.
Original – CISSOID
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Innoscience Technology will demonstrate industry-leadership at the upcoming IEEE Applied Power Electronics Conference and Exposition (APEC) 2024.
At the industrial session, Innoscience will address the exponential demand in power by datacenters due to the processing power necessitated by Artificial Intelligence (AI) applications. The paper will show that with Innoscience’s 650V InnoGaN, it is possible to make a 2kW AC/DC conversion PSU with a high power density and a peak efficiency above 96%, thereby meeting the recent stringent 80 Plus titanium efficiency rating.
Thanks to the absence of a body diode on GaN devices, a simple Totem pole PFC architecture can be implemented while still reaching high levels of efficiency. At the booth Innoscience will also showcase a 4.2kW AC/DC conversion PSU meeting 80 Plus titanium efficiency rating within a power density of 130W/in3.
Moreover, to address the 48V to 12V DC-DC power conversion inside the data center, Innoscience will present an all GaN HEMTs based 1kW 48V-12V unregulated LLC solution that features GaN power devices both at the primary side (100V devices) as well as at the secondary side (40V devices). In order to maximize the power density and simplify the circuit, the solution uses Innoscience’s recent integrated SolidGaN solution (ISG3201), which integrates an half-bridge (made by two 100V/3.2mOhm InnoGaN devices) with its driver, protection etc.. in one package. The final all GaN 1kW 48V-12 converter has a size of only 50mmx30mmx9mm, which is 70% smaller than a Silicon counterpart rated only 600W. The converter achieves a peak efficiency of 98.5%.
Dr. Denis Marcon, General Manager Innoscience Europe, comments: “Reliability is also an important consideration for data centers, because they operate 24/7 and they must guarantee continuity of service. Therefore, in this paper we will also present strong reliability data of Innoscience’s HV and LV GaN power devices, including end-of-life testing for life-time calculation which shows reliability data at the parts-per-billion level.”
Yi Sun, General Manager Innoscience America comments: “Innoscience today has one of the widest portfolio of GaN power device solutions covering 30V to 700V applications, a family of GaN discrete available in standard packages (e.g. QFN, FCQFN, TO252 etc..) as well as integrated GaN IC solutions that include in one chip the GaN FET, the driver, protections etc.”
Visitors to the Innoscience booth at APEC will also see new products, such as the NV100FQ030A, a 100V bidirectional IC that can be employed to deliver high efficiency in applications including battery management systems, high-side load switching in bidirectional converters, and various switching circuits in power systems.
Yi Sun, adds: “Innoscience is leading the GaN industry with many new products that are industry firsts. That is why our devices are finding applications in all markets, from consumer chargers through industrial and communications and into the automotive sector. Join us at booth 1543 to find out more.”
Innoscience presentations:
- IS02.7 – Industry Session / Tuesday Feb 27th ,11:30-11:55am “Ultra-High Frequency (10MHz) Buck Converter with GaN HEMT for Mobile Phone Application” given by Dr Pengju Kong
- IS11.1 – Industry Session / Wednesday Feb 28th, 8:30-8:55am “Efficient and compact power conversions made possible with GaN technology” given by Dr Pengju Kong.
Original – Innoscience Technology
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EPC announced its participation in the premier power electronics conference, APEC 2024. The event, held from February 25 to February 29 in Long Beach, CA, brings together industry experts and thought leaders to explore the latest advancements in power electronics.
At APEC 2024, EPC highlights the industry’s most comprehensive portfolio of GaN-based power conversion solutions. With a focus on efficiency, reliability, and performance, EPC’s gallium nitride-based products offer unparalleled advantages for applications such as DC-DC converters, motor drives, and renewable energy.
Visit EPC at APEC 2024:
- Schedule a Meeting: Learn from GaN Experts and discover strategies to optimize your power systems. To schedule a meeting during APEC 2024 contact info@epc-co.com
- Exhibition Booth # 1045: Visit EPC’s booth to explore comprehensive portfolio of GaN-based solutions.
- Connect with EPC’s team of experts to gain insight into the ‘GaN First Time Right™ Design Process.
- Take the Change My Mind Challenge to see how EPC GaN FETs can be priced lower than equivalent silicon MOSFETs.
- Experience firsthand the superior performance and efficiency of EPC’s GaN products through live demonstrations including robotics, drones, and AI servers.
- Technical Presentations: Attend technical sessions to gain insights into the latest trends and advancements in GaN power conversion technology.
- Ultra-fast switching – the Fastest Power FETs in the Solar System
Industry Session (IS11.5): February 28 at 10:40 a.m.
Speaker: John Glaser, Ph.D. - Experimental Investigation on Transient Operation in Low-Voltage GaN FET Parallel Connection
Industry Session (IS16.4): February 28 at 2:45 p.m.
Speaker: Marco Palma - eGaN Integrated Circuits as a Building Block for Motor Drive Inverters
Industry Session (IS21.1): February 29 at 8:30 a.m.
Speaker: Marco Palma - Using Test-to-Fail Methodology to Accurately Project Lifetime of GaN HEMTs in Common DC-DC Converter Topologies
Industry Session (IS22.5): February 29 at 10:30 a.m.
Speaker: Shengke Zhang, Ph.D. - Emergence of Artificial Intelligence Requires GaN DC-DCs Highest Performance, Efficiency, and Density
Industry Session (IS27.1): February 29 at 1:30 p.m.
Speaker: Andrea Gorgerino
- Ultra-fast switching – the Fastest Power FETs in the Solar System
“At APEC 2024, we are excited to showcase our latest advancements in GaN technology, which empower our customers to achieve greater efficiency and performance in their applications,” said Nick Cataldo, VP of Sales and Marketing at EPC.
Original – Efficient Power Conversion
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Infineon Technologies AG detailed its plans to highlight the industry’s broadest range of power electronic devices during the 2024 Applied Power Electronics Conference (APEC), 25–29 February. Infineon’s wide-bandgap solutions offer the highest efficiency and power density, providing a key element to addressing climate change and accelerating decarbonization efforts. The Infineon best-in-class portfolio includes power devices for leading applications on silicon, silicon carbide (SiC) and gallium nitride (GaN) materials.
Infineon’s exhibits will span two booths, #1013 and #1319 (Infineon + GaN Systems), and feature demonstrations of a broad range of applications. Booth #1013 will be organized in six application zones, including:
- USB-C/Charging. See Infineon’s latest AC/DC and DC/DC USB-C PD chargers, along with system power solutions for next-generation applications such as laptops and notebooks.
- Motor controls. The company’s latest BLDC motor drive solutions for tomorrow’s power tools and robotic applications will be on display. Rad hard reaction wheel motor drives for satellites and space applications will also be demonstrated.
- Data centers. Infineon demonstrations will include a complete artificial intelligence (AI) server solution, a digital power hot-swap solution, and a liquid-cooled high-density power supply optimized for next-generation applications. Also see Infineon’s latest high-density dual-phase power modules that reduce the total cost of ownership in generative AI data centers.
- Electric vehicles (EVs). See Infineon’s latest 50 kW and 22 kW EV chargers, along with SiC- and GaN-based on-board charging solutions, and the company’s latest Hybrid PAK-based inverter for next-generation EVs.
- Renewables & energy storage. Highlighting critical energy applications, this demonstration area will feature the company’s latest solar DC/DC maximizers, along with DC-to-AC inverters, a bi-directional PFC/inverter, and DC-to-DC converters.
- Industrial control. The company’s growing portfolio of solid-state relays and circuit breakers used to replace electromechanical switches will be highlighted.
Infineon’s second booth (#1319) will showcase the company’s expanded portfolio of GaN solutions, such as class D audio amplifiers, data center power supplies, and consumer reference designs. In addition to exhibits in booths #1013 and #1319, Infineon will play a significant role as a contributor to the conference program, participating in more than 30 industry and technical sessions.
Original – Infineon Technologies
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Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops energy-efficient GaN-based power devices that make greener electronics possible, will be present at the upcoming APEC 2024, IEEE Applied Power Electronics Conference and Exposition. In addition to having its largest ever booth at the show, the company will contribute with a number of papers including an analysis of how GaN can play a part in supporting the exponential growth in power demanded by datacentres as the use of Artificial Intelligence (AI) proliferates.
GIORGIA LONGOBARDI | CHIEF EXECUTIVE OFFICER, CGD:
“With datacentres now demanding 100kW per rack and predicting even more in the very near future, power system designers are looking to employ GaN devices in new architectures. At CGD we are addressing this challenge with new devices and reference designs which we will be discussing at APEC, along with many other applications where GaN can play a huge role in enabling sustainable electronics solutions that are more efficient, have high performance and are more compact.”
CGD will present three papers at APEC:
- Tuesday 27th February, 15.00-15.30 – ‘How ICeGaN™ technology can address the datacentre challenges that digitalisation brings’, with Andrea Bricconi, Chief Commercial Officer, CGD and Peter Di Maso, VP of Business Development (Americas) CGD.
- Wednesday 28th February, 09.10-09.30 – ‘Evaluation of GaN HEMT dv/dt Immunity and dv/dt induced false turn-on energy loss’, with Nirmana Perera, Application Engineer, CGD.
- Thursday 29th February, 09:45 – 10:10: ‘Monolithic integration addresses the design challenges of GaN Power devices’, with Di Chen, Director of Business Development & Technical Marketing, CGD.
On booth 1553, CGD will present a range of demos designed to showcase industry’s first easy-to-use and scalable 650 V GaN HEMT family. ICeGaN™ H2 single-chip eMode HEMTs can be driven like a MOSFET, without the need for special gate drivers, complex and lossy driving circuits, negative voltage supply requirements or additional clamping components.
Addressing the increase in power required by server and industrial applications, CGD will show a 350 W PFC/LLC reference design using ICeGaN (650 V, 55 mΩ, H2 series). With a board power density of 23 W/in3, the bridgeless CrM Totem Pole PFC plus half-bridge LLC design has a peak efficiency of 95%, (93% average) and a no-load power consumption of 150 mW.
ANDREA BRICCONI | CHIEF COMMERCIAL OFFICER, CGD:
“GaN is now accepted as a reliable and proven technology that is able to deliver high efficiency and power density simultaneously. Datacentres, with their insatiable need for power, are an obvious application for GaN, but there are many other consumer, industrial and automotive applications where GaN can also demonstrate the ability to be a disruptive technology. CGD has delivered industry’s most easy-to-use GaN technology – ICeGaN – and we are keen to share our ideas with the audience at APEC.”
Original – Cambridge GaN Devices
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Qorvo® will showcase its latest power management innovations at the upcoming Applied Power Electronics Conference (APEC) from Feb. 26-28, at the Long Beach Convention Center in California. Attendees are invited to visit the Qorvo booth #1857 to explore the latest advancements in SPICE simulation, silicon carbide (SiC) and battery management technologies.
Qorvo will feature the following highlights at APEC 2024:
QSPICE™ Simulation Software Showcase
APEC attendees can experience the next level of simulation with Qorvo’s advanced QSPICE tool during three insightful training sessions and engage in a Q&A with the tool’s creator, Mike Engelhardt. For those unable to attend APEC, the sessions will be available on the Qorvo YouTube channel in March.Training Session Schedule:
- Tuesday, Feb. 27, 10-10:20 a.m.: The QSPICE User-Interface
- Tuesday, Feb. 27, 3-3:20 p.m.: Importing 3rd Party Models
- Wednesday, Feb. 28, 10-10:20 a.m.: Anatomy of a Macro Model Done Right
Launch of Inaugural SiC Module Family
Qorvo will unveil its first SiC module family, featuring an innovative cascode JFET architecture. This highly integrated device family simplifies high-voltage designs and offers exceptional thermal and electrical performance due to low switching losses, low thermal resistance and RDS(on) as low as 9.4mΩ.Battery Management Demonstrations
Visitors to the booth can see Qorvo’s wireless battery management debut with a demonstration showcasing a remote battery pack monitoring and state of charge solution, created in combination with Qorvo’s IoT microcontroller.Original – Qorvo
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Navitas Semiconductor invites visitors to experience “Planet Navitas” and collaborate to “Electrify Our World” at APEC 2024 (Long Beach, CA, February 26th-29th, 2024).
Since its inception in 1985, the Applied Power Electronics Conference (APEC) has become the world’s premier event in power electronics, with high-caliber, peer-reviewed technical content from industry and academia. The APEC 2016 keynote by Dan Kinzer, COO / CTO and co-founder, was the public debut for start-up Navitas and GaNFast power ICs.
Following the mission to “Electrify our World™”, the “Planet Navitas” exhibition booth invites visitors to discover how next-gen GaN and SiC technology enable the latest solutions for fully-electrified housing, transportation and industry. Examples range from TV power to home-appliance motors and compressors, EV charging, solar/micro-grid installations, and on to data center power systems. Each example highlights end-user benefits, such as increased portability, longer range, faster charging, and grid-independence, plus a focus on how low-carbon-footprint GaN and SiC technology can save over 6 Gtons/yr CO2 by 2050.
“APEC is a significant event in the power industry calendar, with an intense schedule of customer discussions on new technologies and systems,” said Mr. Kinzer. “Complementary GaNFast™ and GeneSiC™ portfolios, with comprehensive, application-specific system design support accelerates customer time-to-market with sustainable performance advantages. ‘Planet Navitas’ represents the very real, inspiring implementation of GaN & SiC across the vast $22B/year market opportunity.”
Major technology updates and releases include GaNSafe – the world’s most-protected, most-reliable and highest-performance GaN power, Gen-4 GaNSense Half-Bridge ICs – the most integrated GaN devices, Gen-3 Fast SiC power FETs – for high-power performance, and breakthrough bi-directional GaN for game-changing motor drive and energy-storage applications.
APEC 2024 will take place at the Long Beach Convention & Entertainment Center, 300 East Ocean Boulevard, Long Beach, CA 90802, with exhibition running from February 26th – 28th. “Planet Navitas” is featured at booth #1353.
Technical presentations:
- Tuesday 27th February
- “Reducing System Cost with GaN HEMTs in Motor Drive Applications”
- 8:55am, IS05.2, Alfred Hesener, Sr. Dir. Industrial & Consumer
- 10:40am, PSTT02.6, Bin Li, Dir. Applications
- 11:40am, PSTT01.9, Xiucheng Huang, Sr. Director
- 3:45pm, exhibitor presentation, location: 101B
- “Reducing System Cost with GaN HEMTs in Motor Drive Applications”
- Thursday 29th February
- “SiC & Package Innovations in Power Modules”
- 8:30am-11:20am, IS19, Stephen Oliver, Session Chair.
- 8:55am, PSTIS21.2, Tom Ribarich, Sr Dir. Strategic Marketing
- 1:30pm-3:10pm, IS27, Llew-Vaughan-Edmunds, Session Chair
- 2:20pm, IS27-3, Stephen Oliver, VP Corp Mktg & IR, and Llew Vaughan-Edmunds, Sr Dir. GeneSiC
- “SiC & Package Innovations in Power Modules”
Student Job Fair:
- From Los Angeles to Shanghai, careers at Navitas span cutting-edge IC design and innovative applications engineering to pioneering research and ensuring customer success and revenue growth. Meet the experts and join the team!
- Tuesday, February 27, 1:30pm-5pm, Regency Ballroom ABC of the Hyatt Regency hotel, right next to the Long Beach Convention Center, with Shaun Sandera, Sr. Human Resources Manager
To schedule a meeting with the Navitas team, email info@navitassemi.com, or select from the bookings calendars below:
Customer (Private Room): https://bit.ly/navitas-apec-24-customer-private-room
Customer Meeting (On-Booth): https://bit.ly/navitas-apec-24-customer-on-boothOriginal – Navitas Semiconductor
- Tuesday 27th February
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Bourns, Inc. announced it will exhibit its expanding portfolio of advanced high voltage application solutions at the upcoming APEC 2024 Conference. As one of the leading power conversion components suppliers worldwide, Bourns continually develops innovative technology to meet ever-increasing requirements for reliable and safe communication in a growing group of high voltage electric vehicle (EV) and other high energy storage systems.
- Single channel signal transformer with integrated common mode choke
- Only supplier with transformer rated at 1500 VDC
- Industry’s first planar signal BMS transformer
- Continued expansion of WBG evaluation partnership with Wolfspeed
- Emphasizes Bourns’ custom magnetics design capabilities
- Transformative space-saving circuit protection innovations
- Expanded line of intelligent current sensor products
- Highly-efficient silicon carbide (SiC) diode products for increasing power densities
- High power shunt resistors for accurate BMS monitoring
Original – Bourns
- Single channel signal transformer with integrated common mode choke
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SemiQ will be exhibiting its latest portfolio of advanced silicon carbide (SiC) modules at the Applied Power Electronics Conference (APEC) in Long Beach, CA February 25-29, 2024.
Visitors to SemiQ’s booth #2245 will have the first opportunity to explore the latest QSiC™ 1200V SiC modules. These modules are designed to operate reliably in challenging conditions and enable high-performance, high-density implementation while minimizing both dynamic and static losses. Crafted from high-performance ceramics, the modules are available in SOT-227, half-bridge and full-bridge options.
The new QSiC MOSFET modules support a variety of innovative automotive and industrial power applications where efficiency, power density and performance are critical design criteria. These include EV charging, on-board chargers (OBCs), DC-DC converters, E-compressors, fuel cell converters, medical power supplies, energy storage systems, solar and wind energy systems, data center power supplies and UPS/PFC circuits.
“We’re excited to showcase our new family of QSiC™ 1200V MOSFET modules at APEC and look forward to empowering engineers across the renewable energy, automotive, medical, and industrial sectors to build robust systems,” said Dr. Timothy Han, President at SemiQ.
“This family is a testament to SemiQ’s dedication to excellence in semiconductor technology. Our power modules stand out not just for their high performance, but also for the rigorous testing that ensures reliability. All modules have undergone testing exceeding 1350V. From gate burn-in testing to stress tests like HTRB and H3TRB, we prioritize stability and quality.”
Held annually, APEC is a three-day technology event that focuses on the practical and applied aspects of the power electronics business. The conference provides ample opportunities for networking, offering a range of activities from technical and industry sessions to social events and exhibitor presentations. APEC caters to a diverse group of professionals in the field of power electronics, ranging from designers of power supplies, DC-DC converters, and motor drives to equipment OEMs that use power supplies, as well as manufacturers and suppliers.
Additionally, professional education seminars are available for attendees who wish to stay updated on the latest industry trends. These seminars offer in-depth discussions of important and complex power electronics topics that can vary from introductory to advanced in technical level.
Original – SemiQ
