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Infineon Technologies AG announced its joint Innovation Application Center in Shenzhen with Anker Innovations, a global leader in charging technology. With the center already fully operating, it is paving the way for more energy-efficient and CO2-saving charging solutions that support decarbonization.
Driven by the growing consumer demand for faster charging solutions due to an increasing usage of mobile devices, laptops and other battery-powered devices, the idea of establishing an Anker-Infineon Innovation Application Center dated back to 2021. After two years of preparation, the joint lab now serves as R&D hub for industry experts to develop power-delivery (PD) fast charging solutions with higher power density, mainly based on Infineon’s next-generation Hybrid Flyback (HFB) controller product family and the CoolGaN™ IPS for fast chargers above 100W.
Anker has already brought several successful products to the market, such as the industry-leading 100W+ fast charger device powered by Infineon’s CoolGaN in 2022. With the Innovation Application Center Anker and Infineon will even shorten the application cycle and accelerate the time to market for future products.
“Anker is an important customer for Infineon,” said Christian Burrer, Vice President of Systems & Application Marketing of Power & Sensor Systems Division at Infineon Technologies. “We have already started a strong cooperation in the charging field, with product and system solutions covering several Infineon product lines. In the field of PD charging, we provide our customers a comprehensive product portfolio, including state-of-the-art power controllers, first-class switching power supplies, leading silicon MOSFET and GaN transistor performance, and more.”
Beyond charging solutions, the joint lab is focusing on a more diversified range of consumer applications, driven by Infineon’s expertise in wide-bandgap materials such as gallium nitride (GaN). The acquisition of GaN Systems in 2023 has significantly accelerated Infineon’s GaN roadmap and further strengthens its leadership in power systems through mastery of all relevant power semiconductor technologies.
“In 2023, Anker achieved success in many markets such as China and Europe. This would not have been possible without Infineon’s GaN technology solutions and the strong collaboration between our companies. We look forward to even intensifying our partnership with Infineon”, said by Kang Xiong, General Manager of the charging business unit at Anker Technologies.
Original – Infineon Technologies
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Transphorm, Inc. announced availability of two new SuperGaN® devices in a 4-lead TO-247 package (TO-247-4L). The new TP65H035G4YS and TP65H050G4YS FETs offer a 35 mOhm and 50 mOhm on resistance respectively, complete with a kelvin-source terminal that gives customers versatile switching capabilities with even lower energy losses.
The new products will run on Transphorm’s well-established GaN-on-Silicon substrate manufacturing process that is cost-effective, reliable, and well-suited for high volume manufacturing on silicon production lines. The 50 mOhm TP65H050G4YS FET is currently available while the 35mOhm TP65H035G4YS FET is sampling and slated for release in calendar Q1’2024.
Transphorm’s 4-lead SuperGaN devices can serve as an original design-in option or as a drop-in replacement for 4-lead silicon and SiC solutions supporting power supplies at 1 kilowatt and up in a wide range of data center, renewables, and broad industrial applications. As noted, the 4-lead configuration offers flexibility to users for further improved switching performance.
In a hard-switched synchronous boost converter, the 35 mOhm SuperGaN 4-lead FET reduced losses by 15 percent at 50 kilohertz (kHz) and by 27 percent at 100 kHz when compared to a SiC MOSFET device with a comparable on resistance.
Transphorm’s SuperGaN FETs are known for delivering differentiating advantages such as:
- Industry-leading robustness with a +/- 20 V gate threshold and a 4 V noise immunity.
- Easier designability by reducing the amount of circuitry required around the device.
- Easier drivability as FETs can pair with well-known, off-the shelf drivers common to silicon devices.
The TO-247-4L devices offer the same robustness, designability, and drivability with the following core specifications:
Part Number Vds (V) min Rds(on) (mΩ) typ Vth (V) typ Id (25°C) (A) max Package Variation TP65H035G4YS 650 35 3.6 46.5 Source TP65H050G4YS 650 50 4 35 Source “We continue to expand our product portfolio to bring to market GaN FETs that help customers leverage our SuperGaN platform performance advantages in whatever design requirement they may have,” said Philip Zuk, Senior Vice President, Business Development and Marketing, Transphorm.
“The four-lead TO-247 package provides flexibility for designers and customers seeking even greater power system loss reductions with little to no design modifications on silicon or silicon carbide systems. It’s an important addition to our product line as we ramp into higher power applications.”
Original – Transphorm
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Infineon Technologies AG announced its partnership with OMRON Social Solutions Co. Ltd., a pioneering company in social systems technology. Combining Infineon’s first-class gallium nitride (GaN) based power solutions with the innovative circuit topology and control technology of OMRON now enables one of Japan’s smallest and lightest vehicle-to-everything (V2X) charging systems by OMRON Social Solutions.
This partnership will further drive innovation towards wide bandgap materials in power supplies, help to accelerate the transition to renewable energies, a smarter grid, and the adoption of electric vehicles, while fostering decarbonization and digitalization.
For the V2X system, KPEP-A series, Infineon’s CoolGaN™ technology is utilized combined with a unique control technology. OMRON Social Solutions has upgraded its EV charger and discharger system now allowing for bi-directional charging and discharging paths between renewable energy sources, the grid, and EV batteries.
The KPEP-A series is one of the smallest and lightest multi-V2X systems in Japan with a 60% reduction in size and weight compared to similar conventional charger and discharger designs yet providing a charging capability of 6 kW. With the integration of Infineon’s CoolGaN solution, the power efficiency of the V2X systems has increased by more than 10% at light load and around 4% at rated load. By improving efficiency and a reduction in size and weight, the new system allows easier installation and maintenance while enabling more elegant designs and offering a wider range of options for installation locations.
“We are thrilled to partner with OMRON Social Solutions as our CoolGaN based solutions directly contribute to speed up the transition to renewable energies which reduces CO2 emissions and drives decarbonization,” said Adam White, Division President Power & Sensor Systems at Infineon. “It will also make charging of electric vehicles easier and more convenient for consumers, helping to overcome one of the biggest barriers to EV adoption.”
Atsushi Sasawaki, Managing Executive Officer and Senior General Manager for Energy Solutions Business of OMRON Social Solutions said: “Having access to a broad portfolio of WBG solutions significantly increases the functionality, performance and quality of our products. With Infineon, we get the best-in-class application know-how for creating new and improved charging and discharging systems, providing a high level of satisfaction for our customers and end-users. We look forward to further developing GaN- and SiC-based power solutions together with Infineon to help drive renewable energy and electric vehicles.”
Wide bandgap semiconductors made of silicon carbide and gallium nitride differ significantly from conventional semiconductors as they allow for greater power efficiency, smaller size, lighter weight, and lower overall cost. Infineon offers the broadest product and technology portfolio including silicon, silicon carbide and gallium-nitride-based devices.
As the leading power supplier with more than two decades of heritage in SiC and GaN technology development, Infineon caters to the need for smarter, more efficient energy generation, transmission, and consumption.
Original – Infineon Technologies
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Renesas Electronics Corporation and Transphorm, Inc. announced that they have entered into a definitive agreement pursuant to which a subsidiary of Renesas will acquire all outstanding shares of Transphorm’s common stock for $5.10 per share in cash, representing a premium of approximately 35% to Transphorm’s closing price on January 10, 2024, a premium of approximately 56% to the volume weighted average price over the last twelve months and a premium of approximately 78% to the volume weighted average price over the last six months.
The transaction values Transphorm at approximately $339 million. The acquisition will provide Renesas with in-house GaN technology, a key next-generation material for power semiconductors, expanding its reach into fast-growing markets such as EVs, computing (data centers, AI, infrastructure), renewable energy, industrial power conversion and fast chargers/adapters.
Demand for highly efficient power systems is increasing as building blocks for carbon neutrality. To address this trend, an industry-wide transition toward wide bandgap (“WBG”) materials, represented by silicon carbide (“SiC”) and GaN, is also being seen. These advanced materials allow a broader range of voltage and switching frequency than conventional silicon-based devices. To build on this momentum, Renesas has announced the establishment of an in-house SiC production line, supported by a 10 year SiC wafer supply agreement.
Renesas now aims to further expand its WBG portfolio with Transphorm’s expertise in GaN, an emerging material that enables higher switching frequency, lower power losses, and smaller form factors. These benefits empower customers’ systems with greater efficiency, smaller and lighter composition, and lower overall cost.
As such, demand for GaN is predicted to grow by more than 50 percent annually, according to an industry study. Renesas will implement Transphorm’s auto-qualified GaN technology to develop new enhanced power solution offerings, such as X-in-1 powertrain solutions for EVs, along with computing, energy, industrial and consumer applications.
“Transphorm is a company uniquely led by a seasoned team rooted in GaN power and with origins from the University of California at Santa Barbara,” said Hidetoshi Shibata, CEO of Renesas. “The addition of Transphorm’s GaN technology builds on our momentum in IGBT and SiC. It will fuel and expand our power portfolio as a key pillar of growth, offering our customers the full ability to choose their optimal power solutions.”
“Combined with Renesas’ world-wide footprint, breadth of solution offerings and customer relationships, we are excited to pave the way for industry-wide adoption of WBG materials and set the stage for significant growth.
This transaction will also allow us to offer further expanded services to our customers and deliver significant immediate cash value to our stockholders,” said Dr. Primit Parikh, Co-founder, President and CEO of Transphorm and Dr. Umesh Mishra, Co-founder and CTO of Transphorm. “Additionally, it will provide a strong platform for our exceptional team to further Transphorm’s leading GaN technology and products.”
The board of directors of Transphorm has unanimously approved the definitive agreement with respect to the transaction and recommended that Transphorm stockholders adopt such definitive agreement and approve the merger. Concurrently with the execution of the definitive agreement, KKR Phorm Investors L.P., which holds approximately 38.6% of Transphorm’s outstanding common stock, has entered into a customary voting agreement with Renesas to vote in favor of the transaction.
The transaction is expected to close in the second half of calendar year 2024, subject to Transphorm stockholder approval, required regulatory clearances and the satisfaction of other customary closing conditions.
Original – Renesas Electronics
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Navitas Semiconductor announced the appointment of Janet Chou as Executive Vice President, Chief Financial Officer and Treasurer, effective upon the filing of Navitas’ 2023 annual report on Form 10‑K expected at the end of February.
Chou will report to Gene Sheridan, President and CEO, and will replace Ron Shelton, Senior Vice President, CFO and Treasurer, who announced his intention to pursue other opportunities effective March 15, 2024. Following the Form 10-K filing, Shelton will provide advice and assistance to Sheridan and transition assistance and support to Chou.
“Under Ron’s financial leadership, we have executed a significant and successful capital raise, built a strong investor and analyst base, and completed three strategic acquisitions—all while delivering predictable and impressive financial results,” said Sheridan. “While I wish Ron all the best in his next career move, I am also very excited to welcome Janet Chou as our new CFO. I am confident her deep experience in financial leadership at global, multi-$B public semiconductor leaders will be invaluable as we scale Navitas to new levels in coming years.”
Chou was previously Vice President and CFO of Global Operations for Western Digital Corporation, a $12 billion Nasdaq-listed developer, manufacturer, and provider of data storage devices and solutions. She was previously CFO of JCET Group Co., Ltd., a $5 billion global semiconductor company listed on the Shanghai Stock Exchange. Before that Chou progressed through a series of senior financial management roles at NXP Semiconductors N.V., a $13 billion global semiconductor manufacturer, including VP and CFO for Greater China, and VP and CFO of the Portable & Computing Business Unit.
Chou is a certified public accountant and holds a bachelor’s degree in accounting from the University of Texas, San Antonio, and an MBA from Santa Clara University.
Original – Navitas Semiconductor
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EPC introduces three evaluation boards – EPC9179, EPC9181, and EPC9180 – featuring pulse current laser drivers of 75 A, 125 A, and 231 A , showcasing EPC’s AEC-Q101 GaN FETs. These FETs; EPC2252, EPC2204A, and EPC2218A are 30% smaller and more cost-effective than their predecessors. Designed for both long and short-range automotive lidar systems, these boards expedite solution evaluation with varied input and output options.
All boards share identical functionality, differing only in peak current and pulse width. Utilizing a resonant discharge power stage, they employ a ground-referenced GaN FET driven by LMG1020 gate driver. The GaN FET’s ultrafast switching enables rapid discharge of a charged capacitor through the load’s stray inductance, enabling peak discharge currents of tens to hundreds of amps within nanoseconds.
The printed circuit board is designed to minimize power loops and common source inductance while offering mounting flexibility for laser diodes or alternative loads. To enhance user-friendliness, all boards ship with EPC9989 interposer PCBs, featuring various footprints to accommodate a variety of laser diodes or other loads. Customers can choose one that meets their needs to evaluate the GaN solutions.
The EPC9179/81/80 boards are designed to be triggered from 3.3V logic or differential logic signals such as LVDS. For single-ended inputs, the boards can operate with input voltages down to 2.5 V or 1.8 V with a simple modification. Designing an automotive lidar system is complex, and finding a reliable solution is challenging. The purpose of these evaluation boards is to simplify the evaluation of powerful GaN-based lidar drivers that switch faster and deliver higher pulse current than other semiconductor solutions. For technical details, EPC offers full schematics, bill of materials (BOM), PCB layout files, and a quick start guide on EPC’s website.
“To meet the growing demand for automotive lidar, these cost-effective boards, featuring our latest AEC products, streamline evaluation, reducing time-to-market with exceptional switching performance,” said Alex Lidow, CEO, and co-founder of EPC.
Original – EPC
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Teledyne e2v HiRel announced the addition of new space screened versions of its popular 100 V, 90 A and 650 V, 30 A high reliability gallium nitride high electron mobility transistors (GaN HEMTs).
- TDG650E30BSP
- TDG100E90BSP
- TDG100E90TSP
The new parts go through NASA Level 1 or ESA Class 1 screening flow and can be brought up to full Level 1 conformance with extra qualification testing if desired. Typical applications include battery management, dc-dc converters, and space motor drives.
Two new 100 V parts are available with both bottom-side and top-side cooled packaging. One new 650 V 30 A GaN-on-Silicon power transistor is available in a bottom-side cooled package. Each device is available with options for EAR99 or European sourcing.
Teledyne e2v HiRel’s GaN HEMTs feature single wafer lot traceability, extended temperature performance from -55 to +125°C, and low inductance, low thermal resistance packaging.
“Our customers have embraced the previous release of 650 V space screened devices, and we have expanded our portfolio to provide additional options. These GaN HEMT products save customers time and money by providing standard devices without the need for additional screening.” said Mont Taylor, VP of Business Development for Teledyne e2v HiRel. “Our expanded catalog with standard burn-in make it easy for designers to utilize the latest in GaN in their designs.”
Gallium nitride devices have revolutionized power conversion in other industries and are now available in radiation tolerant, plastic encapsulated options that have undergone stringent reliability and electrical testing to help ensure mission critical success. The release of these new GaN HEMTs delivers to customers the efficiency, size, and power-density benefits required in critical aerospace and defense power applications.
Original – Teledyne e2v HiRel
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Aehr Test Systems announced it has received an initial customer order for a FOX-NP™ wafer level test and burn-in system and a FOX WaferPak™ Aligner to be used for gallium nitride (GaN) power devices. The customer is a leading global supplier of semiconductor devices used in electric vehicles and power infrastructure and adds another major customer to the list of companies using Aehr’s FOX products for wafer level test and burn-in of wide bandgap compound semiconductors. The FOX-NP system, including the FOX WaferPak Aligner, is scheduled to ship and be installed in the current fiscal quarter.
As Aehr’s first gallium nitride customer to order a system, this company selected Aehr due in part to its unique ability to offer a total solution that allows customers to apply thermal and electrical stress conditions to thousands of devices while still in wafer form. Aehr’s cutting-edge technology provides critical geolocation information across the wafer while inducing the extrinsic (early life) failures that would otherwise fail in the field without reducing the long-term reliability or life of the good devices.
Gayn Erickson, President and CEO of Aehr Test Systems, commented, “After seeing the positive results from their long and extensive evaluation of our FOX wafer level test systems for their silicon carbide devices, this customer decided to first move forward with our FOX-NP system to test their gallium nitride devices’ long-term reliability failure rates, as well as qualify the production extrinsic failure screening process for their devices in applications where safety, reliability, and/or security are critical.
A key consideration behind their decision is that the FOX-NP system is 100% compatible with the Aehr FOX-XP system that is targeted for high volume production and can support all the test modes needed for both gallium nitride and silicon carbide device testing and burn-in, including high-voltage testing of up to 2,000 volts with full wafer test without electrical arcing that can damage the wafer, which is a distinct advantage of our unique patented technology.
“Similar to silicon carbide, gallium nitride semiconductor MOSFETs are considered wide bandgap devices with much higher efficiencies in terms of power conversion than silicon, with gallium nitride being particularly good for lower power devices such as under 1000 watt power converters used in consumer devices such as cell phones, tablets, and laptop computers, as well as being targeted for automotive power converters for all the electrical systems in automobiles, whether electric vehicles or traditional gasoline automobiles. Gallium nitride MOSFETs are also believed by many industry analysts and technical communities to likely take over silicon as the power converter of choice for photovoltaic (solar panel) applications.
“Gallium nitride and silicon carbide devices both have excellent long-term intrinsic reliability, making them very good for automotive and industrial applications. But both also experience higher than acceptable early life or extrinsic failures related to the material and processing steps. Gallium nitride and silicon carbide semiconductor suppliers can add a special stress or screening test known as burn-in on 100% of the devices to identify and remove these early life failures so that they can meet the end customers’ target reliability needs. This 100% burn-in requirement is not unique to these devices, as it is also the case with microprocessors and microcontrollers, dynamic random-access memories (DRAM), flash non-volatile memories, as well as many sensors used in automotive and other industrial applications.”
Aehr enables its customers to cost-effectively implement the needed testing and qualification process for semiconductor devices that experience early life failures by not only applying the electrical stress condition to every device on the wafer but by also testing up to 18 wafers at a time using the FOX-XP production test and burn in system. These electrical tests are done with up to thousands of precise calibrated electrical source and measurement instruments per wafer. These tests are done while maintaining the temperature at an accurately programmed thermal temperature across each of the wafers using a direct conduction thermal transfer via a proprietary patented precision thermal chuck per wafer.
The FOX-NP compliments Aehr’s production FOX-XP system by using the exact same test ‘Blades’ that are in the FOX-XP to allow 100% correlation between the results on the FOX-NP to the FOX-XP.
The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
Original – Aehr Test Systems
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Nexperia announced that its GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications.
Building on two decades of expertise in supplying high-volume, high-quality copper-clip SMD packaging, Nexperia is now proud to extend its revolutionary packaging approach to GaN cascode switches in CCPAK. The GAN039-650NTB, a 33 mΩ (typ.) Gallium Nitride (GaN) FET within the CCPAK1212i top-side cooling package, ushers in a new era of wide bandgap semiconductors and copper-clip packaging.
This technology offers advantages for renewable energy applications such as solar and residential heat pumps, further enhancing Nexperia’s commitment to developing the latest component technology for sustainable applications. It is also suited to a wide spectrum of industrial applications such as servo drives, switched-mode power supplies (SMPS), server, and telecom.
Nexperia’s CCPAK surface mount packaging uses Nexperia’s proven innovative copper-clip package technology to replace internal bond wires. This reduces parasitic losses, optimizes electrical and thermal performance, and improves device reliability. For maximum flexibility in designs, these CCPAK GaN FETs are available in top- or bottom-cooled configurations to further improve heat dissipation.
The cascode configuration of the GAN039-650NTB enables it to deliver superior switching and on-state performance, with a robust gate offering high margins against noise. This feature also simplifies application designs by eliminating the requirement for complex gate drivers and control circuitry, instead allowing them to be conveniently driven using standard silicon MOSFET drivers.
Nexperia’s GaN technology improves switching stability and helps to shrink die size by approximately 24%. In addition, device RDS(on) is reduced to only 33 mΩ (typ.) at 25°C, with a high threshold voltage and low diode forward voltage.
“Nexperia recognizes that designers of industrial and renewable energy equipment need a highly robust switching solution that can provide excellent thermal efficiency when performing power conversion.”, according to Carlos Castro, Vice President and General Manager of the GaN FET business at Nexperia. “This is why Nexperia decided to bring together the exceptional switching performance of its cascode GaN FETs with the exceptional thermal properties of its CCPAK packaging to offer customers a compelling solution.”
Nexperia begins its CCPAK portfolio release with the top-cooled 33 mΩ (typ.), 650 V GAN039-650NTB, and will follow shortly with the bottom-cooled variant, GAN039-650NBB of the same RDS(on). More information including datasheets and samples is available at www.nexperia.com/ccpak.
Original – Nexperia
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Navitas Semiconductor announced that NIO, a global, leading, new-energy vehicle maker has released its inaugural smartphone, the NIO Phone with a powerful 66 W fast charger featuring Navitas’ next-generation gallium-nitride (GaN) GaNFast™ power ICs equipped with GaNSense™ technology. This enhancement delivers flagship-level charging efficiency, providing end users with a better vehicle-centric mobile interconnection experience. New GaNFast ICs are replacing legacy silicon chips to enable next-gen fast-charging for mobile phones, tablets and laptops.
The flagship NIO Phone features the leading Qualcomm Snapdragon 8 Gen 2 chip, and boasts a 6.81-inch 2K variable refresh-rate curved screen, with the main, ultra-wide-angle, and 50 M pixel periscope telephoto cameras. Using NIO Link panoramic-interconnection technology, the NIO Phone integrates smoothly and seamlessly with smart EVs and NIO’s in-car system. With a single click, the driver can control over 30 functions, and equipped with ultra-wideband technology, it can completely replace traditional car keys.
To support such powerful and comprehensive features, the NIO Phone is equipped with a large 5,200 mAh battery and an in-box GaNFast charger offering up to 66 W of charging power. Measuring only 57 x 57 x 30 mm (97.5 cc), the NV6136 GaNFast power IC in a high-frequency quasi-resonant (HFQR) topology with loss-less current sensing and ultra-fast autonomous short-circuit protection, delivers power density of 1.03 W/cc.
Mr. Zhang Baozhou who is responsible for NIO’s mobile phone supply chain, stated, “NIO is dedicated to providing users with high-performance smart electric vehicles and ultimate user experience, creating a delightful lifestyle for our users.
The NIO Phone fulfills the expectations and needs of NIO users for a flagship smartphone, making their cars more intuitive and user-friendly. In launching NIO Phone, we are very pleased to collaborate with Navitas Semiconductor, industry leader in GaN to utilize the mature, cutting-edge GaNFast power ICs, allowing our users to experience a comprehensive, lightweight, and efficient charging experience.”
Mr. Wu Gongli, GM of R&D for TenPao, the manufacturing partner for the NIO Phone commented, “We are excited to work with Navitas to build this leading GaN charger for NIO users, marking an important milestone in TenPao’s development. Navitas’ GaNFast ICs deliver top power-density performance with easy-to-use features. The combination of high efficiency and fast design accelerates our time-to-market.”
Mr. Yingjie (Charles) Zha, VP and GM of Navitas China, stated, “Navitas is extremely honored to collaborate with TenPao to make the NIO Phone possible by integrating the leading GaNFast technology into the NIO Phone. Navitas’ mission to ‘Electrify Our World™’ aligns closely with NIO’s objective of ‘Blue Sky Coming’. This is just the beginning of our collaboration. In the future, Navitas will spare no effort to deeply-integrate energy-saving, sustainable, world-leading GaN and SiC technology into NIO Phone’s DNA, creating a comprehensive lifestyle revolution from a smartphone to EVs.”
Original – Navitas Semiconductor
